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21. 发明授权

US08668366B2 Energy star compliant LED lamp 有权
标题翻译：符合能源之星的LED灯
公开(公告)号：US08668366B2
公开(公告)日：2014-03-11
申请号：US13313153
申请日：2011-12-07
申请人： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
发明人： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
IPC分类号： F21V7/00
CPC分类号： F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
摘要： The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
摘要翻译：本公开提供一种照明装置。照明装置包括盖结构。盖结构部分地涂覆有可反射光的反射材料。照明装置包括设置在盖结构内的一个或多个发光装置。发光装置可以是发光二极管（LED）芯片。照明装置还包括散热结构。散热结构在第一方向上连接到盖结构。散热结构和盖结构具有耦合接口。联接接口在基本上垂直于第一方向的第二方向上延伸。散热结构具有以一定角度与耦合接口相交的部分。根据一些实施例，该角度在约60度至约90度的范围内。

22. 发明授权

US08414160B2 LED lamp and method of making the same 有权
标题翻译： LED灯及其制作方法
公开(公告)号：US08414160B2
公开(公告)日：2013-04-09
申请号：US13158962
申请日：2011-06-13
申请人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
发明人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21K9/232 , F21K9/90 , F21V3/02 , F21Y2101/00 , F21Y2115/10 , Y10T29/49002
摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.
摘要翻译：照明装置包括具有朝向外侧的中心部分的小面的多面散热器。小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。照明装置还具有安装有半导体发射体的多个电路板。每个电路板安装在散热器的相应面上。所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件模块。

23. 发明授权

US08669722B2 Color temperature adjustment for LED lamps using switches 有权
标题翻译：使用开关的LED灯的色温调节
公开(公告)号：US08669722B2
公开(公告)日：2014-03-11
申请号：US13209327
申请日：2011-08-12
申请人： Wei-Yu Yeh , Chih-Hsuan Sun
发明人： Wei-Yu Yeh , Chih-Hsuan Sun
IPC分类号： H05B37/00 , H05B39/00 , H05B41/00 , H05B37/02 , H05B39/04 , H05B41/36 , G05F1/00 , G01J5/60
CPC分类号： H05B33/0863 , H05B33/0824 , H05B33/0869
摘要： A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.
摘要翻译：发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。用户或控制器可以调节灯输出的光的色温。色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。

24. 发明授权

US08507328B2 Systems and methods providing semiconductor light emitters 有权
公开(公告)号：US08507328B2
公开(公告)日：2013-08-13
申请号：US13117320
申请日：2011-05-27
申请人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： H01L21/20
CPC分类号： H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

25. 发明申请

US20120201007A1 SYSTEMS AND METHODS PROVIDING THERMAL SPREADING FOR AN LED MODULE 有权
标题翻译：为LED模块提供热扩散的系统和方法
公开(公告)号：US20120201007A1
公开(公告)日：2012-08-09
申请号：US13024017
申请日：2011-02-09
申请人： Wei-Yu Yeh , Chih-Hsuan Sun
发明人： Wei-Yu Yeh , Chih-Hsuan Sun
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： F21V29/20 , F21K9/20 , F21V29/70 , F21V29/763 , F21Y2103/10 , F21Y2115/10 , H05K1/0203 , H05K1/056 , H05K1/111 , H05K3/0061 , H05K2201/066 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.
摘要翻译：发光二极管（LED）模块包括具有前侧和后侧的电路板，耦合到电路板的背面的散热器，设置在电路板的前侧的散热垫，设置在LED 在电路板的正面。 LED与散热垫热接触。模块还包括放置在热垫上并与热垫热接触的散热装置。

26. 发明申请

US20130106297A1 THERMAL PROTECTION STRUCTURE FOR MULTI-JUNCTION LED MODULE 有权
标题翻译：多功能LED模块的热保护结构
公开(公告)号：US20130106297A1
公开(公告)日：2013-05-02
申请号：US13287171
申请日：2011-11-02
申请人： Wei-Yu Yeh
发明人： Wei-Yu Yeh
IPC分类号： H05B37/02
CPC分类号： H05B33/089 , H05B33/0851 , Y02B20/341
摘要： The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.
摘要翻译：本公开公开了一种用于热保护LED装置的装置。该装置包括基板。该装置包括设置在基板上的多个发光装置。所述多个发光器件中的所选择的一个至少部分地被所述多个发光器件的其余部分包围。该装置包括电耦合到所选择的发光装置的反馈机构。反馈机构可操作以检测所选择的发光装置的温度变化。反馈机构还可操作以响应于检测到的温度变化而调节通过至少所选择的发光器件的电流。

27. 发明授权

US08899787B2 Thermal protection structure for multi-junction LED module 有权
标题翻译：多结LED模块的热保护结构
公开(公告)号：US08899787B2
公开(公告)日：2014-12-02
申请号：US13287171
申请日：2011-11-02
申请人： Wei-Yu Yeh
发明人： Wei-Yu Yeh
IPC分类号： F21V27/00 , H05B33/08
CPC分类号： H05B33/089 , H05B33/0851 , Y02B20/341
摘要： The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.
摘要翻译：本公开公开了一种用于热保护LED装置的装置。该装置包括基板。该装置包括设置在基板上的多个发光装置。所述多个发光器件中的所选择的一个至少部分地被所述多个发光器件的其余部分包围。该装置包括电耦合到所选择的发光装置的反馈机构。反馈机构可操作以检测所选择的发光装置的温度变化。反馈机构还可操作以响应于检测到的温度变化而调节通过至少所选择的发光器件的电流。

