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    • 21. 发明授权
    • Insulated-gate semiconductor field effect transistor which operates with
a low gate voltage and high drain and source voltages
    • 绝缘栅半导体场效应晶体管以低栅极电压和高漏极和源极电压工作
    • US5495122A
    • 1996-02-27
    • US246250
    • 1994-05-19
    • Gen Tada
    • Gen Tada
    • H01L21/8234H01L27/088H01L29/76
    • H01L27/088
    • In a low voltage drive circuit section of a semiconductor integrated circuit, the gate oxide films are approximately 250 .ANG., and a low voltage N-channel IGFET and a low voltage P-channel IGFET are operable at high speed and driven at a low voltage. In a high voltage driven circuit section, the gate oxide films are approximately 1500 .ANG., and a high voltage N-channel IGFET and a high voltage P-channel IGFET are designed to have a high breakdown voltage performance. In a low gate voltage/high voltage drive circuit section, the gate oxide films are approximately 250 .ANG., and a high voltage N-channel IGFET is driven at a low gate voltage and operable at high speed. The high voltage N-channel IGFET of the low gate voltage/high voltage drive circuit section has an offset structure including a drain diffusion layer of low concentration, such that the breakdown voltage of the drain is greatly increased.
    • 在半导体集成电路的低电压驱动电路部分中,栅极氧化物膜约为250安培,低电压N沟道IGFET和低电压P沟道IGFET可高速工作并以低电压驱动。 在高电压驱动电路部分中,栅极氧化物膜约为1500安培,高压N沟道IGFET和高电压P沟道IGFET被设计成具有高的击穿电压性能。 在低栅极电压/高压驱动电路部分中,栅极氧化物膜约为250安培,高电压N沟道IGFET以低栅极电压驱动并以高速运行。 低栅极电压/高压驱动电路部分的高电压N沟道IGFET具有包括低浓度漏极扩散层的偏移结构,使得漏极的击穿电压大大增加。
    • 25. 发明授权
    • Method of producing a semiconductor device having two MIS transistor
circuits
    • 制造具有两个MIS晶体管电路的半导体器件的方法
    • US5545577A
    • 1996-08-13
    • US156847
    • 1993-11-24
    • Gen Tada
    • Gen Tada
    • H01L21/8234H01L27/088H01L27/092H01L21/70
    • H01L27/0925
    • After forming a gate oxide film on the surface side of a single crystalline silicon substrate, a first polycrystalline silicon layer is subsequently formed. After that, portions of polycrystalline silicon layers are left in each gate electrode formation region of a high voltage drive circuit. Then, the gate oxide film in a low voltage drive circuit side is removed while maintaining this state. Then, after forming a gate oxide film on those surface sides, a polycrystalline silicon layer is subsequently formed in the surface side. After that, impurities are introduced into the polycrystalline silicon layer to provide it with electrical conduction, and then portions of polycrystalline silicon layers are left.
    • 在单晶硅衬底的表面侧形成栅极氧化膜之后,随后形成第一多晶硅层。 之后,在高电压驱动电路的每个栅电极形成区域中留下多晶硅层的一部分。 然后,在保持该状态的同时,去除低压驱动电路侧的栅极氧化膜。 然后,在这些表面侧形成栅极氧化膜后,在表面侧随后形成多晶硅层。 之后,将杂质引入多晶硅层以提供导电,然后留下多晶硅层的一部分。