会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 26. 发明申请
    • Heat Sinking Pad and Printed Circuit Board
    • 散热垫和印刷电路板
    • US20150351284A1
    • 2015-12-03
    • US14442171
    • 2014-09-26
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Yue WUHongjun XIEYan RENZifeng WANG
    • H05K7/20H05K1/02
    • H05K7/20509H05K1/0203H05K1/0206H05K1/0209H05K2201/09663H05K2201/10969
    • The present invention relates to a heat sinking pad and a printed circuit board. The surface of the heat sinking pad on which electronic components are placed comprises a solder loading area and a solder non-loading area, wherein the solder loading area is used for being coated with solder; and the solder non-loading area comprises heat collection passages for collecting heat on the heat sinking pad and heat dissipation passages communicated with the heat collection passages. Openings of the heat dissipation passages are positioned at edges of the heat sinking pad so as to discharge the heat collected by the heat collection passages to the outside of the heat sinking pad. The heat dissipation to the edges of the heat sinking pad along the heat collection passages and the heat dissipation passages is faster than along the solder loading area, so the heat sinking pad has higher heat dissipation speed.
    • 本发明涉及散热垫和印刷电路板。 放置电子部件的散热垫的表面包括焊料加载区域和焊料非加载区域,其中焊料加载区域用于涂覆焊料; 并且无焊接区域包括用于在散热垫上收集热量的热收集通道和与集热通道连通的散热通道。 散热通道的开口位于散热垫的边缘处,以将由热量收集通道收集的热量排出到散热垫的外部。 散热垫沿着集热通道和散热通道的边缘的散热比沿着焊料加载区域的散热更快,所以散热垫具有较高的散热速度。