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21. 发明授权

US5661983A Fluidized bed desiccant cooling system 失效
标题翻译：流化床干燥剂冷却系统
公开(公告)号：US5661983A
公开(公告)日：1997-09-02
申请号：US460500
申请日：1995-06-02
申请人： Barney Groten , Tahir Cader , Richard Tidball
发明人： Barney Groten , Tahir Cader , Richard Tidball
IPC分类号： B01D53/26 , F24F3/14 , F24F3/147 , F25D23/00 , F25D17/06
CPC分类号： B01D53/261 , F24F3/1411 , F24F3/147 , F24F2003/144 , F24F2003/1458
摘要： An air conditioning system utilizes parallel fluidized bed desiccators for reducing the temperature and humidity of supply air. While one fluidized bed removes moisture from the supply air, the other is regenerated by a heated air flow. Use of the two beds is cycled back and forth between moisture removal and regeneration during operation of the system.
摘要翻译：空调系统采用平行流化床干燥器，减少供气温度和湿度。当一个流化床从供应空气中除去水分时，另一个通过加热的空气流再生。在系统运行期间，使用两张床在水分除去和再生之间来回循环。

22. 发明授权

US09506815B2 Temperature band operation logging 有权
标题翻译：温度带操作记录
公开(公告)号：US09506815B2
公开(公告)日：2016-11-29
申请号：US14125739
申请日：2011-06-27
申请人： David A Moore , Scott P. Faasse , Jeffrey A. Plank , Tahir Cader
发明人： David A Moore , Scott P. Faasse , Jeffrey A. Plank , Tahir Cader
IPC分类号： G01K3/00 , G01K3/04 , G06F1/20 , H05K7/20
CPC分类号： G01K3/04 , G06F1/206 , H05K7/20836
摘要： In a system, temperature measurements are logged. From the logged measurements, duration of operation of the system in each of a plurality of temperature bands is determined.
摘要翻译：在系统中，记录温度测量。从记录的测量中，确定在多个温度带中的每一个中的系统的操作持续时间。

23. 发明授权

US08810266B2 Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis 有权
标题翻译：喷雾冷却热管理系统和半导体探测，诊断和故障分析方法
公开(公告)号：US08810266B2
公开(公告)日：2014-08-19
申请号：US13241100
申请日：2011-09-22
申请人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
发明人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
IPC分类号： G01R31/26 , G01R31/10
CPC分类号： G01R1/0458 , G01R31/2891
摘要： A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.
摘要翻译：公开了一种有利于电激励集成电路芯片的测试仪的微型喷雾冷却系统。该系统包括围绕探针头设置的微喷头。喷头和探针头以密封的方式设置在喷雾室内，在喷雾室中，在操作期间以密封方式被推压到保持被测集成电路的密封板上。雾化的雾气冷却集成电路，然后在喷雾室壁上冷凝。将冷凝的流体泵出室并在冷却器中循环，以便再次循环并再次注入到微喷头中。可以控制喷雾室内的压力以提供所需的沸点。

24. 发明申请

US20120007623A1 SPRAY COOLING THERMAL MANAGEMENT SYSTEM AND METHOD FOR SEMICONDUCTOR PROBING, DIAGNOSTICS, AND FAILURE ANALYSIS 有权
标题翻译：喷雾冷却热管理系统和半导体探测，诊断和故障分析方法
公开(公告)号：US20120007623A1
公开(公告)日：2012-01-12
申请号：US13241100
申请日：2011-09-22
申请人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
发明人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
IPC分类号： G01R31/10
CPC分类号： G01R1/0458 , G01R31/2891
摘要： A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.
摘要翻译：公开了一种有利于电激励集成电路芯片的测试仪的微型喷雾冷却系统。该系统包括围绕探针头设置的微喷头。喷头和探针头以密封的方式设置在喷雾室内，在喷射室内，在操作期间以密封的方式被推压到保持被测集成电路的密封板上。雾化的雾气冷却集成电路，然后在喷雾室壁上冷凝。将冷凝的流体泵出室并在冷却器中循环，以便再次循环并再次注入到微喷头中。可以控制喷雾室内的压力以提供所需的沸点。

25. 发明授权

US08076951B2 Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis 失效
标题翻译：喷雾冷却热管理系统和半导体探测，诊断和故障分析方法
公开(公告)号：US08076951B2
公开(公告)日：2011-12-13
申请号：US12402475
申请日：2009-03-11
申请人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
发明人： Tahir Cader , Charles Lester Tilton , Benjamin Hewett Tolman , George Joseph Wos , Alan Brent Roberts , Thomas Wong , Jonathan D. Frank
IPC分类号： G01R31/26 , G01R31/10
CPC分类号： G01R1/0458 , G01R31/2891
摘要： A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.
摘要翻译：公开了一种有利于电激励集成电路芯片的测试仪的微型喷雾冷却系统。该系统包括围绕探针头设置的微喷头。喷头和探针头以密封的方式设置在喷雾室内，在喷射室内，在操作期间以密封的方式被推压到保持被测集成电路的密封板上。雾化的雾气冷却集成电路，然后在喷雾室壁上冷凝。将冷凝的流体泵出室并在冷却器中循环，以便再次循环并再次注入到微喷头中。可以控制喷雾室内的压力以提供所需的沸点。

