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    • 22. 发明授权
    • Low voltage CMOS amplifier
    • 低电压CMOS放大器
    • US4264874A
    • 1981-04-28
    • US872281
    • 1978-01-25
    • William R. Young
    • William R. Young
    • H03F1/30H03F3/16
    • H03F1/301
    • A CMOS amplifier having a pair of CMOS load and amplifying devices connected in series, two parallel pairs of CMOS devices with interconnected gates to form current mirrors and connected to the gate of the load MOS device to compensate the gain for variations in power supply voltage, temperature and transistor parameters, a feedback MOS device having its source-drain path connected between the junction of the load and amplifying MOS and the gate of the amplifying MOS to provide nonlinear, negative feedback, and a resistor connected in parallel with the feedback MOS device to establish an initial self-biasing voltage level for the amplifying MOS below the threshold voltage of the feedback MOS.
    • 具有串联连接的一对CMOS负载和放大装置的CMOS放大器,具有互连栅极的两个并联的CMOS器件对以形成电流镜并连接到负载MOS器件的栅极,以补偿电源电压变化的增益, 温度和晶体管参数,其源极 - 漏极路径连接在负载和放大MOS的结点与放大MOS的栅极之间以提供非线性负反馈的反馈MOS器件和与反馈MOS器件并联连接的电阻器 以建立低于反馈MOS的阈值电压的放大MOS的初始自偏置电压电平。
    • 23. 发明授权
    • Method for improving a property of an alloy
    • 提高合金性能的方法
    • US4249963A
    • 1981-02-10
    • US59796
    • 1979-07-23
    • William R. Young
    • William R. Young
    • C22C1/00B23K35/30C21D3/00C22C3/00C23F1/12C21D1/74C22F1/02
    • B23K35/38B23K35/30C21D3/00C23F1/12
    • A property, such as ductility, mechanical strength and increased remelt temperature, of an alloy, for example one which includes an element such as Si or B, or both, is improved by depletion of such an element through the alloy surface. This is accomplished by exposing the alloy surface, one common form of which is a brazing alloy, to gaseous ions such as fluoride ions, while heating the alloy at a temperature which is not detrimental to the alloy or members associated with the alloy. Heating is conducted for a time sufficient for such elements, for example those selected from Si and B, included as a melting point depressant, to diffuse to the surface of the alloy and to react with the gaseous ions to form a gaseous compound of the element. Such gaseous compound then separates from the surface, thereby depleting the alloy of the element and improving at least one property.
    • 通过合金表面的这种元素的消耗,可以改善合金例如包括诸如Si或B的元素或两者的合金的延展性,机械强度和增加的熔融温度的性质。 这是通过将合金表面(其一种常见形式是钎焊合金)暴露于诸如氟离子的气态离子而实现的,同时在对合金或与合金相关的构件不利的温度下加热合金。 进行加热进行足够的时间,这些元素例如包括作为熔点降低剂的Si和B元素扩散到合金表面并与气态离子反应以形成元素的气态化合物 。 这样的气体化合物然后与表面分离,从而消耗元素的合金并改善至少一种性质。
    • 26. 发明授权
    • Integrated circuit air bridge structures and methods of fabricating same
    • 集成电路空气桥结构及其制造方法
    • US06492705B1
    • 2002-12-10
    • US08658010
    • 1996-06-04
    • Patrick A. BegleyWilliam R. YoungAnthony L. RivoliJose Avelino DelgadoStephen J. Gaul
    • Patrick A. BegleyWilliam R. YoungAnthony L. RivoliJose Avelino DelgadoStephen J. Gaul
    • H01L2900
    • H01L28/10H01L21/7682H01L23/5221H01L2924/0002H01L2924/00
    • Airbridge structures and processes for making air bridge structures and integrated circuits are disclosed. One airbridge structure has metal conductors 24 encased in a sheath of dielectric material 249. The conductors extend across a cavity 244 and a semiconductor substrate 238. In one embodiment, the conductors traversing the cavity 244 are supported by posts 248 that extend from the substrate. In another embodiment, oxide posts 258 extend from the substrate to support the conductors. In another embodiment, trenches 101 are made in a device substrate 110 bonded to a handle substrate 100. The trenches are filled with a dielectric and a conductor pattern is formed over the filled trenches. The substrate material between the conductors is then removed to leave a pattern of posts 116, 114, 112 that included dielectrically encased conductors 106. In another bonded wafer embodiment, conductors 204 are encased in a dielectric above a sacrificial device region. The device region is isolated by suitably filled trenches. Vias 224, 226 in the dielectric 205 allow removal of the substrate material to form a cavity 208 beneath the conductors 204. Other embodiments included a conductor 42 encased in dielectric that is formed above a region from which sacrificial polysilicon is removed to form a cavity 66. It is still another embodiment the conductor 42 is enclosed in a dielectric above a cavity 66a from which device material is removed.
