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    • 21. 发明申请
    • Nonvolatile memory device and method thereof
    • 非易失性存储器件及其方法
    • US20070177427A1
    • 2007-08-02
    • US11698071
    • 2007-01-26
    • Geon-Woo ParkGeum-Jong BaeIn-Wook ChoByoung-Jin LeeMyung-Yoon UmSang-Chul Lee
    • Geon-Woo ParkGeum-Jong BaeIn-Wook ChoByoung-Jin LeeMyung-Yoon UmSang-Chul Lee
    • G11C16/04
    • G11C16/0425G11C16/04G11C16/0466G11C16/12G11C16/3418G11C16/3427G11C29/50G11C29/50004G11C2029/5002
    • A nonvolatile memory device and method thereof are provided. The example method may include applying a first bias voltage to a gate electrode, applying a second bias voltage to a substrate to obtain a first voltage potential difference between the gate electrode and the substrate and applying a third bias voltage to a first impurity region to obtain a second voltage potential difference between the substrate and the first impurity region, the first and third bias voltages being positive and the second bias voltage being negative. The example nonvolatile memory device may include a gate electrode receiving a first bias voltage, a substrate receiving a second bias voltage, the first and second bias voltages forming a first voltage potential difference between the gate electrode and the substrate and a first impurity region receiving a third bias voltage, the second and third bias voltages forming a second voltage potential difference between the first impurity region and the substrate, the first and third bias voltages being positive and the second bias voltage being negative.
    • 提供了一种非易失性存储器件及其方法。 示例性方法可以包括向栅电极施加第一偏置电压,向衬底施加第二偏置电压以获得栅电极和衬底之间的第一电压电位差,并向第一杂质区域施加第三偏置电压以获得 所述基板和所述第一杂质区域之间的第二电压电位差,所述第一和第三偏置电压为正,所述第二偏置电压为负。 示例性非易失性存储器件可以包括接收第一偏置电压的栅电极,接收第二偏置电压的衬底,在栅电极和衬底之间形成第一电压电位差的第一和第二偏置电压以及接收第 所述第二偏置电压和所述第三偏置电压在所述第一杂质区域和所述衬底之间形成第二电压电位差,所述第一和第三偏置电压为正,所述第二偏置电压为负。
    • 24. 发明授权
    • Method of fabricating non-volatile flash memory device having at least two different channel concentrations
    • 制造具有至少两个不同通道浓度的非易失性闪速存储器件的方法
    • US07932154B2
    • 2011-04-26
    • US12007097
    • 2008-01-07
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L21/334
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。
    • 25. 发明申请
    • Method of fabricating non-volatile flash memory device having at least two different channel concentrations
    • 制造具有至少两个不同通道浓度的非易失性闪速存储器件的方法
    • US20080108197A1
    • 2008-05-08
    • US12007097
    • 2008-01-07
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L21/334
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。
    • 26. 发明授权
    • Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same
    • 具有至少两种不同通道浓度的非挥发性闪存器件及其制造方法
    • US07320920B2
    • 2008-01-22
    • US11097281
    • 2005-04-04
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L21/334
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。
    • 27. 发明申请
    • Non-volatile flash memory device having at least two different channel concentrations and method of fabricating the same
    • 具有至少两种不同通道浓度的非挥发性闪存器件及其制造方法
    • US20060011965A1
    • 2006-01-19
    • US11097281
    • 2005-04-04
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • Sang-Su KimSung-Taeg KangIn-Wook ChoJeong-Hwan Yang
    • H01L29/76
    • H01L29/66833H01L21/28282H01L29/792
    • In a non-volatile flash memory device, and a method of fabricating the same, the device includes a semiconductor substrate, a source region and a drain region disposed in the semiconductor substrate to be spaced apart from each other, a tunneling layer pattern, a charge trap layer pattern and a shielding layer pattern, which are sequentially stacked on the semiconductor substrate between the source region and the drain region, adjacent to the source region, a first channel region disposed in the semiconductor substrate below the tunneling layer pattern, a gate insulating layer disposed on the semiconductor substrate between the drain region and the first channel region, a second channel region disposed in the semiconductor substrate below the gate insulating layer, a concentration of the second channel region being different from that of the first channel region, and a gate electrode covering the shielding layer pattern and the gate insulating layer.
    • 在非易失性闪速存储器件及其制造方法中,该器件包括半导体衬底,设置在半导体衬底中的源极区和漏极区以彼此间隔开,隧道层图案, 电荷陷阱层图案和屏蔽层图案,它们在与源极区相邻的源极区域和漏极区域之间的半导体衬底上依次层叠,设置在半导体衬底中的在隧道层图案下方的第一沟道区域,栅极 在所述漏极区域和所述第一沟道区域之间设置在所述半导体衬底上的绝缘层,设置在所述半导体衬底中的所述栅极绝缘层下方的第二沟道区域,所述第二沟道区域的浓度与所述第一沟道区域的浓度不同,以及 覆盖屏蔽层图案的栅电极和栅极绝缘层。