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    • 28. 发明申请
    • Magnetic Tunnel Junction for MRAM applications
    • MRAM应用的磁隧道结
    • US20120181537A1
    • 2012-07-19
    • US12930877
    • 2011-01-19
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • H01L29/82H01L21/36H01L29/04
    • H01L43/10G11C11/161H01L27/222H01L43/00H01L43/02H01L43/08
    • A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FeB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic %. NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiment, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
    • 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FeB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%的Mg,Hf,Zr,Nb或Ta。 NiFeX厚度优选在20至40埃之间,以显着减少位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。
    • 30. 发明授权
    • Magnetic tunnel junction for MRAM applications
    • 用于MRAM应用的磁隧道结
    • US08786036B2
    • 2014-07-22
    • US12930877
    • 2011-01-19
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • H01L43/10H01L27/22
    • H01L43/10G11C11/161H01L27/222H01L43/00H01L43/02H01L43/08
    • A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FEB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic % NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiments, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
    • 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FEB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%NiFeX厚度的Mg,Hf,Zr,Nb或Ta优选为20〜40埃,以显着降低位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。