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21. 发明申请

US20070065647A1 Hot pressing ceramic distortion control 失效
标题翻译：热压陶瓷失真控制
公开(公告)号：US20070065647A1
公开(公告)日：2007-03-22
申请号：US10595550
申请日：2003-12-05
申请人： Govindarajan Natarajan , Raschid Bezama
发明人： Govindarajan Natarajan , Raschid Bezama
IPC分类号： B32B18/00 , C03B29/00
CPC分类号： B32B18/00 , C04B35/645 , C04B2237/32 , C04B2237/343 , C04B2237/366 , C04B2237/561 , C04B2237/562 , C04B2237/565 , C04B2237/567 , C04B2237/62 , C04B2237/64 , C04B2237/66 , C04B2237/702 , H01L21/4857 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/09781 , Y10T156/108 , Y10T428/24926
摘要： A method to control the post sinter distortion of hot pressing sintered multilayer ceramic laminate by placing a non-densifying structure in the green ceramic laminate prior to sintering. One or more non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the non-densifying structure will control the dimensions of the hot pressed multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the non-densifying structure in the kerf area between the individual product ups prior to sintering.
摘要翻译：一种通过在烧结之前在生坯陶瓷层压板中放置非致密化结构来控制热压烧结多层陶瓷层压体的烧结后变形的方法。将一个或多个非致密结构放置在一个或多个陶瓷刮板上，然后将其堆叠并层压以形成生坯陶瓷层压板。然后将层压体烧结，并且非致密化结构将控制热压多层陶瓷基板的尺寸。该方法可用于控制通过在烧结之前将非致密化结构放置在各个产品之间的切口区域中，将MLC衬底中的烧结后尺寸制作为单层或多层衬底。

22. 发明申请

US20050287044A1 TEST APPARATUS AND METHOD 审中-公开
标题翻译：测试装置和方法
公开(公告)号：US20050287044A1
公开(公告)日：2005-12-29
申请号：US10710183
申请日：2004-06-24
申请人： Govindarajan Natarajan
发明人： Govindarajan Natarajan
IPC分类号： B01L3/00
CPC分类号： B01L3/50273 , B01L3/5025 , B01L3/502707 , B01L2400/0406 , B01L2400/0688
摘要： An apparatus and method is described for testing interactions between multiple reagents or components by means of a flow distribution body configured to have a three-dimensional network of conduits including feed holes for dispensing fluid, connected to a capillary channel bounded on at least one surface by a receiving surface, which in turn is connected to capillary flow promotion chimneys. The receiving surface may be a surface of a detachable receiving plate. Each feed hole is configured to terminate at a capillary flow control means at the intersection of the capillary channel to the feed hole. A uniform layer of reagent is formed or deposited on the receiving surface along the capillary channel. The feed hole, capillary channel and capillary flow promotion chimneys are configured so that when fluid is dispensed into the feed hole, capillary forces promote continuous flow of fluid along the capillary channel from the feed hole to the flow promotion chimneys until the trailing meniscus of the fluid in the feed hole stops at the capillary flow control means.
摘要翻译：描述了一种用于测试多个试剂或组分之间的相互作用的装置和方法，所述流动分布主体被配置成具有三维网络的导管，所述导管的三维网络包括用于分配流体的进料孔，其连接到通过限定在至少一个表面上的毛细管通道接收表面又连接到毛细管流动促进烟囱。接收表面可以是可拆卸接收板的表面。每个进料孔构造成在毛细管通道与进料孔交叉处的毛细管流动控制装置处终止。沿着毛细通道在接收表面上形成或沉积均匀的试剂层。进料孔，毛细管通道和毛细管流动促进烟囱被构造成使得当流体被分配到进料孔中时，毛细管力促使流体沿着毛细管通道从进料孔到流动促进烟囱的连续流动，直到尾部弯液面进料孔中的流体在毛细管流动控制装置处停止。

