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21. 发明专利

JPS63278263A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63278263A
公开(公告)日：1988-11-15
申请号：JP597687
申请日：1987-01-16
申请人： HITACHI LTD
发明人： YAMAGUCHI TOSHIO , MORITA MASAYUKI , KOJIMA KAZUO , OTSUKA KENICHI
IPC分类号： H01L23/50 , H05K1/18 , H05K3/34
摘要： PURPOSE:To enhance the soldering performance of a semiconductor device by a method wherein a solder film applied to the neighborhood of each curved end part of a lead is flattened at the curved end part. CONSTITUTION:Each of two or more leads 5 which have been formed by protruding from four side faces of a package 2 is curved to be J-shaped toward a direction of the rear of the package 2. Solder films 1 are applied to the neighborhood of curved end parts. Flat faces 1a are formed on the solder films 1 in such a way that, when this package 2 is placed on a board 8, the individual leads 5 come into contact with the surface of the board 8 uniformly at these curved end parts. In order to form the flat faces 1a at the solder films 1, the package 2 is placed, e.g., on a grindstone whose surface is flat and is ground. By this setup, the soldering performance of a semiconductor device is enhanced when the device is mounted on the board.

22. 发明专利

JPH10229145A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH10229145A
公开(公告)日：1998-08-25
申请号：JP3003697
申请日：1997-02-14
申请人： HITACHI LTD
发明人： RI AKIRA , SHIMIZU KAZUO , OTSUKA KENICHI
IPC分类号： H01L23/28 , H01L23/50 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To make it possible to prevent occurrence of a soldering failure in outer leads while the width of the pitch between the outer leads is maintained to a reduction in the area of a package, by a method wherein the resin-sealed plane shape of the package is formed into a diamond shape. SOLUTION: A semiconductor device 11 is constituted into a structure, wherein a semiconductor pellet 13 is sealed with an epoxy resin which is used as a package body 12, and the visual appearance of the device 11 is one of the shape of a dual inline package having leads 14, which are used as external electrodes, in two directions. The leads 14 are formed so as to extend vertically to the surface of a resin sealing material on the body 12 and the plate width of inner leads 14a is formed narrow on the side of the pellet 13. The plane shape of the body 12 is formed into a diamond shape, and when the acute angle of the diamond shape is assumed 45 deg., for example, 71% of a reduction becomes possible in the same perimeter as that of a square. Accordingly, as the length of the sides of the diamond shape becomes long as compared with the same area as that of the square, solder bridges in outer leads can be eliminated.

23. 发明专利

JPH1053294A CONTAINING BODY FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1053294A
公开(公告)日：1998-02-24
申请号：JP20736196
申请日：1996-08-06
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI KAZUYA , ENOMOTO USUKE , OTSUKA KENICHI
IPC分类号： B65D85/86 , H05K13/02
摘要： PROBLEM TO BE SOLVED: To prevent damage to inner cases and a semiconductor device, by providing an inner case for fractions having the same external size with the external size of the inner cases. SOLUTION: A containing body for a semiconductor device contains nine inner-cases in the outer case. The outer case 1 and the inner case 2 are made of a rectangular parallelepiped corrugated cardboard cases and the upper sides are opened. The height of the external dimensions of the inner cases is made one/an integer of the inner dimension of the outer case. The lateral width of the external dimension of the inner case 2 is made one/an integer of the lateral width of the inner dimension of the outer case 1. The longitudinal width of the outer dimension of the inner case 2 is made one/an integer of the longitudinal width of the inner dimension of the outer case 1. That is, the external dimension of the inner case 2 is made one/an integer of the inner dimension of the outer case 1. In this way, when the inner case 2 is eight against nine of the maximum containing number of the outer case 1, the inner case 3 for fractions is charged to fill the hollow space caused by no inner case contained and serve as a shock-absorbing material.

