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21. 发明专利

JP2004095684A Heat sink 审中-公开
公开(公告)号：JP2004095684A
公开(公告)日：2004-03-25
申请号：JP2002252080
申请日：2002-08-29
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , MASUKO KOICHI
IPC分类号： F28D15/02 , H01L23/427
CPC分类号： F28D15/0233
摘要： PROBLEM TO BE SOLVED: To provide a compact and lightweight heat sink having a high thermal characteristic. SOLUTION: In the heat sink having a plate type heat pipe 3 constituted of sealing working fluid in a thin plate-like container 2 formed by a press working body 2A and a cover plate 2B, an outer frame 8 is formed on the outer peripheral edge of the container 2, the outer frame 8 is attached to the outer peripheral edge of the press working body 2A, and the cover plate 2B is attached so as to cover the press working body 2A and the outer frame 8. COPYRIGHT: (C)2004,JPO

22. 发明专利

JP2004079754A Heat sink 审中-公开
标题翻译：散热器
公开(公告)号：JP2004079754A
公开(公告)日：2004-03-11
申请号：JP2002237558
申请日：2002-08-16
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , MASUKO KOICHI
IPC分类号： F28D15/02 , H01L23/36 , H01L23/427 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a heat sink which has such a structure that radiation fins are attached to a heat pipe installed in a base section and which has superior thermal properties.
SOLUTION: In the heat sink 1 wherein a plurality of flat fins 3 are arranged in parallel with prescribed intervals and are mounted on a front surface of the base section in an upright position, one end 5A of at least one heat pipe 5 is connected to the base section 2 while the other end 5B of the heat pipe 5 is extended laterally along a front surface 2A of the base section 2. The other tabular fins 4 are attached to the other end 5B of the heat pipe 5.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种散热器，其具有散热片附接到安装在基部中的热管并具有优异的热性能的结构。解决方案：在散热器1中，其中多个扁平翅片3以规定间隔平行布置并且以直立位置安装在基部的前表面上，至少一个热管5的一端5A 连接到基部2，而热管5的另一端5B沿着基部2的前表面2A横向延伸。其他平板状翅片4附接到热管5的另一端5B。 P>版权所有（C）2004，JPO

23. 发明专利

JP2004071636A Heat sink with fan 审中-公开
公开(公告)号：JP2004071636A
公开(公告)日：2004-03-04
申请号：JP2002224960
申请日：2002-08-01
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , MASUKO KOICHI
IPC分类号： F28D15/02 , H01L23/36 , H01L23/427 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink equipped with a fan, which is capable of cooling down an object efficiently. SOLUTION: The heat sink 1 with the fan 8 is equipped with a plurality of fins 5 and a base unit 2, wherein the fan 8 is provided to feed an air flow between the fins 5. The fins 5 are arranged above the base unit 2 as stacked up at regular intervals, a hollow part 9 is provided near the center part of the stacked fins 5 as extending from the uppermost fin 5 to a prescribed lower fin 5, and the fan 8 is arranged so as to blow an air flow into the hollow part 9 from above. COPYRIGHT: (C)2004,JPO

24. 发明专利

JP2004047570A Heat sink with fan 审中-公开
公开(公告)号：JP2004047570A
公开(公告)日：2004-02-12
申请号：JP2002200314
申请日：2002-07-09
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , MASUKO KOICHI
IPC分类号： H05K7/20 , H01L23/36 , H01L23/467
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat sink with a fan whose heat radiation area is large and which can efficiently cool electronic elements without stagnating a heat exchange fluid in a heat sink. SOLUTION: The heat sink 1 has the fan with a plurality of fins 5 erected by spacing a prescribed interval on a base 2, and arranges an axial fan 6 supplying air toward a gap 7 between the fins 5 on the end of the reverse side to the base 2 of the fins 5. The fin 5 is formed as a truncated pyramid-shaped frame body in which the opening area of a side of the fan 6 is made large with respect to the opening area of the side of the base 2, a plurality of the frame bodies whose inner sizes are made gradually larger are combined to space a constant interval so as to be mutually telescopic in the order in the outside by making the center axial line of the axial fan 6 as a center, and through-holes 5A penetrating each fin in the direction of plate thickness are formed. COPYRIGHT: (C)2004,JPO

