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    • 25. 发明申请
    • SUBSTRATE FITTING PROCESS AND SUBSTRATE ASSEMBLY TO BE FITTED
    • 基板接合工艺和基板组件装配
    • US20150293386A1
    • 2015-10-15
    • US14488134
    • 2014-09-16
    • BOE TECHNOLOGY GROUP CO., LTD.BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Ang XIAOSunghun SONGXu CHEN
    • G02F1/1339G02F1/1333B32B3/02
    • G02F1/1339B32B3/02B32B3/085B32B2307/558B32B2307/714B32B2457/202G02F2001/133354G02F2001/133388
    • The present invention provides a substrate fitting process and a substrate assembly to be fitted, wherein the substrate assembly to be fitted of the present invention, a periphery mold frame is disposed on a surface of a substrate, a cell mold frame is disposed inside said periphery mold frame, the height of said cell mold frame is larger than the height of said periphery mold frame. A substrate fitting process of the present invention comprises: providing a cell mold frame on a surface of a first substrate, providing a cell mold frame inside the periphery mold frame for sealing liquid crystal, the height of said cell mold frame is larger than the height of the periphery mold frame; extracting the air between the first substrate and the second substrate; making the first substrate fit with the second substrate preliminarily; filling the air between the first substrate and the second substrate; making the first substrate further fit with the second substrate. With the technical solution of the present invention, the puncture caused by the impact of the in-cell liquid crystal onto the cell mold frame is prevented, and the time and the costs of the process is decreased, meanwhile the probability of the circuit metal wire and the component switch on the liquid crystal panel suffering corrode of the thinning acid is decreased.
    • 本发明提供了一种基板装配工艺和一种待安装的基板组件,其中本发明的待安装的基板组件,一个周边模架被设置在基板的表面上,一个单元模架被设置在所述周边 模具框架,所述单元模具框架的高度大于所述周边模架的高度。 本发明的基板装配工艺包括:在第一基板的表面上设置电池模架,在周边模架内设置用于密封液晶的电池模架,所述电池模架的高度大于高度 的周边模架; 提取第一基板和第二基板之间的空气; 使第一衬底预先与第二衬底配合; 填充第一基板和第二基板之间的空气; 使得第一衬底进一步与第二衬底配合。 利用本发明的技术方案,可以防止由于单元内液晶冲击到电池模架而造成的穿孔,并且降低了处理的时间和成本,同时电路金属线的概率 并且在薄化酸腐蚀的液晶面板上的部件开关减少。