26. 发明授权

US07477513B1 Dual sided board thermal management system 有权
标题翻译：双面板热管理系统
公开(公告)号：US07477513B1
公开(公告)日：2009-01-13
申请号：US11618566
申请日：2006-12-29
申请人： Tahir Cader , Paul A. Knight
发明人： Tahir Cader , Paul A. Knight
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2224/16 , H01L2224/16145 , H05K1/0272
摘要： A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal management system generally includes a housing surrounding a portion of a printed circuit board, and a plurality of coolant dispensing units within the housing directed towards opposite sides of the printed circuit board to thermally manage electronic components on opposite sides of the printed circuit board.
摘要翻译：一种双面板热管理系统，用于有效地热管理在其相对侧上具有电子部件的印刷电路板。双面板热管理系统通常包括围绕印刷电路板的一部分的壳体，以及壳体内的多个冷却剂分配单元，其指向印刷电路板的相对侧，以热控制印刷电路板的相对侧上的电子部件电路板。

27. 发明授权

US06958911B2 Low momentum loss fluid manifold system 有权
标题翻译：低动量损失流体歧管系统
公开(公告)号：US06958911B2
公开(公告)日：2005-10-25
申请号：US10769259
申请日：2004-01-30
申请人： Tahir Cader , Robert J. Ressa
发明人： Tahir Cader , Robert J. Ressa
IPC分类号： F25D23/12 , H05K7/20
CPC分类号： H05K7/20345
摘要： The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting liquid and vapor mixture exit the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.
摘要翻译：本发明是冷却并联连接的多个电子部件的两相液体冷却系统。泵将冷却流体作为液体输送到供应歧管，其中其分裂成不同的分支管线。优选地，分支管线将冷却剂供给到各个喷射模块。液体冷却剂从要冷却的部件中除去热量。所得到的液体和蒸气混合物通过多个返回分支离开喷射模块。每个单独的返回分支以锐角进入回流歧管。返回分支和回流歧管之间的角度转换提供了低歧管损失和更有效的系统。

28. 发明申请

US20050168948A1 LOW MOMENTUM LOSS FLUID MANIFOLD SYSTEM 有权
标题翻译：低摩擦流体歧管系统
公开(公告)号：US20050168948A1
公开(公告)日：2005-08-04
申请号：US10769259
申请日：2004-01-30
申请人： Tahir Cader , Robert Ressa
发明人： Tahir Cader , Robert Ressa
IPC分类号： F25D23/12 , H05K7/20
CPC分类号： H05K7/20345
摘要： The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting liquid and vapor mixture exit the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.
摘要翻译：本发明是冷却并联连接的多个电子部件的两相液体冷却系统。泵将冷却流体作为液体输送到供应歧管，其中其分裂成不同的分支管线。优选地，分支管线将冷却剂供给到各个喷射模块。液体冷却剂从要冷却的部件中除去热量。所得到的液体和蒸气混合物通过多个返回分支离开喷射模块。每个单独的返回分支以锐角进入回流歧管。返回分支和回流歧管之间的角度转换提供了低歧管损失和更有效的系统。

29. 发明授权

US06889515B2 Spray cooling system 有权
标题翻译：喷雾冷却系统
公开(公告)号：US06889515B2
公开(公告)日：2005-05-10
申请号：US10368289
申请日：2003-02-14
申请人： Charles L. Tilton , Donald E. Tilton , Ryan J. Baddeley , Tahir Cader , George J. Wos
发明人： Charles L. Tilton , Donald E. Tilton , Ryan J. Baddeley , Tahir Cader , George J. Wos
IPC分类号： F28F7/02 , H01L23/433 , F25D23/12
CPC分类号： F28D15/0266 , F28D5/00 , F28D15/0258 , F28F7/02 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
摘要翻译：一种用于有效地管理单个或多个半导体芯片封装的喷雾冷却系统。喷雾冷却系统包括具有泵单元和储存器的热交换器单元，流体连接到热交换器单元的同轴管，连接到同轴管的耦合器单元和喷射模块，其中耦合器单元可拆卸地连接到喷雾模块。热交换器单元具有允许进入和释放空气而不干扰其运行的耐空气设计。

30. 发明申请

US20140105244A1 TEMPERATURE BAND OPERATION LOGGING 有权
标题翻译：温度条操作记录
公开(公告)号：US20140105244A1
公开(公告)日：2014-04-17
申请号：US14125739
申请日：2011-06-27
申请人： David A Moore , Scott P. Faasse , Jeffrey A. Plank , Tahir Cader
发明人： David A Moore , Scott P. Faasse , Jeffrey A. Plank , Tahir Cader
IPC分类号： G01K3/04
CPC分类号： G01K3/04 , G06F1/206 , H05K7/20836
摘要： In a system, temperature measurements are logged. From the logged measurements, duration of operation of the system in each of a plurality of temperature bands is determined.
摘要翻译：在系统中，记录温度测量。从记录的测量中，确定在多个温度带中的每一个中的系统的操作持续时间。

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