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    • 21. 发明授权
    • Electrical fuse circuit for security applications
    • 电熔丝电路用于安全应用
    • US08030181B2
    • 2011-10-04
    • US12881944
    • 2010-09-14
    • Shine ChungFu-Lung HsuehFu-Chieh Hsu
    • Shine ChungFu-Lung HsuehFu-Chieh Hsu
    • H01L21/326
    • G11C17/18
    • A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.
    • 公开了一种熔丝电路,其包括至少一个电熔丝元件,该电熔丝元件具有在电迁移模式下受到应力之后变化的电阻;开关装置,其在熔丝编程电源(VDDQ)之间的预定路径中与电熔丝元件串联连接, 以及用于在编程操作期间选择性地允许通过电熔丝元件的编程电流的低电压电源(GND),以及耦合到所述VDDQ的至少一个外围电路,其中所述外围电路是有效的并且在VDDQ期间从VDDQ引出电流 保险丝编程操作。
    • 22. 发明申请
    • Electrical Fuse Circuit for Security Applications
    • 用于安全应用的电保险电路
    • US20080283963A1
    • 2008-11-20
    • US11748959
    • 2007-05-15
    • Shine ChungFu-Lung HsuehFu-Chieh Hsu
    • Shine ChungFu-Lung HsuehFu-Chieh Hsu
    • H01L23/62H01L29/00
    • G11C17/18
    • A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.
    • 公开了一种熔丝电路,其包括至少一个电熔丝元件,该电熔丝元件具有在电迁移模式下受到应力之后变化的电阻;开关装置,其在熔丝编程电源(VDDQ)之间的预定路径中与电熔丝元件串联连接, 以及用于在编程操作期间选择性地允许通过电熔丝元件的编程电流的低电压电源(GND),以及耦合到所述VDDQ的至少一个外围电路,其中所述外围电路是有效的并且在VDDQ期间从VDDQ引出电流 保险丝编程操作。
    • 23. 发明授权
    • Fabrication process for increased capacitance in an embedded DRAM memory
    • 嵌入式DRAM存储器中增加电容的制造工艺
    • US07323379B2
    • 2008-01-29
    • US11050988
    • 2005-02-03
    • Dennis SinitskyFu-Chieh Hsu
    • Dennis SinitskyFu-Chieh Hsu
    • H01L21/8238
    • H01L29/66181H01L27/10829H01L27/1087H01L27/10894H01L27/11
    • An embedded memory system includes an array of dynamic random access memory (DRAM) cells, which are isolated with deep trench isolation, and logic transistors, which are isolated with shallow trench isolation. Each DRAM cell includes an access transistor and a capacitor structure. The capacitor structure is fabricated by forming a metal-dielectric-semiconductor (MOS) capacitor in a deep trench isolation region. A cavity is formed in the deep trench isolation, thereby exposing a sidewall region of the substrate. The sidewall region is doped, thereby forming one electrode of the cell capacitor. A gate dielectric layer is formed over the exposed sidewall, and a polysilicon layer is deposited over the resulting structure, thereby filling the cavity. The polysilicon layer is patterned to form the gate electrode of the access transistor and a capacitor electrode, which extends over the sidewall region and upper surface of the substrate.
    • 嵌入式存储器系统包括与深沟槽隔离隔离的动态随机存取存储器(DRAM)单元阵列和与浅沟槽隔离隔离的逻辑晶体管。 每个DRAM单元包括存取晶体管和电容器结构。 通过在深沟槽隔离区域中形成金属 - 电介质半导体(MOS)电容器来制造电容器结构。 在深沟槽隔离中形成空腔,从而暴露衬底的侧壁区域。 侧壁区域被掺杂,从而形成单元电容器的一个电极。 在暴露的侧壁上形成栅介电层,并且在所得结构上沉积多晶硅层,从而填充空腔。 图案化多晶硅层以形成存取晶体管的栅电极和在衬底的侧壁区域和上表面上延伸的电容器电极。
    • 24. 发明申请
    • Fabrication process for increased capacitance in an embedded DRAM memory
    • 嵌入式DRAM存储器中增加电容的制造工艺
    • US20060172504A1
    • 2006-08-03
    • US11050988
    • 2005-02-03
    • Dennis SinitskyFu-Chieh Hsu
    • Dennis SinitskyFu-Chieh Hsu
    • H01L21/20
    • H01L29/66181H01L27/10829H01L27/1087H01L27/10894H01L27/11
    • An embedded memory system includes an array of dynamic random access memory (DRAM) cells, which are isolated with deep trench isolation, and logic transistors, which are isolated with shallow trench isolation. Each DRAM cell includes an access transistor and a capacitor structure. The capacitor structure is fabricated by forming a metal-dielectric-semiconductor (MOS) capacitor in a deep trench isolation region. A cavity is formed in the deep trench isolation, thereby exposing a sidewall region of the substrate. The sidewall region is doped, thereby forming one electrode of the cell capacitor. A gate dielectric layer is formed over the exposed sidewall, and a polysilicon layer is deposited over the resulting structure, thereby filling the cavity. The polysilicon layer is patterned to form the gate electrode of the access transistor and a capacitor electrode, which extends over the sidewall region and upper surface of the substrate.
