专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

WO2005069914A2 PROBE CARD CONFIGURATION FOR LOW MECHANICAL FLEXURAL STRENGTH ELECTRICAL ROUTING SUBSTRATES 审中-公开
标题翻译：低机械强度电气路由基板的探针卡配置
公开(公告)号：WO2005069914A2
公开(公告)日：2005-08-04
申请号：PCT/US2005001551
申请日：2005-01-18
申请人： FORMFACTOR INC , SHINDE MAKARAND S , LARDER RICHARD A , COOPER TIMOTHY E , SHENOY RAVINDRA V , ELDRIDGE BENJAMIN N
发明人： SHINDE MAKARAND S , LARDER RICHARD A , COOPER TIMOTHY E , SHENOY RAVINDRA V , ELDRIDGE BENJAMIN N
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2889 , G01R1/07378
摘要： A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface
摘要翻译：提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探针负载; 和/或（5）高刚性界面

22. 发明申请

WO03001223A3 HIGH DENSITY PLANAR ELECTRICAL INTERFACE 审中-公开
标题翻译：高密度平面电气接口
公开(公告)号：WO03001223A3
公开(公告)日：2003-05-30
申请号：PCT/US0219347
申请日：2002-06-18
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , MILLER CHARLES A
发明人： ELDRIDGE BENJAMIN N , MILLER CHARLES A
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R31/26 , H01B1/00
CPC分类号： G01R1/0466 , H01R13/025 , H01R13/40 , H01R2201/20
摘要： An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
摘要翻译：一种设备，包括具有多个通孔的基板和包括电线和/或同轴电缆的多根电缆，延伸穿过基板的多个通孔中的相应的通孔。每个电缆包括导体并围绕基板的表面终止，使得多个电缆中的相应电缆的导体平面对准并且可用于电接触。一种系统，包括延伸穿过所述界面的主体的多个通孔中的相应一个的电缆接口; 互连部件，其包括与所述多根电缆中的相应导体对准的第一多个接触点以及与要测试的设备的相应接触点对准的第二多个接触点。而且，一种通过电子部件之间的多根电缆的导线路由信号的方法。

23. 发明申请

WO02101830A3 ELECTRONIC COMPONENTS WITH PLURALITY OF CONTOURED MICROELECTRONIC SPRING CONTACTS 审中-公开
标题翻译：具有多层结构的微电子弹簧触头的电子元件
公开(公告)号：WO02101830A3
公开(公告)日：2003-05-01
申请号：PCT/US0217970
申请日：2002-06-06
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , WENZEL STUART W
发明人： ELDRIDGE BENJAMIN N , WENZEL STUART W
IPC分类号： H01R12/61 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , H01L23/48 , H01R13/24 , H05K3/40 , H05K7/10
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electronic component having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
摘要翻译：一种电子部件，具有安装到部件的平面上的多个微电子弹簧触点。微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座，梁的第一端和位于梁的与基座相对的自由端的尖端。梁在其自由端和底座之间具有不受支撑的跨距。微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。弹簧触点可以具有各种创新的轮廓形状。在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

24. 发明申请

WO0180315A3 SHAPED SPRINGS AND METHODS OF FABRICATING AND USING SHAPED SPRINGS 审中-公开
标题翻译：形状弹簧和制作和使用形状弹簧的方法
公开(公告)号：WO0180315A3
公开(公告)日：2002-03-28
申请号：PCT/US0109994
申请日：2001-03-28
申请人： FORMFACTOR INC , MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , WENZEL STUART W
发明人： MATHIEU GAETAN L , ELDRIDGE BENJAMIN N , WENZEL STUART W
IPC分类号： G01R1/073 , G01R1/067 , G01R3/00 , H01L21/60 , H01L23/48 , H01L23/485 , H01R33/76
CPC分类号： G01R1/06761 , G01R1/06744 , G01R1/07342 , G01R3/00 , H01L24/11 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01094 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/00
摘要： An interconnection element and a method of fabricating and using an interconnect element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is modified. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume).
摘要翻译：互连元件和制造和使用互连元件的方法，所述互连元件包括适于耦合到基板的第一元件材料和包括具有可变形特性的材料的第二元件材料，使得在变换时，互连的形状被修改。一个实例是具有可变形特性的材料，使得第一和/或第二元素材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转化。

