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    • 23. 发明授权
    • Method for forming a capacitor in a mixed mode circuit device by ion implantation
    • 通过离子注入在混合模式电路器件中形成电容器的方法
    • US06444519B1
    • 2002-09-03
    • US10120286
    • 2002-04-09
    • Chien-Hung LiuShou-Wei HuangShyi-Shuh Pan
    • Chien-Hung LiuShou-Wei HuangShyi-Shuh Pan
    • H01L218242
    • H01L28/40H01L21/26533H01L21/32105
    • The invention provides a method for forming a capacitor in a mixed mode circuit device through ion implantation. The method includes forming a polysilicon layer over a substrate, which substrate has isolation region formed thereon. An ion implantation process is performed to implant oxygen ions into the polysilicon layer. An annealing process is performed to trigger an reaction between the oxygen ions and the silicon ions. As a result, a silicon oxide layer is formed within the polysilicon layer. The silicon layer and the polysilicon layer are patterned, where the top portion of the polysilicon layer above the silicon oxide layer serves as an upper electrode of a capacitor. The polysilicon layer below the silicon oxide layer serves as the lower electrode.
    • 本发明提供了一种通过离子注入在混合模式电路器件中形成电容器的方法。 该方法包括在衬底上形成多晶硅层,该衬底上形成有隔离区。 执行离子注入工艺以将氧离子注入到多晶硅层中。 执行退火处理以触发氧离子和硅离子之间的反应。 结果,在多晶硅层内形成氧化硅层。 图案化硅层和多晶硅层,其中氧化硅层上方的多晶硅层的顶部用作电容器的上电极。 氧化硅层下面的多晶硅层用作下电极。