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21. 发明授权

US07541209B2 Method of forming a device package having edge interconnect pad 失效
标题翻译：形成具有边缘互连焊盘的器件封装的方法
公开(公告)号：US07541209B2
公开(公告)日：2009-06-02
申请号：US11251412
申请日：2005-10-14
申请人： Charles C Haluzak , Chien-Hua Chen , David M Craig
发明人： Charles C Haluzak , Chien-Hua Chen , David M Craig
IPC分类号： H01L21/00
CPC分类号： B81C1/00301 , B81B2207/092 , H05K3/3442 , H05K2201/10454 , H05K2201/1053 , Y02P70/613
摘要： A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.
摘要翻译：形成具有边缘互连焊盘的器件封装的方法包括形成覆盖至少一个电连接到下层的导电通孔的MEMS器件的阵列。该方法继续通过镶嵌工艺沉积与MEMS器件阵列共面的衬底上的导电材料，该导电材料耦合到至少一个导电通孔。该方法还包括用钝化层覆盖MEMS器件阵列和导电材料。

22. 发明申请

US20080280398A1 System And Method For Direct Bonding Of Substrates 失效
标题翻译：基板直接贴合的系统和方法
公开(公告)号：US20080280398A1
公开(公告)日：2008-11-13
申请号：US12177033
申请日：2008-07-21
申请人： Charles C. Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
发明人： Charles C. Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
IPC分类号： H01L21/50
CPC分类号： B81C1/00285 , B81B2201/042 , G02B26/0833
摘要： A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
摘要翻译：一种形成MEMS（微机电系统）的方法包括：通过限定在其中包含多个MEMS致动器的空腔的MEMS盖形成环境端口; 以及将盖装置结合到MEMS盖以密封环境端口。

23. 发明申请

US20080259125A1 MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME 有权
标题翻译：微流体装置和与其同时进行的流体喷射装置
公开(公告)号：US20080259125A1
公开(公告)日：2008-10-23
申请号：US11738654
申请日：2007-04-23
申请人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
发明人： Charles C. Haluzak , Chien-Hua Chen , Kirby Sand
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1637
摘要： A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second glass substrate is bonded to the second opposed surface of the first glass substrate whereby an outlet of a channel formed in the second glass substrate substantially aligns with the through slot. The channel of the second glass substrate has an inlet that is larger than the outlet.
摘要翻译：微流体装置包括粘合在一起的第一和第二玻璃基板。第一玻璃基板具有第一和第二相对表面。模具袋形成在第一相对表面中，并且通孔从模腔延伸到第二相对表面。第二玻璃基板被接合到第一玻璃基板的第二相对表面，由此形成在第二玻璃基板中的通道的出口基本上与通孔对准。第二玻璃基板的通道具有比出口大的入口。

24. 发明申请

US20080131101A1 Fan system and starting method thereof 有权
标题翻译：风机系统及其启动方法
公开(公告)号：US20080131101A1
公开(公告)日：2008-06-05
申请号：US11976424
申请日：2007-10-24
申请人： Chien-Hua Chen , Chin-Pin Wei , Wei-Shuo Tseng
发明人： Chien-Hua Chen , Chin-Pin Wei , Wei-Shuo Tseng
IPC分类号： H02P7/29
CPC分类号： F04D25/166 , F04D27/004
摘要： A fan system includes a connecting device, a controlling device and a fan device. The connecting device has a plurality of pins receiving at least one driving signal and a start signal. The control device is electrically connected to the pins of the connecting device and has a start control unit. The start control unit generates a first enabling signal in accordance with the start signal. The control device synchronously outputs the first enabling signal and the driving signal. The fan device is electrically connected to the control device and has a plurality of fans. The fan device synchronously transmits the driving signal to the fans and synchronously drives the fans to rotate in accordance with the first enabling signal.
摘要翻译：风扇系统包括连接装置，控制装置和风扇装置。连接装置具有接收至少一个驱动信号和起始信号的多个引脚。控制装置电连接到连接装置的销，并具有启动控制单元。启动控制单元根据起始信号生成第一使能信号。控制装置同步地输出第一使能信号和驱动信号。风扇装置电连接到控制装置并具有多个风扇。风扇装置将驱动信号同步传送到风扇，并根据第一使能信号同步驱动风扇旋转。

