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    • 23. 发明授权
    • Method of forming a semiconductor array of floating gate memory cells and strap regions
    • 形成浮栅存储器单元和带区域的半导体阵列的方法
    • US06773974B2
    • 2004-08-10
    • US10406917
    • 2003-04-04
    • Chih Hsin WangAmitay Levi
    • Chih Hsin WangAmitay Levi
    • H01L218238
    • H01L27/11521H01L27/115
    • A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate, along with strap regions interlaced within the array. The array includes word lines and source lines that connect together control gates and source regions from memory cells contained in row within the array. The strap regions include word line strap cells through which the word lines traverse, wherein the word lines completely traverse across the strap regions, and source line strap cells in which the source lines terminate without completely traversing across the strap region. A first plurality of conductive metal contacts are each connected to one of the word lines in one of the word line strap cells. A second plurality of conductive metal contacts are each connected to one of the source lines in one of the source line strap cells.
    • 一种在半导体衬底中形成浮动栅极存储单元的半导体存储器阵列的自对准方法,以及在阵列内交错的带区域。 该阵列包括字符串和源极线,其将控制栅极和源区域连接在阵列内的行中包含的存储器单元中。 带区域包括字线条带单元,字线穿过该单元线,其中字线完全穿过带区域,以及源极线束带单元,其中源极线终止,而不完全穿过带区域。 第一多个导电金属触点各自连接到一个字线条带单元中的一条字线。 第二多个导电金属触点各自连接到源极线束带单元之一中的源极线之一。
    • 26. 发明授权
    • Non-volatile memory cell with buried select gate, and method of making same
    • 具有埋选择栅极的非易失性存储单元及其制造方法
    • US07851846B2
    • 2010-12-14
    • US12327114
    • 2008-12-03
    • Nhan DoHieu V. TranAmitay Levi
    • Nhan DoHieu V. TranAmitay Levi
    • H01L29/788H01L21/28
    • H01L29/42328H01L27/11521H01L29/42336H01L29/7885
    • A memory device, and method of making the same, in which a trench is formed into the surface of a semiconductor substrate. Source and drain regions define a channel region there between. The drain is formed under the trench. The channel region includes a first portion that extends along a bottom wall of the trench, a second portion that extends along a sidewall of the trench, and a third portion that extends along the surface of the substrate. The floating gate is disposed over the channel region third portion. The control gate is disposed over the floating gate. The select gate is at least partially disposed in the trench and adjacent to the channel region first and second portions. The erase gate disposed adjacent to and insulated from the floating gate.
    • 一种存储器件及其制造方法,其中沟槽形成在半导体衬底的表面中。 源区和漏区定义其间的通道区。 漏极形成在沟槽下方。 沟道区域包括沿着沟槽的底壁延伸的第一部分,沿着沟槽的侧壁延伸的第二部分和沿着衬底的表面延伸的第三部分。 浮动栅极设置在沟道区域第三部分上。 控制栅极设置在浮动栅上。 选择栅极至少部分地设置在沟槽中并且邻近沟道区第一和第二部分。 擦除栅极邻近并与浮栅隔绝。
    • 28. 发明授权
    • Method of planarizing a semiconductor die
    • US06703318B1
    • 2004-03-09
    • US10423270
    • 2003-04-25
    • Amitay LeviGian Sharma
    • Amitay LeviGian Sharma
    • H01L21302
    • H01L21/31055H01L21/31053
    • A method of CMP planarizing a silicon dioxide layer on a silicon nitride in the semiconductor die is disclosed. A wafer has a plurality substantially identical semiconductor dies defined on the wafer. Each of the dies is separated from one another by a scribe line. A layer of silicon nitride is formed on the planar surface of the wafer where the silicon nitride has a top surface which is substantially parallel to the planar surface. A layer of silicon dioxide is deposited on the top surface with the silicon dioxide varying in height above the top surface. A mask is formed across the wafer, including on the scribe line, where the mask has a plurality of locations with each location having a differing density of gap-to-pillar ratio, which is proportional to the height of the silicon dioxide above the top surface. The silicon dioxide is anisotropically etched through each gap of the mask across the entire wafer where each gap is etched by the same amount in the height direction. CMP is then used to planarize the silicon dioxide to the top surface of the silicon nitride across the entire wafer.