23. 发明授权

US06726984B2 Ceramic structure using a support sheet 有权
标题翻译：陶瓷结构使用支撑片
公开(公告)号：US06726984B2
公开(公告)日：2004-04-27
申请号：US10403239
申请日：2003-03-28
申请人： Govindarajan Natarajan , John U. Knickerbocker , Robert W. Pasco
发明人： Govindarajan Natarajan , John U. Knickerbocker , Robert W. Pasco
IPC分类号： B32B300
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2201/09581 , H05K2203/0152 , H05K2203/0156 , Y10T29/49126 , Y10T156/1057 , Y10T428/24917 , Y10T428/24926
摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.
摘要翻译：本发明一般涉及一种新的陶瓷结构及其工艺。基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法更强的支撑板。本发明的结构和方法能够在多层陶瓷封装的制造中筛选，堆叠和处理非常薄的生片和/或具有非常密集金属化图案的生片。薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。

24. 发明授权

US06395337B1 Substrate with ceramic coating for camber modification and method for making 失效
标题翻译：具有陶瓷涂层的基体用于外观修改和制造方法
公开(公告)号：US06395337B1
公开(公告)日：2002-05-28
申请号：US09364845
申请日：1999-07-30
申请人： Raschid J. Bezama , Govindarajan Natarajan , Robert W. Pasco
发明人： Raschid J. Bezama , Govindarajan Natarajan , Robert W. Pasco
IPC分类号： B05D302
CPC分类号： B32B18/00 , C04B35/10 , C04B35/581 , C04B41/009 , C04B41/5022 , C04B41/86 , C04B2111/00844 , C04B2237/064 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/564 , H01L21/481 , H05K1/0306 , H05K3/4629 , C04B41/4539 , C04B41/4578
摘要： A multilayer ceramic substrate contains a ceramic coating which is different in composition than the main body of the multilayer ceramic substrate to control camber of the multilayer ceramic substrate during sintering. The primary component of the ceramic coating is a secondary component of the main body of the multilayer ceramic substrate.
摘要翻译：多层陶瓷基板包含与多层陶瓷基板的主体不同的陶瓷涂层，以在烧结期间控制多层陶瓷基板的弯度。陶瓷涂层的主要成分是多层陶瓷基体的主体的次要成分。

25. 发明授权

US06284079B1 Method and structure to reduce low force pin pull failures in ceramic substrates 失效
标题翻译：降低陶瓷衬底中低引脚拉拔故障的方法和结构
公开(公告)号：US06284079B1
公开(公告)日：2001-09-04
申请号：US09261344
申请日：1999-03-03
申请人： Raschid J. Bezama , Govindarajan Natarajan
发明人： Raschid J. Bezama , Govindarajan Natarajan
IPC分类号： B32B3126
CPC分类号： H05K3/381 , H01L21/481 , H01L21/4853 , H05K1/0306 , H05K3/4629 , Y10T156/1023 , Y10T428/24917 , Y10T428/24926
摘要： The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.
摘要翻译：可以在处理期间控制生片的表面冶金，以在输入 - 输出焊盘结构下提供对金属 - 陶瓷界面的低强度结构故障的增加的阻力，并且增加氧化铝多层陶瓷上的输入 - 输出焊盘的引脚强度底物。为了增加生片与输入输出垫之间的接触面积，粗筛在要输出输出垫的区域中的生片上的表面积变粗糙。金属 - 陶瓷界面之间的机械互锁通过生片和投入产出冶金之间的粘合点数量的增加以及使用不同的筛选材料得到加强。

26. 发明授权

US06261927B1 Method of forming defect-free ceramic structures using thermally depolymerizable surface layer 失效
标题翻译：使用可热解聚表面层形成无缺陷陶瓷结构的方法
公开(公告)号：US06261927B1
公开(公告)日：2001-07-17
申请号：US09302943
申请日：1999-04-30
申请人： Govindarajan Natarajan , Richard F. Indyk , Vincent P. Peterson , Krishna G. Sachdev
发明人： Govindarajan Natarajan , Richard F. Indyk , Vincent P. Peterson , Krishna G. Sachdev
IPC分类号： H01L2130
CPC分类号： H01L21/481 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y10S438/976 , H01L2924/00
摘要： This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.
摘要翻译：本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。特别地，本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。更具体地说，本发明包括一种制造半导体衬底的方法，其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。本发明还包括用于制造表面保护的生片层压板的方法，其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。在层压之后，由于在烧结过程中挥发物质的热解聚和燃烧，因此可方便且清洁地除去热可分解/可分解的膜，从而提供无表面缺陷的陶瓷基材。

