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21. 发明专利

JPH09157802A COMPOSITE MAGNETIC MEMBER AND PRODUCTION THEREOF 失效
公开(公告)号：JPH09157802A
公开(公告)日：1997-06-17
申请号：JP31888795
申请日：1995-12-07
申请人： HITACHI METALS LTD , DENSO CORP
发明人： INUI TSUTOMU , SUNAKAWA ATSUSHI , TAKEUCHI KEIZO , SHIMIZU MAKI , SUGIURA SHINYA
IPC分类号： C21D6/00 , C21D9/00 , C22C38/00 , C22C38/18 , C22C38/40 , H01F1/03
摘要： PROBLEM TO BE SOLVED: To produce a composite magnetic member provided with a ferromagnetic part and low magnetism by subjecting a martensitic stainless steel with a ferromagnetic structure composed of ferrite and carbides to partial heating and cooling at a specified temp. SOLUTION: A martensitic stainless steel having a compsn. contg., by weight, 35 to 75%C, 10.0 to 14.0% Cr, 0.5 to 4.0% Ni, 0.01 to 0.05% N and one or more kinds among Si, Mn and Al as a deoxidizer by 200 maximum permeability and

23. 发明专利

JPH02194168A TARGET MEMBER 失效
公开(公告)号：JPH02194168A
公开(公告)日：1990-07-31
申请号：JP1112089
申请日：1989-01-20
申请人： HITACHI METALS LTD
发明人： INUI TSUTOMU
IPC分类号： C23C14/34
摘要： PURPOSE:To provide a target member for sputtering capable of forming a film not causing pitting corrosion even at high temp. and humidity and hardly undergoing a change in the magnetism by adding Nb to a Co-Cr alloy and specifying the compsn. CONSTITUTION:This target member consists of 10-20atomic% Cr, 0.1-7atomic% Nb and the balance Co. When this target member is used to form a Co-based magnetic film for magnetic recording by sputtering, a film having satisfactory corrosion resistance even at high temp. and humidity, e.g., at 65 deg.C temp. and 95% humidity and hardly undergoing a change in the magnetism with the lapse of time is obtd. W and/or Ru may be added in combination with Nb. In the case of 7% Nb, saturation magnetization is reduced and the resulting film is not fit for practical use.

25. 发明专利

JPH01242733A MANUFACTURE OF ALLOY POWDER FOR RARE EARTH METAL-TRANSITION METAL TARGET AND MANUFACTURE OF RARE EARTH METAL-TRANSITION METAL TARGET 失效
公开(公告)号：JPH01242733A
公开(公告)日：1989-09-27
申请号：JP6883088
申请日：1988-03-23
申请人： HITACHI METALS LTD
发明人： MATSUMOTO SHUNICHIRO , INUI TSUTOMU , KAZUYASU MUTSUO
IPC分类号： B22F9/08 , C22C1/04 , C22C33/02 , C23C14/34
摘要： PURPOSE:To reduce the oxygen content in a target or the like in the manufacture of subjecting the mixture of rapidly solidified alloy powder and rare earth metal to pressure sintering under a nonoxidizing atmosphere in the specific temp. by specifying the oxygen content in the above alloy material. CONSTITUTION:The mixture of each alloy powder constituted of rare earth metal and transition metal in the compositional range where eutectic structure is revealed and subjected to rapid solidifying treatment and transition metal powder less than the objective compsn. of the target is prepd. The mixture is subjected to pressure sintering in a vacuum or under the atmosphere of an inert gas in the temp. range less than the liquid-phase revealing temp. of the mixture. In the manufacture of the rare earth metal-transition metal target, the oxygen content of the molten material in the alloy to be subjected to rapid solidifying treatment is regulated to

28. 发明专利

JPS63121662A TARGET FOR SPUTTERING 失效
公开(公告)号：JPS63121662A
公开(公告)日：1988-05-25
申请号：JP25872487
申请日：1987-10-14
申请人： HITACHI METALS LTD
发明人： MATSUMOTO SHUNICHIRO , INUI TSUTOMU , MIZUGUCHI TAKEO
IPC分类号： C23C14/34
摘要： PURPOSE:To stably form a good-quality sputtered film on a substrate to be treated by joining a target for sputtering to a Cu block for cooling by using a metallized layer and brazing filler metal layer from the target side at the time of joining said target and block. CONSTITUTION:The target to be used in a sputtering device rises to a high temp. during use and, therefore, the target material 1 is joined to the block 4 for cooling consisting of metal such as Cu having high heat conductivity. The metallized layer 2 is formed to 0.1-30mum thickness by an ion plating, sputtering or wet plating method on the joint surface of the target material 1. Spare solder is formed on the surface thereof and the surface of the Cu block 4 for cooling, respectively and thereafter, the two spare solder surfaces are contacted with each other and are joined by heating to form the brazing filler metal layer 3, by which the target material 1 and the block 4 are securely joined. The cooling effect of the target 1 is thereby improved and the exfoliation of the target material 1 from the block 4 is prevented. The good-quality sputtered film is thus formed on the material to be treated.

29. 发明专利

JPS6289863A TARGET MEMBER 失效
公开(公告)号：JPS6289863A
公开(公告)日：1987-04-24
申请号：JP23076485
申请日：1985-10-16
申请人： HITACHI METALS LTD
发明人： INUI TSUTOMU , MATSUMOTO SHUNICHIRO , MIZUGUCHI TAKEO
IPC分类号： C22C19/03 , C23C14/34 , H01F41/18
摘要： PURPOSE:To make a film formed by sputtering uniform and to reduce the coercive force of the film by manufacturing an alloy contg. prescribed percentages of Ni, Mo, Fe, etc., and by regulating the grain size of a face of the alloy to be sputtered to a prescribed value. CONSTITUTION:An alloy steel consisting of, by weight, 70-85% Ni, 2-6% Mo and the balance Fe or further contg. one or more among 0.01-2% Si, 0.1-2% Mn and 0.0001-0.02% Mg is manufactured by melting. An ingot of the alloy steel is hot or cold worked and annealed to regulate the grain size of a face to be sputtered to JIS austenite grain size No.3 or below.

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