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    • 24. 发明授权
    • Increasing phase change memory column landing margin
    • 增加相变记忆柱着陆边界
    • US07390691B2
    • 2008-06-24
    • US11262250
    • 2005-10-28
    • Charles H. DennisonIlya V. Karpov
    • Charles H. DennisonIlya V. Karpov
    • H01L21/00H01L21/336
    • H01L45/06H01L27/2463H01L45/1233H01L45/1253H01L45/126H01L45/1675
    • A phase change memory with higher column landing margin may be formed. In one approach, the column landing margin may be increased by increasing the height of an electrode. For example, the electrode being made of two disparate materials, one of which includes nitride and the other of which does not. In another approach, a hard mask is used which is of substantially the same material as an overlying and surrounding insulator. The hard mask and an underlying phase change material are protected by a sidewall spacer of a different material than the hard mask. If the hard mask and the insulator have substantially the same etch characteristics, the hard mask may be removed while maintaining the protective character of the sidewall spacer.
    • 可以形成具有较高列着陆边缘的相变存储器。 在一种方法中,可以通过增加电极的高度来增加列着色边缘。 例如,电极由两种不同的材料制成,其中之一包括氮化物,另一个不包括氮化物。 在另一种方法中,使用与覆盖和围绕的绝缘体基本上相同的材料的硬掩模。 硬掩模和下面的相变材料由与硬掩模不同的材料的侧壁间隔物保护。 如果硬掩模和绝缘体具有基本相同的蚀刻特性,则可以去除硬掩模,同时保持侧壁间隔物的保护特性。