28. 发明授权

US08801228B2 Changing LED light output distribution through coating configuration 有权
标题翻译：通过涂层配置改变LED光输出分布
公开(公告)号：US08801228B2
公开(公告)日：2014-08-12
申请号：US13420927
申请日：2012-03-15
申请人： Dong Jung Suen , Chih-Hsun Sun , Wei-Yu Yeh , Hsueh-Hung Fu
发明人： Dong Jung Suen , Chih-Hsun Sun , Wei-Yu Yeh , Hsueh-Hung Fu
IPC分类号： F21V9/16 , F21K99/00 , H01L33/50 , F21V3/04
CPC分类号： F21K9/56 , F21K9/64 , F21V3/049 , F21V3/10 , F21V7/005 , F21V29/673 , F21Y2115/10 , H01L33/504 , Y10T29/49002
摘要： The present disclosure provides a lighting instrument. The lighting instrument includes a recessed light fixture, for example a troffer light or a batten light. The light fixture includes a plurality of light-emitting diode (LED) devices located on a board. The light fixture also includes a diffuser cap located on the board and housing the LED devices therein. The diffuser cap includes a plurality of coating regions. Each coating region is coated by a film containing white particles. The white particles can reflect and diffuse light emitted by the LED devices. The film in each coating region has a different white particle concentration level than other coating regions.
摘要翻译：本公开提供了一种照明器具。照明器具包括凹入的灯具，例如灯光或灯条灯。灯具包括位于板上的多个发光二极管（LED）装置。灯具还包括位于板上的扩散器帽，并将LED器件容纳在其中。扩散器盖包括多个涂覆区域。每个涂层区域被含有白色颗粒的膜包覆。白色颗粒可以反射和漫射由LED器件发出的光。每个涂层区域中的膜具有与其它涂覆区域不同的白色颗粒浓度水平。

29. 发明申请

US20130107549A1 LED MODULE AND METHOD OF BONDING THEREOF 有权
标题翻译： LED模块及其连接方法
公开(公告)号：US20130107549A1
公开(公告)日：2013-05-02
申请号：US13286562
申请日：2011-11-01
申请人： Wei-Yu Yeh
发明人： Wei-Yu Yeh
IPC分类号： F21V29/00 , B23K20/10
CPC分类号： F21V19/005 , B23K20/002 , B23K20/10 , B23K2101/36 , F21V29/70 , H01L2924/0002 , H05K1/0203 , H05K1/05 , H05K3/0061 , H05K2201/10106 , H05K2203/0285 , H01L2924/00
摘要： The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).
摘要翻译：本公开提供了一种包括提供发光二极管（LED）装置（例如，LED元件和PCB）和散热器的方法。 LED器件通过施加超声波能量而与散热器接合。在一个实施方案中，键合可以形成包含铜和铝的键。 PCB可以是金属芯PCB（MC-PCB）。

30. 发明授权

US09293447B2 LED thermal protection structures 有权
标题翻译： LED热保护结构
公开(公告)号：US09293447B2
公开(公告)日：2016-03-22
申请号：US13353572
申请日：2012-01-19
申请人： Wei-Yu Yeh
发明人： Wei-Yu Yeh
IPC分类号： H05B37/02 , H01L33/64 , H01L25/16 , H05B33/08
CPC分类号： H01L25/167 , H01L33/64 , H01L2924/0002 , H05B33/089 , Y02B20/341 , H01L2924/00
摘要： The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. A light-emitting device disposed on a first region of the substrate. The apparatus includes a thermistor disposed on a second region of the substrate. The second region is substantially spaced apart from the first region. The thermistor is thermally and electrically coupled to the light-emitting device. The present disclosure also discloses a method of thermally protecting an LED device. The method includes providing a substrate having a light-emitting diode (LED) die disposed thereon. The method includes detecting a temperature of the LED die using a negative temperature coefficient (NTC) thermistor. The NTC thermistor is positioned on a region of the substrate substantially away from the LED die. The method includes adjusting an electrical current of the LED die in response to the detecting.
摘要翻译：本公开公开了一种用于热保护LED装置的装置。该装置包括基板。 1.一种发光器件，其设置在所述基板的第一区域上。该装置包括设置在基板的第二区域上的热敏电阻。第二区域与第一区域基本间隔开。热敏电阻热电耦合到发光器件。本公开还公开了一种热保护LED器件的方法。该方法包括提供具有设置在其上的发光二极管（LED）裸片的衬底。该方法包括使用负温度系数（NTC）热敏电阻检测LED管芯的温度。 NTC热敏电阻位于基板远离LED管芯的区域上。该方法包括响应于检测来调整LED管芯的电流。

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