25. 发明授权

US07378785B2 Polarizing photonic band gap system with reflector 有权
标题翻译：偏振光子带隙系统与反射器
公开(公告)号：US07378785B2
公开(公告)日：2008-05-27
申请号：US10819158
申请日：2004-04-07
申请人： Chien-Hua Chen , Murali Chaparala , Robert Bicknell
发明人： Chien-Hua Chen , Murali Chaparala , Robert Bicknell
IPC分类号： H01J5/16
CPC分类号： G02B6/105 , B82Y20/00 , G02B6/1225 , G02F1/13362
摘要： A polarizing photonic band gap system has a photonic crystal emitter. The photonic crystal emitter has a crystal end surface. The photonic crystal emitter is configured to generate electromagnetic energy having a wavelength λ. The system has a polarizer. The polarizer is connected to the photonic crystal emitter. The polarizer has a polarizer surface. The polarizer surface is located within a distance of said crystal end surface. The distance is sufficient to quantum mechanically couple the polarizer surface with said crystal end surface at the wavelength λ.
摘要翻译：偏振光子带隙系统具有光子晶体发射极。光子晶体发射器具有晶体端面。光子晶体发射器被配置为产生具有波长λ的电磁能。该系统具有偏振器。偏振器连接到光子晶体发射器。偏振器具有偏振器表面。偏振器表面位于所述晶体端面的一定距离内。该距离足以量子力学地将偏振器表面与波长λ的所述晶体端面结合。

26. 发明授权

US07332411B2 Systems and methods for wafer bonding by localized induction heating 有权
标题翻译：通过局部感应加热晶圆接合的系统和方法
公开(公告)号：US07332411B2
公开(公告)日：2008-02-19
申请号：US10917123
申请日：2004-08-12
申请人： James McKinnell , Chien-Hua Chen , John Liebeskind , Ronald A Hellekson
发明人： James McKinnell , Chien-Hua Chen , John Liebeskind , Ronald A Hellekson
IPC分类号： H01L21/46 , H01L21/30 , H01L21/00 , H01L21/50 , H01L21/48 , H01L21/762
CPC分类号： B81C1/00269 , H01L21/187 , H01L21/50 , H01L23/13 , H01L23/147 , H01L24/29 , H01L24/83 , H01L2224/29111 , H01L2224/81234 , H01L2224/83805 , H01L2224/8385 , H01L2224/83894 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19042 , H05B6/105 , H01L2924/01014 , H01L2924/00 , H01L2924/00014
摘要： A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.
摘要翻译：使用局部感应加热的系统和方法接合晶片。一个或多个感应微加热器形成有待接合的第一衬底。第二基底定位成与感应微加热器紧密接触。产生交变磁场以诱导感应微加热器中的电流，以在第一基板和第二基板之间形成一个或多个键。