25. 发明申请

WO2007065012A3 APPARATUS AND METHOD FOR ADJUSTING AN ORIENTATION OF PROBES 审中-公开
标题翻译：调整探头方向的装置和方法
公开(公告)号：WO2007065012A3
公开(公告)日：2009-02-12
申请号：PCT/US2006046277
申请日：2006-12-04
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SLOCUM ALEXANDER H
发明人： ELDRIDGE BENJAMIN N , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SLOCUM ALEXANDER H
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R31/31905
摘要： Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.
摘要翻译：可以相对于探针卡组件的元件调整探针卡组件的探针，探针卡组件可以是探针卡组件的元件，其有助于将探针卡组件安装到测试装置。然后可以将探针卡组件安装在测试装置中，并且可以相对于测试装置（例如测试装置的结构部分或连接到测试装置的结构元件）来调整探针卡组件的取向。

26. 发明申请

WO2008048938A3 MAKING AND USING CARBON NANOTUBE PROBES 审中-公开
标题翻译：制造和使用碳纳米管探针
公开(公告)号：WO2008048938A3
公开(公告)日：2008-09-12
申请号：PCT/US2007081423
申请日：2007-10-15
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , MARTENS RODNEY I , SLOCUM ALEXANDER H , YAGLIOGLU ONNIK
发明人： ELDRIDGE BENJAMIN N , GRITTERS JOHN K , MARTENS RODNEY I , SLOCUM ALEXANDER H , YAGLIOGLU ONNIK
IPC分类号： F16F1/36 , B82B1/00
CPC分类号： G01R1/06716 , G01R1/06744 , G01R1/0675 , G01R1/06755 , G01R3/00 , H01L2924/0002 , Y10T29/49004 , Y10T29/49147 , Y10T29/49204 , H01L2924/00
摘要： Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.
摘要翻译：包括多个垂直排列的碳纳米管的柱可以被配置为机电接触结构或探针。柱可以在牺牲衬底上生长并转移到产物基底，或者可以在产物基底上生长柱。可以处理柱以增强诸如刚度，电性能如导电性和/或物理接触特性的机械性能。柱可以被机械调节以具有预定的弹簧性质。这些列可以用作机电探针，例如用于接触和测试诸如半导体管芯的电子器件，并且这些列可以在电子器件的端子上形成独特的标记。

27. 发明申请

WO2008024726A2 CARBON NANOTUBE CONTACT STRUCTURES 审中-公开
标题翻译：碳纳米管接触结构
公开(公告)号：WO2008024726A2
公开(公告)日：2008-02-28
申请号：PCT/US2007076345
申请日：2007-08-21
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , KHANDROS IGOR K , MARTENS ROD , MATHIEU GAETAN L
发明人： ELDRIDGE BENJAMIN N , GRITTERS JOHN K , KHANDROS IGOR K , MARTENS ROD , MATHIEU GAETAN L
IPC分类号： D01F9/12
CPC分类号： G01R1/06755 , H01R13/03 , Y10T29/49204
摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.
摘要翻译：可以使用碳纳米管接触结构来与DUT进行压力连接。可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。接触结构或其部分也可以镀有含有碳纳米管的溶液。所得到的接触结构可以是韧性的，并且可以提供良好的导电性。