    • 公开了用于制造空气桥结构和集成电路的空中桥梁结构和工艺。 一个空中桥结构具有包裹在电介质材料249的护套中的金属导体24.导体延伸穿过空腔244和半导体衬底238.在一个实施例中,穿过空腔244的导体由从衬底延伸的柱248支撑。 在另一个实施例中,氧化物柱258从衬底延伸以支撑导体。在另一个实施例中,沟槽101被制成接合到手柄衬底100的器件衬底110.沟槽填充有电介质,并且导体图案形成在 填充的沟槽。 然后去除导体之间的衬底材料以留下包括介电封装的导体106的柱116,114,112的图案。在另一个接合晶片实施例中,导体204被封装在牺牲器件区域之上的电介质中。 器件区域由适当填充的沟槽隔离。 电介质205中的通孔224,226允许去除衬底材料以在导体204下方形成空腔208.其它实施例包括封装在电介质中的导体42,导电体42形成在除去牺牲多晶硅以形成空腔66的区域之上 还有另一个实施例,导体42封闭在空腔66a之上的电介质中,器件材料从该空腔中被去除。
    • 27. 发明授权
    • Driver circuit having load-independent slew rate
    • 驱动电路具有负载独立的转换速率
    • US06172541B2
    • 2001-01-09
    • US09152420
    • 1998-09-14
    • William R. YoungStuart W. Pullen
    • William R. YoungStuart W. Pullen
    • H03K512
    • H04L25/028H03K19/00361H03K19/00384
    • Load-monitoring feedback is used to maintain the slew rate of a line driver circuit at a prescribed rate that is independent of the effective load of the line being driven. This load-monitoring feedback control makes it possible to drive the line with an amplified output signal that faithfully tracks the input signal and conforms with prescribed slew rate and rise/fall time specifications, irrespective of characteristics of the signal line, which may vary over a specified range of component values. In a first embodiment, slew rate control is effected by increasing or decreasing the amount of charge on a reference capacitor and thereby the drive current to an output driver FET, in accordance with the change in state of the output of an output terminal-monitoring voltage threshold comparator relative to termination of a prescribed (one-shot established) time window. In a second embodiment, slew rate control is effected by directly determining the length of time required for the output terminal to transition between first and second states, and adjusting the operation of the output driver FET based on whether the total time measurement is equal to, greater than or less than the slew rate window.
    • 负载监控反馈用于将线路驱动电路的转换速率保持在与驱动线路的有效负载无关的规定速率。 该负载监测反馈控制使得可以用放大的输出信号来驱动线路,该放大的输出信号忠实地跟踪输入信号并且符合规定的转换速率和上升/下降时间规范,而与信号线的特性无关,其可以在一个 指定范围的组件值。 在第一实施例中,通过根据输出端子监视电压的输出状态的变化来增加或减少参考电容器上的电荷量,从而提供到输出驱动器FET的驱动电流来实现转换速率控制 阈值比较器相对于规定(一次建立)时间窗口的终止。 在第二实施例中,通过直接确定输出端子在第一和第二状态之间转变所需的时间长度以及基于总时间测量是否等于调整输出驱动器FET的操作来实现压摆率控制, 大于或小于压摆率窗口。