25. 发明专利

JP2004015024A Cooling device for electronic element 有权
公开(公告)号：JP2004015024A
公开(公告)日：2004-01-15
申请号：JP2002170522
申请日：2002-06-11
申请人： Fujikura Ltd , Internatl Business Mach Corp , インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation , 株式会社フジクラ
发明人： KAWAHARA YOJI , MOCHIZUKI MASATAKA , MASUKO KOICHI , KIYOOKA FUMITOSHI , AGATA HIROAKI
IPC分类号： F28D15/02 , H01L23/427 , H01L23/467 , H05K7/20
CPC分类号： F28D15/0233
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for an electronic element which has high cooling efficiency.
SOLUTION: The cooling device 1 for an electronic element cools an electronic element 8 by dissipating heat by cooling air generated by a micro fan 1A. The cooling device 1 includes a platy heat pipe 7 which, is enclosed inside a container 7A, a working fluid that delivers heat in the form of latent heat. Part of a frame 2 of the micro fan 1A is formed of part of the container 7A. In the other part of the container 7A, a heat input section 9 is formed which locates the electronic element 8 so that the electronic element 8 can transfer heat. The container 7A is equipped with a flat portion connected to a part which forms a hollow portion wherein the working fluid is enclosed. In the flat portion, suction ports 5 are formed through it. The micro fan 1A is located in the flat portion, and radiating fins 10 integrally formed with the outer surface of the container 7A are located at a position which receives cooling air outputted from output ports 6A and 6B of the micro fan 1A.
COPYRIGHT: (C)2004,JPO

26. 发明专利

JP2003304629A Structure for cooling marine cable landed portion 审中-公开
标题翻译：用于冷却海洋电缆的部分结构
公开(公告)号：JP2003304629A
公开(公告)日：2003-10-24
申请号：JP2002107073
申请日：2002-04-09
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , YOSHIDA SHOTARO , SUMITANI SHINZO
IPC分类号： F28D15/02 , H02G1/10 , H02G9/00 , H02G9/02
CPC分类号： F28D15/0275
摘要： PROBLEM TO BE SOLVED: To provide a structure for cooling a marine cable landed portion, capable of efficiently cooling an electrical heating element, such as a marine cable, at a low cost.
SOLUTION: In a cooling system 1 for the marine cable landed portion, that cools the heat of a power cable 2 landed from water by dissipating heat into an air, a sheathing material 8, that sucks the water by capillarity is arranged therein with one end immerged in the water and another end laid along the landed power cable 2, and the material 8, is buried along the power cable 2 in the vicinity of the cable 2. The side end of the heating part 5 of a heat pipe 4, the side end of the radiation part 7 of which is exposed to the air, is buried in the vicinity of the power cable 2 laid along the cable 2.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于冷却船用电缆着陆部分的结构，其能够以低成本有效地冷却诸如船用电缆的电加热元件。解决方案：在用于海洋电缆着陆部分的冷却系统1中，通过将热量散发到空气中来冷却从水中降落的电力电缆2的热量，其中布置有通过毛细管吸收水的护套材料8 其一端浸没在水中，另一端沿着着陆电力电缆2放置，材料8沿着电力电缆2在电缆2附近被埋设。热管的加热部分5的侧端如图4所示，辐射部7的暴露于空气的侧端被埋在沿着电缆2放置的电力电缆2的附近。版权所有（C）2004，JPO

27. 发明专利

JP2003051571A Heat sink 审中-公开
标题翻译：散热器
公开(公告)号：JP2003051571A
公开(公告)日：2003-02-21
申请号：JP2001239844
申请日：2001-08-07
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , MASUKO KOICHI
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a heat sink having high productivity and high heat sink efficiency.
SOLUTION: The heat sink 7 comprises a plurality of heat sink units having multiple flat plate-like heat sink fins 2 arranged with a predetermined interval in parallel with each other and mounted on the surface of a metal base 1 in a state in which the fins 2 are erected. The heat sink units 3, 4 and 5 are continuously disposed in a direction perpendicular to the array direction of the fins 2, and a width of the fins 2 of any heat sink unit in the array direction is different from that of another adjacent heat sink unit to a heat sink unit to thereby form a space on the surface side of the base 1.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供具有高生产率和高散热效率的散热器。解决方案：散热器7包括多个散热单元，其具有多个平板状的散热片翅片2，它们以预定的间隔彼此平行地布置并安装在金属基座1的表面上， 2架设。散热单元3,4和5在与散热片2的排列方向垂直的方向上连续地设置，散热单元的排列方向的散热片2的宽度与另一个相邻散热片的宽度不同单元到散热单元，从而在基座1的表面侧上形成空间。

28. 发明专利

JP2002372388A Heat pipe and its manufacturing method 有权
标题翻译：热管及其制造方法
公开(公告)号：JP2002372388A
公开(公告)日：2002-12-26
申请号：JP2001179201
申请日：2001-06-13
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MOCHIZUKI MASATAKA , SHISEKI MASAO , SAITO YUJI , OGAWARA TORU , KURIYAMA HIROYUKI
IPC分类号： F28D15/02 , B32B15/02
CPC分类号： F28D15/046
摘要： PROBLEM TO BE SOLVED: To increase the heat transporting ability of a heat pipe using metallic fibers as wicks. SOLUTION: In this heat pipe 1, wicks are constituted by inserting many extremely thin copper wires (fibers) 4 into the internal surface of an airtightly sealed heat pipe container 2, and a condensable working fluid 7 is enclosed in the container 2. At least part of the extremely thin copper wires 4 is integrated with the internal surface of the container 2. Consequently, the thermal resistance of this heat pipe 1 becomes smaller and the heat transporting ability of this pipe 1 is improved, because no dry out, etc., occurs in its heat input section (heating section) due to the improved reflux characteristics of the liquid- phase working fluid.
摘要翻译：要解决的问题：增加使用金属纤维作为纤芯的热管的传热能力。解决方案：在该热管1中，通过将许多非常细的铜线（纤维）4插入气密密封的热管容器2的内表面，将可冷凝的工作流体7封闭在容器2内，构成灯芯。至少一部分极细的铜线4与容器2的内表面一体化。因此，由于没有干燥等，该热管1的热阻变小，因此该管1的热传递能力得到改善，由于液相工作流体的回流特性的改善，在其热输入部（加热部）中发生。

