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    • 26. 发明授权
    • Diffusion sidewall for a semiconductor structure
    • 半导体结构的扩散侧壁
    • US08946853B2
    • 2015-02-03
    • US13351041
    • 2012-01-16
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • H01L29/06H01L21/762H01L21/84H01L27/12
    • H01L21/76224H01L21/76283H01L21/84H01L27/1203
    • A method of forming diffusion sidewalls in a semiconductor structure and a semiconductor structure having diffusion sidewalls includes etching a trench into a semiconductor substrate to form first and second active regions, lining each trench with an oxide liner along exposed sidewalls of an active silicon region (RX) of the first and second active regions, removing the oxide liner formed along the exposed sidewalls of the RX region of one of the first and second active regions, forming diffusion sidewalls by epitaxially growing in-situ doped material within the exposed sidewalls of the RX region of the one of the first and second active regions, and forming an isolation region within the trench between the first and second active regions to electrically isolate the first and second active regions from each other.
    • 在半导体结构中形成扩散侧壁的方法和具有扩散侧壁的半导体结构的方法包括将沟槽蚀刻到半导体衬底中以形成第一和第二有源区,沿着有源硅区(RX )去除沿着第一和第二有源区域之一的RX区域的暴露的侧壁形成的氧化物衬垫,通过在RX的暴露侧壁内外延生长原位掺杂材料来形成扩散侧壁 区域,并且在第一和第二有源区域之间的沟槽内形成隔离区域,以将第一和第二有源区域彼此电隔离。
    • 27. 发明授权
    • Multi-gate transistor having sidewall contacts
    • 具有侧壁接触的多栅极晶体管
    • US08536651B2
    • 2013-09-17
    • US13604340
    • 2012-09-05
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • H01L21/336H01L29/786
    • H01L29/785H01L29/66795H01L2029/7858
    • A multi-gate transistor having a plurality of sidewall contacts and a fabrication method that includes forming a semiconductor fin on a semiconductor substrate and etching a trench within the semiconductor fin, depositing an oxide material within the etched trench, and etching the oxide material to form a dummy oxide layer along exposed walls within the etched trench; and forming a spacer dielectric layer along vertical sidewalls of the dummy oxide layer. The method further includes removing exposed dummy oxide layer in a channel region in the semiconductor fin and beneath the spacer dielectric layer, forming a high-k material liner along sidewalls of the channel region in the semiconductor fin, forming a metal gate stack within the etched trench, and forming a plurality of sidewall contacts within the semiconductor fin along adjacent sidewalls of the dummy oxide layer.
    • 一种具有多个侧壁触点的多栅极晶体管及其制造方法,包括在半导体衬底上形成半导体鳍片并蚀刻半导体鳍片内的沟槽,在蚀刻沟槽内沉积氧化物材料,并蚀刻氧化物材料以形成 沿着蚀刻沟槽内的暴露壁的虚拟氧化物层; 以及沿所述虚拟氧化物层的垂直侧壁形成间隔电介质层。 该方法还包括去除半导体鳍片中的沟道区域中的暴露的虚拟氧化物层并且在间隔物电介质层下方形成沿着半导体鳍片中的沟道区域的侧壁形成高k材料衬垫,在蚀刻 沟槽,并且在半导体鳍片内沿虚拟氧化物层的相邻侧壁形成多个侧壁接触。
    • 28. 发明授权
    • MOSFET on silicon-on-insulator REDX with asymmetric source-drain contacts
    • MOSFET上绝缘体上的REDX具有不对称的源极 - 漏极触点
    • US08138547B2
    • 2012-03-20
    • US12548005
    • 2009-08-26
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • H01L29/786H01L21/336
    • H01L21/84H01L29/41733H01L29/458H01L29/66772H01L29/7839H01L29/78624
    • A semiconductor device is disclosed that includes a silicon-on-insulator substrate including a buried insulator layer and an overlying semiconductor layer. Source extension and drain extension regions are formed in the semiconductor layer. A deep drain region and a deep source region are formed in the semiconductor layer. A first metal-semiconductor alloy contact layer is formed using tilted metal formation at an angle tilted towards the source extension region, such that the source extension region has a metal-semiconductor alloy contact that abuts the substrate from the source side, as a Schottky contact therebetween and the gate shields metal deposition from abutting the deep drain region. A second metal-semiconductor alloy contact is formed located on the first metal-semiconductor layer on each of the source extension region and drain extension region.
    • 公开了一种半导体器件,其包括绝缘体上硅衬底,其包括掩埋绝缘体层和上覆半导体层。 在半导体层中形成源延伸和漏扩展区。 在半导体层中形成深漏极区域和深源极区域。 第一金属 - 半导体合金接触层使用倾斜的金属形成,以朝向源延伸区域倾斜的角度形成,使得源极延伸区域具有金属 - 半导体合金接触件,其从源极侧邻接衬底,作为肖特基接触 并且栅极屏蔽金属沉积物抵靠深漏极区域。 在源极延伸区域和漏极延伸区域中的每一个上,在第一金属 - 半导体层上形成第二金属 - 半导体合金接触。
    • 30. 发明申请
    • Multi-gate Transistor Having Sidewall Contacts
    • 具有侧壁触点的多栅极晶体管
    • US20120007183A1
    • 2012-01-12
    • US12832829
    • 2010-07-08
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • H01L29/78H01L21/20
    • H01L29/785H01L29/66795H01L2029/7858
    • A multi-gate transistor having a plurality of sidewall contacts and a fabrication method that includes forming a semiconductor fin on a semiconductor substrate and etching a trench within the semiconductor fin, depositing an oxide material within the etched trench, and etching the oxide material to form a dummy oxide layer along exposed walls within the etched trench; and forming a spacer dielectric layer along vertical sidewalls of the dummy oxide layer. The method further includes removing exposed dummy oxide layer in a channel region in the semiconductor fin and beneath the spacer dielectric layer, forming a high-k material liner along sidewalls of the channel region in the semiconductor fin, forming a metal gate stack within the etched trench, and forming a plurality of sidewall contacts within the semiconductor fin along adjacent sidewalls of the dummy oxide layer.
    • 一种具有多个侧壁触点的多栅极晶体管及其制造方法,包括在半导体衬底上形成半导体鳍片并蚀刻半导体鳍片内的沟槽,在蚀刻沟槽内沉积氧化物材料,并蚀刻氧化物材料以形成 沿着蚀刻沟槽内的暴露壁的虚拟氧化物层; 以及沿所述虚拟氧化物层的垂直侧壁形成间隔电介质层。 该方法还包括去除半导体鳍片中的沟道区域中的暴露的虚拟氧化物层并且在间隔物电介质层下方形成沿着半导体鳍片中的沟道区域的侧壁形成高k材料衬垫,在蚀刻 沟槽,并且在半导体鳍片内沿虚拟氧化物层的相邻侧壁形成多个侧壁接触。