27. 发明授权

US06254925B1 Source metal embedded in an inert material and process thereof 失效
标题翻译：嵌入在惰性材料中的源极金属及其工艺
公开(公告)号：US06254925B1
公开(公告)日：2001-07-03
申请号：US09123928
申请日：1998-07-28
申请人： Govindarajan Natarajan , John U. Knickerbocker , Robert A. Rita
发明人： Govindarajan Natarajan , John U. Knickerbocker , Robert A. Rita
IPC分类号： C23C1606
CPC分类号： C23C16/08
摘要： The present invention discloses at least one source metal that is embedded in at least one inert material to form a stand-alone structure and process thereof. It is preferred that the source metal is nickel or alloy thereof, and the inert material is at least one ceramic.
摘要翻译：本发明公开了至少一种源金属，其嵌入在至少一种惰性材料中以形成独立结构及其工艺。源金属优选为镍或其合金，惰性材料为至少一种陶瓷。

28. 发明授权

US5759320A Method of forming cavity substrates using compressive pads 失效
标题翻译：使用压缩垫形成空腔基板的方法
公开(公告)号：US5759320A
公开(公告)日：1998-06-02
申请号：US834302
申请日：1997-04-13
申请人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
发明人： Govindarajan Natarajan , Robert W. Pasco , Charles H. Perry , Vincent P. Peterson
IPC分类号： H01L21/48 , B32B31/20
CPC分类号： B32B37/26 , B32B37/0023 , H01L21/4807 , Y10T156/10
摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
摘要翻译：本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。更具体地说，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将固化的厚的可压缩弹性垫放置在空腔上方并使其符合空腔的轮廓，从而防止破坏或损坏到层压过程中的腔架或角落。在层压处理之后，固化的厚的可压缩弹性垫可以方便地从空腔区域移除，而不会对腔架或角落造成任何损坏或具有任何糊状物抽出。该垫可以重复使用多次以形成这些MLC空腔衬底。

29. 发明授权

US5707480A Apparatus for forming multiple cavity products 失效
标题翻译：用于形成多个腔体产品的装置
公开(公告)号：US5707480A
公开(公告)日：1998-01-13
申请号：US530500
申请日：1995-09-19
申请人： Raschid Jose Bezama , John Ulrich Knickerbocker , Govindarajan Natarajan , Joseph Gang Zhou
发明人： Raschid Jose Bezama , John Ulrich Knickerbocker , Govindarajan Natarajan , Joseph Gang Zhou
IPC分类号： H01L21/48 , B32B31/04 , B32B31/20
CPC分类号： H01L21/486 , B32B37/0023 , B32B37/26 , H01L21/4857 , B32B2315/02
摘要： The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.
摘要翻译：本发明一般涉及用于同时层压具有至少一个空腔的多个基板的新装置和方法。更具体地说，本发明涵盖用于在MLC（多层陶瓷）中制造空腔的装置和方法。具有或不具有开口的膜被放置在具有至少一个空腔的未层压生片的顶表面上，然后施加标准压力以层压生片，同时在空腔中施加反压力以防止空腔变形或塌陷。这样做同时形成多个空腔基板。

30. 发明授权

US5613181A Co-sintered surface metallization for pin-join, wire-bond and chip attach 失效
公开(公告)号：US5613181A
公开(公告)日：1997-03-18
申请号：US360526
申请日：1994-12-21
申请人： Govindarajan Natarajan , Srinivasa S. N. Reddy
发明人： Govindarajan Natarajan , Srinivasa S. N. Reddy
IPC分类号： C03C17/36 , C04B41/52 , C04B41/89 , C23C26/00 , H01L21/48 , H01L23/373 , B22F7/02 , B22F7/04
CPC分类号： C03C17/3607 , C03C17/36 , C03C17/3649 , C04B41/009 , C04B41/52 , C04B41/89 , C23C26/00 , H01L21/4846 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L23/3731 , C03C2217/40 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , Y10T428/12 , Y10T428/12007 , Y10T428/12167
摘要： A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.

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