29. 发明专利

JP2015050323A 半導体パッケージの複合冷却構造有权
标题翻译：用于半导体封装的复合冷却结构
公开(公告)号：JP2015050323A
公开(公告)日：2015-03-16
申请号：JP2013181041
申请日：2013-09-02
申请人：株式会社フジクラ , Fujikura Ltd
发明人： AHMAD JALILVAND , MOCHIZUKI MASATAKA
IPC分类号： H01L23/427 , H05K7/20
摘要：【課題】半導体を3次元実装して構成された半導体パッケージの冷却性能に優れた冷却構造を提供する。【解決手段】マザーボード1上に半導体2,4,5が複数層に積層されて構成された半導体パッケージの複合冷却構造において、最上層の半導体5の上に、加熱されて蒸発するとともに放熱して凝縮する作動流体が封入されたベーパーチャンバー型熱拡散板8が前記最上層の半導体5との間で熱授受するように配置され、その熱拡散板8上にヒートシンク11が設けられ、前記熱拡散板8は、前記マザーボード1の上面に配置された第1層の半導体2の上面に向けて延びるとともにその第1層の半導体の上面に熱授受可能に接触させられた中空構造の脚部8bを備え、この脚部8bの内部を含む前記熱拡散板8の内部に、液相の前記作動流体が浸透しかつ毛管力を発生するウィック9が収容されている。【選択図】図1
摘要翻译：要解决的问题：提供具有优异性能的冷却结构，用于冷却构造成三维封装半导体的半导体封装。解决方案：提供了一种半导体封装的复合冷却结构，其通过层叠多个半导体2,4，在复合冷却结构中，包括通过加热蒸发并通过辐射热而被冷凝的工作流体的蒸气室型热扩散板8布置在最上层的半导体5上以便与最上层的半导体5进行热传导。散热板11设置在热扩散板8上。热扩散板8包括朝向母板1的上表面上的第一层的半导体2的上表面延伸的中空构造的腿部8b，以及与第一层的半导体的上表面接触，从而能够在腿部8b和第一层的半导体的上表面之间连通热量。在包括腿部8b内部的热扩散板8的内部，容纳浸渍有液相的工作流体并产生毛细管力的芯10。

30. 发明专利

JP2014013849A Heat dissipation structure for electronic apparatus 审中-公开
标题翻译：电子设备散热结构
公开(公告)号：JP2014013849A
公开(公告)日：2014-01-23
申请号：JP2012151008
申请日：2012-07-05
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SINGH RANDEEP , MOCHIZUKI MASATAKA , MASUKO KOICHI
IPC分类号： H01L23/36 , H01L23/427 , H05K7/20
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a heat dissipation structure for an electronic apparatus, which facilitates cooling multiple electronic components having different heights.SOLUTION: A heat dissipation structure for an electronic apparatus is configured to mount electronic components 1, 3 to generate heat by energization on a substrate 2 and transmit heat from the multiple electronic components 1, 3 to a thermal diffusion plate 6 arranged to cover the upper surface side of the multiple electronic components 1, 3. The electronic components 1, 3 include the electronic component 1 larger in height when measured from the substrate 2 and the electronic component 3 smaller in height. A working fluid 8 to be evaporated by heating, to dissipate heat, and to be condensed is enclosed inside a sealed container 7a. A heat transmission member 7 where the container 7a is expanded by the evaporation of the working fluid is held at least between the upper surface of the electronic component 3 smaller in height and the lower surface of the thermal diffusion plate 6.
摘要翻译：要解决的问题：提供一种用于电子设备的散热结构，其有助于冷却具有不同高度的多个电子部件。解决方案：电子设备的散热结构被配置为安装电子部件1,3以通过通电而产生热量在基板2上，并且将来自多个电子部件1,3的热传递到布置成覆盖多个电子部件1,3的上表面侧的热扩散板6.电子部件1,3包括较大的电子部件1 从基板2和高度较小的电子部件3测量时的高度。通过加热蒸发以散热并被冷凝的工作流体8封闭在密封容器7a内。容器7a通过工作流体的蒸发膨胀的传热构件7至少保持在电子部件3的高度较小的上表面与热扩散板6的下表面之间。

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