28. 发明申请

WO2006023741A3 METHOD TO BUILD A WIREBOND PROBE CARD IN A MANY AT A TIME FASHION 审中-公开
标题翻译：一种方便地在时间上构建WIREBOND探针卡的方法
公开(公告)号：WO2006023741A3
公开(公告)日：2007-12-06
申请号：PCT/US2005029581
申请日：2005-08-19
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , BARBARA BRUCE J
发明人： ELDRIDGE BENJAMIN N , BARBARA BRUCE J
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/07342 , G01R1/07378 , G01R31/2889 , H01L2224/48091 , H01L2224/49171 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01L2924/3011 , H01L2924/30111 , Y10T29/49121 , Y10T29/49147 , Y10T29/49224 , H01L2924/00014 , H01L2924/00
摘要： Resilient spring contacts (140) for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures (140) are adapted for wire bonding to an electrical circuit on a space transformer substrate (160). The support substrates (150) with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate (160) to improve yield. The resilient spring contacts (140) are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts (140) are epoxied to the support substrate (150) and the release layer removed. The support substrate (150) can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided (152) beneath the spring contacts for improved impedance matching.
摘要翻译：提供了用于晶片测试探测的弹性弹簧触点（140），其可以以非常精细的间距间距制造并且精确地位于支撑基板上。弹性接触结构（140）适于引线接合到空间变换器基板（160）上的电路。具有附接的弹簧触点的支撑基板（150）可以一起大量制造，并在附接到空间变压器基板（160）之前进行切割和测试，以提高产量。弹性弹簧触点（140）使用光刻技术制造，以在将弹簧触点（140）环氧化为支撑衬底（150）并且去除释放层之前在释放层上形成触点。支撑基板（150）可以是透明的，以允许触点的对准和下面的光学部件的测试。支撑衬底可以包括在弹簧触点下面提供（152）的接地平面，用于改善阻抗匹配。

29. 发明申请

WO02075783A8 WAFER LEVEL INTERPOSER 审中-公开
公开(公告)号：WO02075783A8
公开(公告)日：2005-03-17
申请号：PCT/US0207863
申请日：2002-03-13
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , REYNOLDS CARL V
发明人： ELDRIDGE BENJAMIN N , REYNOLDS CARL V
IPC分类号： G01R1/067 , G01R1/073 , H01L23/48
CPC分类号： G01R1/07378 , G01R1/07307 , H01L2924/0002 , H01L2924/00
摘要： Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer (1078) comprises a substrate having a first surface (1082) and a second surface (1086) opposite of said first surface, a first plurality of contact elements (1080) disposed on said first side (1082) of said substrate, and a second plurality of contact elements (1084) disposed on said second surface (1086) of said substrate, wherein said interposer (1078) connects electronic devices (1088, 1090) via said first and said second plurality of contact elements.
摘要翻译：双面插入器组件及其形成和使用方法。在本发明的一个示例中，插入器（1078）包括具有第一表面（1082）和与所述第一表面相对的第二表面（1086）的基板，设置在所述第一侧面上的第一多个接触元件（1080） 1082）和设置在所述基板的所述第二表面（1086）上的第二多个接触元件（1084），其中所述插入件（1078）经由所述第一和第二多个接触元件

30. 发明申请

WO2012006249A2 TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS 审中-公开
标题翻译：通过设备VIAS的测试技术
公开(公告)号：WO2012006249A2
公开(公告)日：2012-01-12
申请号：PCT/US2011042850
申请日：2011-07-01
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： H01L21/66
CPC分类号： G01R31/2884 , G01R31/2889
摘要： Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias.
摘要翻译：用于测试具有穿通设备通孔的电子设备的技术可以包括使用具有探针的探针卡组件，用于接触包括电子设备的穿通设备通孔的端部的电子设备的连接结构。一对探针可以电连接在探针卡组件中，并且因此可以接触并且形成从一个通过装置通孔到另一个通过装置通孔的直接返回回路，一对通过装置通孔与一对穿通装置通孔探针接触。电子设备可以包括用于将测试信号驱动到通过设备通孔中的一个上的测试电路和用于检测通过设备通孔中的另一个上的测试信号的接收器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式