    • 嵌入式存储器系统包括与深沟槽隔离隔离的动态随机存取存储器(DRAM)单元阵列和与浅沟槽隔离隔离的逻辑晶体管。 每个DRAM单元包括存取晶体管和电容器结构。 通过在深沟槽隔离区域中形成金属 - 电介质半导体(MOS)电容器来制造电容器结构。 在深沟槽隔离中形成空腔,从而暴露衬底的侧壁区域。 侧壁区域被掺杂,从而形成单元电容器的一个电极。 在暴露的侧壁上形成栅介电层,并且在所得结构上沉积多晶硅层,从而填充空腔。 图案化多晶硅层以形成存取晶体管的栅电极和在衬底的侧壁区域和上表面上延伸的电容器电极。
    • 26. 发明授权
    • One-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region
    • 具有电隔离电荷存储区域的大容量CMOS工艺中的单晶体管浮体DRAM单元
    • US06661042B2
    • 2003-12-09
    • US10095901
    • 2002-03-11
    • Fu-Chieh Hsu
    • Fu-Chieh Hsu
    • H01L29768
    • H01L27/108H01L27/0214H01L27/10802H01L27/10873H01L29/7841
    • A one-transistor, floating-body (1T/FB) dynamic random access memory (DRAM) cell is provided that includes a field-effect transistor fabricated using a process compatible with a standard CMOS process. The field-effect transistor includes a source region and a drain region of a first conductivity type and a floating body region of a second conductivity type, opposite the first conductivity type, located between the source region and the drain region. A buried region of the first conductivity type is located under the source region, drain region and floating body region. The buried region helps to form a depletion region, which is located between the buried region and the source region, the drain region and the floating body region. The floating body region is thereby isolated by the depletion region. A bias voltage can be applied to the buried region, thereby controlling leakage currents in the 1T/FB DRAM cell.
    • 提供了一个单晶体管浮体(1T / FB)动态随机存取存储器(DRAM)单元,其包括使用与标准CMOS工艺兼容的工艺制造的场效应晶体管。 场效应晶体管包括位于源极区域和漏极区域之间的第一导电类型的源极区域和漏极区域以及与第一导电类型相反的第二导电类型的浮动体区域。 第一导电类型的掩埋区域位于源极区域,漏极区域和浮体区域的下方。 掩埋区域有助于形成耗尽区,其位于掩埋区域与源极区域,漏极区域和浮体区域之间。 浮体区由此被耗尽区隔离。 可以将偏置电压施加到掩埋区域,从而控制1T / FB DRAM单元中的漏电流。
    • 28. 发明授权
    • Method of operating a system-on-a-chip including entering a standby state in a non-volatile memory while operating the system-on-a-chip from a volatile memory
    • 操作片上系统的方法,包括在易失性存储器中操作片上系统的同时在非易失性存储器中进入待机状态
    • US06457108B1
    • 2002-09-24
    • US09415032
    • 1999-10-07
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F1300
    • H01L27/11521G11C7/20G11C16/0416G11C2216/10H01L21/28273H01L27/11558H01L29/66825
    • A method of operating a system-on-a-chip having a logic circuit and a thin-oxide non-volatile memory embedded or located on a single chip. In this method, the contents of the non-volatile memory cells are read out and stored (with or without data decompression operations) into on-chip or off-chip volatile memory. The data contents of the non-volatile memory cells are then refreshed (through charge injection and removal) with optimum signal condition. The non-volatile memory cells then remain in an idle or standby mode substantially without a significant external electric field, while the system-on-a-chip is operated in response to the data stored in the volatile memory. If a reprogramming operation or a refresh operation is required, then the non-volatile memory cells are reprogrammed or refreshed as required and then returned to the idle or standby mode. As a result, the storage characteristics of the non-volatile memory cells are improved.
    • 一种操作片上系统的方法,其具有嵌入或位于单个芯片上的逻辑电路和薄氧化物非易失性存储器。 在该方法中,将非易失性存储单元的内容读出并存储(具有或不具有数据解压缩操作)到片上或片外易失性存储器中。 然后通过最佳信号条件刷新非易失性存储单元的数据内容(通过电荷注入和去除)。 然后,非易失性存储器单元基本上没有显着的外部电场而保持在空闲或待机模式,同时在片上系统响应于存储在易失性存储器中的数据而被操作。 如果需要重新编程操作或刷新操作,则根据需要对非易失性存储单元进行重新编程或刷新,然后返回到空闲或待机模式。 结果,提高了非易失性存储单元的存储特性。
    • 30. 发明授权
    • Method of operating memory array with write buffers and related apparatus
    • 使用写入缓冲器和相关设备操作存储器阵列的方法
    • US06295593B1
    • 2001-09-25
    • US09153099
    • 1998-09-14
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F1206
    • G06F12/0893G06F12/0855G06F12/0879G06F12/0897G06F12/10G11C7/10G11C7/1018G11C7/1051G11C7/1069G11C7/1078G11C7/1096G11C11/406G11C11/4076G11C11/4096
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and a second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. A widened data path is provided to the DRAM array, effectively increasing the data rate of the DRAM array. By operating the DRAM array at a higher data rate than the CPU bus, additional time is provided for precharging the DRAM array. As a result, the precharging of the DRAM array is transparent to the CPU bus. A structure and method control the refresh and internal operations of the DRAM array.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线,以及包括连接到CPU总线的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 向DRAM阵列提供加宽的数据路径,有效地增加DRAM阵列的数据速率。 通过以比CPU总线更高的数据速率操作DRAM阵列,为DRAM阵列预充电提供了额外的时间。 结果,DRAM阵列的预充电对CPU总线是透明的。 一种结构和方法来控制DRAM阵列的刷新和内部操作。