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    • 23. 发明授权
    • Reconfigurable semiconductor device
    • 可重构半导体器件
    • US08350602B2
    • 2013-01-08
    • US13089206
    • 2011-04-18
    • Seunghun HongSung MyungKwang Heo
    • Seunghun HongSung MyungKwang Heo
    • H03K3/01
    • H01L29/7883B82Y10/00H01L21/28273H01L29/42328H01L29/42332H01L29/7887
    • A reconfigurable semiconductor device is disclosed. The semiconductor device includes a substrate, a first insulating material formed on the substrate, two channels having different polarities, a plurality of terminal electrodes formed on the insulating material and coupled in common with the channels at their opposite ends, a second insulating material formed on the terminal electrodes, and a control gate formed on the second insulating material. The channels have different polarity and a charge storage layer is formed inside the second insulating material. The control gate is applied with a forward bias or a reverse bias and then the bias is cut off. The voltage-current characteristics of the semiconductor device are changed according to an electrical charge created in the charge storage layer.
    • 公开了可重新配置的半导体器件。 该半导体器件包括基板,形成在基板上的第一绝缘材料,具有不同极性的两个通道,形成在绝缘材料上的多个端子电极,并在其相对端与通道共同地连接,第二绝缘材料形成在 端子电极和形成在第二绝缘材料上的控制栅极。 通道具有不同的极性,并且在第二绝缘材料内形成电荷存储层。 控制栅极被施加正向偏压或反向偏压,然后偏压被切断。 半导体器件的电压 - 电流特性根据在电荷存储层中产生的电荷而改变。
    • 24. 发明授权
    • Reconfigurable semiconductor device
    • 可重构半导体器件
    • US07968935B2
    • 2011-06-28
    • US12197961
    • 2008-08-25
    • Seunghun HongSung MyungKwang Heo
    • Seunghun HongSung MyungKwang Heo
    • H01L29/792H01L21/28
    • H01L29/7883B82Y10/00H01L21/28273H01L29/42328H01L29/42332H01L29/7887
    • A reconfigurable semiconductor device is disclosed. The semiconductor device includes a substrate, a first insulating material formed on the substrate, two channels having different polarities, a plurality of terminal electrodes formed on the insulating material and coupled in common with the channels at their opposite ends, a second insulating material formed on the terminal electrodes, and a control gate formed on the second insulating material. The channels have different polarity and a charge storage layer is formed inside the second insulating material. The control gate is applied with a forward bias or a reverse bias and then the bias is cut off. The voltage-current characteristics of the semiconductor device are changed according to an electrical charge created in the charge storage layer.
    • 公开了可重新配置的半导体器件。 该半导体器件包括基板,形成在基板上的第一绝缘材料,具有不同极性的两个通道,形成在绝缘材料上的多个端子电极,并在其相对端与通道共同地连接,第二绝缘材料形成在 端子电极和形成在第二绝缘材料上的控制栅极。 通道具有不同的极性,并且在第二绝缘材料内形成电荷存储层。 控制栅极被施加正向偏压或反向偏压,然后偏压被切断。 半导体器件的电压 - 电流特性根据在电荷存储层中产生的电荷而改变。
    • 25. 发明申请
    • RECONFIGURABLE SEMICONDUCTOR DEVICE
    • 可重构半导体器件
    • US20100044777A1
    • 2010-02-25
    • US12197961
    • 2008-08-25
    • Seunghun HongSung MyungKwang Heo
    • Seunghun HongSung MyungKwang Heo
    • H01L29/792H01L21/28
    • H01L29/7883B82Y10/00H01L21/28273H01L29/42328H01L29/42332H01L29/7887
    • A reconfigurable semiconductor device is disclosed. The semiconductor device includes a substrate, a first insulating material formed on the substrate, two channels having different polarities, a plurality of terminal electrodes formed on the insulating material and coupled in common with the channels at their opposite ends, a second insulating material formed on the terminal electrodes, and a control gate formed on the second insulating material. The channels have different polarity and a charge storage layer is formed inside the second insulating material. The control gate is applied with a forward bias or a reverse bias and then the bias is cut off. The voltage-current characteristics of the semiconductor device are changed according to an electrical charge created in the charge storage layer.
    • 公开了可重新配置的半导体器件。 该半导体器件包括基板,形成在基板上的第一绝缘材料,具有不同极性的两个通道,形成在绝缘材料上的多个端子电极,并在其相对端与通道共同地连接,第二绝缘材料形成在 端子电极和形成在第二绝缘材料上的控制栅极。 通道具有不同的极性,并且在第二绝缘材料内形成电荷存储层。 控制栅极被施加正向偏压或反向偏压,然后偏压被切断。 半导体器件的电压 - 电流特性根据在电荷存储层中产生的电荷而改变。
    • 30. 发明申请
    • RECONFIGURABLE SEMICONDUCTOR DEVICE
    • 可重构半导体器件
    • US20110210765A1
    • 2011-09-01
    • US13089206
    • 2011-04-18
    • Seunghun HongSung MyungKwang Heo
    • Seunghun HongSung MyungKwang Heo
    • H03K3/01
    • H01L29/7883B82Y10/00H01L21/28273H01L29/42328H01L29/42332H01L29/7887
    • A reconfigurable semiconductor device is disclosed. The semiconductor device includes a substrate, a first insulating material formed on the substrate, two channels having different polarities, a plurality of terminal electrodes formed on the insulating material and coupled in common with the channels at their opposite ends, a second insulating material formed on the terminal electrodes, and a control gate formed on the second insulating material. The channels have different polarity and a charge storage layer is formed inside the second insulating material. The control gate is applied with a forward bias or a reverse bias and then the bias is cut off. The voltage-current characteristics of the semiconductor device are changed according to an electrical charge created in the charge storage layer.
    • 公开了可重新配置的半导体器件。 该半导体器件包括基板,形成在基板上的第一绝缘材料,具有不同极性的两个通道,形成在绝缘材料上的多个端子电极,并在其相对端与通道共同地连接,第二绝缘材料形成在 端子电极和形成在第二绝缘材料上的控制栅极。 通道具有不同的极性,并且在第二绝缘材料内形成电荷存储层。 控制栅极被施加正向偏压或反向偏压,然后偏压被切断。 半导体器件的电压 - 电流特性根据在电荷存储层中产生的电荷而改变。