27. 发明授权

US07309467B2 Fluidic MEMS device 失效
标题翻译：流体MEMS器件
公开(公告)号：US07309467B2
公开(公告)日：2007-12-18
申请号：US10606023
申请日：2003-06-24
申请人： Chien-Hua Chen , Xia feng Yang
发明人： Chien-Hua Chen , Xia feng Yang
IPC分类号： B01L3/02 , B01L11/00 , B32B5/02 , B32B27/04 , B32B27/12
CPC分类号： F04B43/046 , B01D57/02 , B01D61/18 , B01D63/081 , B01D63/088 , B01D67/003 , B01D2323/30 , B01D2323/50 , B01D2325/08 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01J2219/00833 , B01J2219/00853 , B01J2219/00873 , B01J2219/00891 , B01J2219/00909 , B01J2219/00912 , B01J2219/00943 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L3/502753 , B01L7/525 , B01L2200/027 , B01L2200/10 , B01L2200/12 , B01L2300/0654 , B01L2300/0681 , B01L2300/1827 , B01L2400/0415 , B01L2400/0439 , B01L2400/0442 , B01L2400/0638 , B81B2201/058 , B81C1/00119 , F04B19/24 , G01N21/05 , G01N2021/0346 , Y10T436/11 , Y10T436/117497 , Y10T436/118339 , Y10T436/25 , Y10T436/25375 , Y10T436/2575
摘要： A fluidic micro electro-mechanical system (MEMS) device is described. In one aspect, at least one at least partially covered fluidic channel is formed between a polymer layer and a polymer substrate as the polymer layer is deposited on the substrate. The partially covered fluidic channel is fabricated as a unitary polymer layer structure. In one implementation, a strong exposure process is applied to the polymer layer to create a deep cross-linked polymer region. A weak exposure process is applied to the polymer layer to create a shallow cross-linked polymer region.
摘要翻译：描述了流体微机电系统（MEMS）装置。在一个方面，当聚合物层沉积在基底上时，在聚合物层和聚合物基底之间形成至少一个至少部分覆盖的流体通道。部分覆盖的流体通道被制造为单一的聚合物层结构。在一个实施方案中，将强烈的曝光工艺应用于聚合物层以产生深交联聚合物区域。将弱曝光工艺应用于聚合物层以产生浅交联聚合物区域。

28. 发明授权

US07300812B2 Micro electrical mechanical system 有权
标题翻译：微机电系统
公开(公告)号：US07300812B2
公开(公告)日：2007-11-27
申请号：US10976452
申请日：2004-10-29
申请人： Chien-Hua Chen , David M. Craig , Charles C. Haluzak
发明人： Chien-Hua Chen , David M. Craig , Charles C. Haluzak
IPC分类号： H01L21/00
CPC分类号： B81B7/007 , H01L2924/16235
摘要： This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.
摘要翻译：本公开涉及用于形成和使用它们的盖子和方法。这些盖子的一个实施例使得由盖子保护的MEMS更小。这些盖子中的另一个使得能够测试一组结合的有盖MEMS。此外，还公开了用于形成和使用这些盖的方法。这些过程中的一个从位于组件MEMS上的盖子前体形成盖子。

29. 发明申请

US20070128828A1 Micro electro-mechanical system packaging and interconnect 有权
标题翻译：微机电系统封装和互连
公开(公告)号：US20070128828A1
公开(公告)日：2007-06-07
申请号：US11192945
申请日：2005-07-29
申请人： Chien-Hua Chen , John Bamber , Henry Kang
发明人： Chien-Hua Chen , John Bamber , Henry Kang
IPC分类号： H01L21/30
CPC分类号： B81C3/002
摘要： A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.
摘要翻译：微电子机械系统（MEMS）装置包括电晶片，机械晶片，将电晶片结合到机械晶片的等离子体处理的氧化物密封，以及电晶片和机械晶片之间的电互连。

30. 发明申请

US20070087462A1 Method of forming a device package having edge interconnect pad 失效
标题翻译：形成具有边缘互连焊盘的器件封装的方法
公开(公告)号：US20070087462A1
公开(公告)日：2007-04-19
申请号：US11251412
申请日：2005-10-14
申请人： Charles Haluzak , Chien-Hua Chen , David Craig
发明人： Charles Haluzak , Chien-Hua Chen , David Craig
IPC分类号： H01L21/00
CPC分类号： B81C1/00301 , B81B2207/092 , H05K3/3442 , H05K2201/10454 , H05K2201/1053 , Y02P70/613
摘要： A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.
摘要翻译：形成具有边缘互连焊盘的器件封装的方法包括形成覆盖至少一个电连接到下层的导电通孔的MEMS器件的阵列。该方法继续通过镶嵌工艺沉积与MEMS器件阵列共面的衬底上的导电材料，该导电材料耦合到至少一个导电通孔。该方法还包括用钝化层覆盖MEMS器件阵列和导电材料。

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