24. 发明专利

JPH053277A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH053277A
公开(公告)日：1993-01-08
申请号：JP15288191
申请日：1991-06-25
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR , HITACHI MICOM SYST KK
发明人： NAITO TAKAHIRO , TANAKA SHIGEKI , AKEYAMA KENJI , OTSUKA KENICHI , MASUDA MASACHIKA , SUZUKI HIROMICHI , KIMOTO RYOSUKE , TERADA KAZUHIRO
IPC分类号： H01L23/50 , H05K3/34
摘要： PURPOSE:To secure the wettability of the end face where no solder plating layer exists thereby to enhance the bonding strength of a mount board and to improve the accuracy of visual inspections by making the sectional area of the areas at the leading ends of the gull wing shaped or flat outer leads smaller than the other parts. CONSTITUTION:The areas 2E of the leading ends of outer leads 2D are formed in a board thickness thinner than that of the other areas. A semiconductor device 1 is mounted on a mount board 10 made of a PCB board and others. The outer leads 2D are connected electrically and mechanically to the terminals 11 on the mount surface through a solder paste 8. Since the areas 2E are in a thin board thickness, the solder pastes 8 being wet by the solder plating layer 7 surrounding the end face of the leading ends of the outer leads 2D are coupled to each other by the surface tension or the like. Then, the solder pastes 8 are caused to adhere to the end faces of the outer leads 2D. In other words, a wettability is apparently secured on the end faces of the outer leads 2D. Thus, the accuracy of the visual defect inspection is improved.

25. 发明专利

JPH0330455A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0330455A
公开(公告)日：1991-02-08
申请号：JP16396689
申请日：1989-06-28
申请人： HITACHI LTD
发明人： SATO HAJIME , KITAMURA WAHEI , OTSUKA KENICHI
IPC分类号： H01L23/29
摘要： PURPOSE:To improve a semiconductor device of this design in heat dissipating property without changing a package in thickness by a method wherein a heat dissipating body formed of a coiled metal wire, a metal wire subjected to a bending work, or metal meshes is joined to the rear side of the tab of a lead frame as buried in a resin sealing body. CONSTITUTION:A semiconductor chip 4 is fixed to a tab 3 of a lead frame 2, which is sealed up with resin to form a resin sealed type semiconductor device 1, where a heat dissipating body 7 formed of a coiled metal wire, a metal wire subjected to a bending work, or metal meshes is joined to the rear side of the tab 3 of the lead frame 2 opposed to the side where the semiconductor chip 4 is mounted as all buried in a resin sealing body 8 or partially exposed from the resin sealing body 8. For instance, the semiconductor chip 4 is fixed the tab 3 of the lead frame 2, and the chip 4 and a lead section 5 are electrically connected together with a connector wire 6. The heat dissipating body 7 is joined to the side of the tab 3 opposed to the semiconductor chip 4 and buried int eh resin sealing body 8 so as to make its surface partially exposed out of the sealing body.

26. 发明专利

JPS6173343A Wire bonding device 失效
标题翻译：电线连接装置
公开(公告)号：JPS6173343A
公开(公告)日：1986-04-15
申请号：JP19466284
申请日：1984-09-19
申请人： Hitachi Ltd
发明人： SATO HAJIME , OTSUKA KENICHI , KITAMURA WAHEI , MURAKAMI HAJIME
IPC分类号： H01L21/60
CPC分类号： H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/78 , H01L2224/78301 , H01L2224/78703 , H01L2224/78743 , H01L2224/85 , H01L2224/851 , H01L2924/01082 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE:To enable a lead tip to be fixed securely with the suction force applied through a through hole, by providing an aperture at a predetermined position in a bonding stage and providing a through hole communicating with a decompression device. CONSTITUTION:A through hole 17 is provided at a predetermined position in a bonding state 1 so as to communicate with a decompression device. The aperture of the through hole 17 is positioned under the proximity of the bonding area of a lead 18 to be mounted on the stage 1 during bonding operation. The lead 18 is then fixed mechanically by a pressing jig 16 while, at the same time, fixed by sucking the tip thereof in the direction as shown by the arrow. In this manner, the wire bonding can be effected precisely and reliably, whereby the workability is improved.
摘要翻译：目的：通过在结合台中的预定位置设置孔，并提供与减压装置连通的通孔，使引线头能够通过通孔施加的吸力牢固地固定。构成：通孔17设置在接合状态1的预定位置，以与减压装置通信。在接合操作期间，通孔17的孔径位于引线18的接合区域附近，以安装在载物台1上。然后，引线18通过加压夹具16机械地固定，同时通过沿箭头所示的方向吸取其尖端来固定引线18。以这种方式，可以精确可靠地进行引线接合，从而提高加工性。

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