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    • 23. 发明授权
    • Estimating ball-grid-array longevity in a computer system
    • 在计算机系统中估计球栅阵列寿命
    • US08798944B2
    • 2014-08-05
    • US12490012
    • 2009-06-23
    • Aleksey M. UrmanovAnton A. BougaevDavid K. McElfreshLeoncio D. Lopez
    • Aleksey M. UrmanovAnton A. BougaevDavid K. McElfreshLeoncio D. Lopez
    • G01F17/00
    • H04Q9/00H04Q2209/84
    • A method for generating a service action for a computer system is described. During the method, a longevity index value for a packaging technology in the computer system is calculated using a longevity model and thermal and vibration telemetry data that is collected in the computer system. This longevity model may be based on accelerated failure testing of the packaging technology, field failures of the packaging technology in a group of computer systems that includes the computer system, and/or thermal and vibration telemetry data for the group of computer systems. Furthermore, using the longevity index value, the service action for the computer system is determined. Based on the longevity index value, remedial as action, e.g., repairs to the computer system, may be scheduled and performed.
    • 描述了一种用于为计算机系统生成服务动作的方法。 在该方法中,使用计算机系统中收集的寿命模型和热和振动遥测数据计算计算机系统中的包装技术的寿命指数值。 该寿命模型可以基于包装技术的加速故障测试,包括计算机系统的一组计算机系统中的包装技术的现场故障和/或用于该组计算机系统的热和振动遥测数据。 此外,使用寿命指数值,确定计算机系统的服务动作。 基于寿命指数值,可以调度和执行补救作为动作,例如对计算机系统的修复。
    • 25. 发明申请
    • ESTIMATING BALL-GRID-ARRAY LONGEVITY IN A COMPUTER SYSTEM
    • 在计算机系统中估计球网阵列长度
    • US20100324882A1
    • 2010-12-23
    • US12490012
    • 2009-06-23
    • Aleksey M. UrmanovAnton A. BougaevDavid K. McElfreshLeoncio D. Lopez
    • Aleksey M. UrmanovAnton A. BougaevDavid K. McElfreshLeoncio D. Lopez
    • G06F9/44
    • H04Q9/00H04Q2209/84
    • A method for generating a service action for a computer system is described. During the method, a longevity index value for a packaging technology (such as solder joints in a BGA) in the computer system is calculated using thermal and vibration telemetry data (which is collected in the computer system) and a longevity model. This longevity model may be based on accelerated failure testing of the packaging technology, field failures of the packaging technology in a group of computer systems (which includes the computer system) and/or thermal and vibration telemetry data for the group of computer systems. Furthermore, using the longevity index value, the service action for the computer system is determined. Based on the longevity index value, remedial action (such as repairs to the computer system) may be scheduled and performed.
    • 描述了一种用于为计算机系统生成服务动作的方法。 在该方法中,使用计算机系统中的热和振动遥测数据(计算机系统中收集)和长寿模型来计算计算机系统中的包装技术(诸如BGA中的焊点)的寿命指数值。 该寿命模型可以基于包装技术的加速故障测试,一组计算机系统(包括计算机系统)中的包装技术的现场故障和/或用于该组计算机系统的热和振动遥测数据。 此外,使用寿命指数值,确定计算机系统的服务动作。 根据寿命指数值,可以安排和执行补救措施(如计算机系统的维修)。