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21. 发明授权

US08438931B2 Semiconductor strain sensor 有权
标题翻译：半导体应变传感器
公开(公告)号：US08438931B2
公开(公告)日：2013-05-14
申请号：US12674419
申请日：2008-07-25
申请人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
发明人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
IPC分类号： G01L1/22
CPC分类号： G01L1/18 , G01B7/16 , G01L1/2293
摘要： A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.
摘要翻译：一种半导体应变传感器，具有由具有压阻元件的半导体基板构成的应变传感器芯片作为应变检测部。半导体应变传感器在待测尺寸的应变范围内长时间地具有稳定的特性，并且在应变传感器芯片中产生的应变对应于被测量物体的应变的稳定的转换系数。应变传感器芯片用金属接合材料接合到金属基板上。金属基板具有从应变传感器芯片的一侧突出的两个或四个延伸部件，用于将应变传感器芯片附接到待测量对象。优选地，在对应于应变传感器芯片与金属基板接合的接合区域的金属底板下表面区域和延伸构件的下表面之间布置有凹槽，以及由凹槽夹持的突出部分布置在金属底板的下表面上。

22. 发明申请

US20110227178A1 SEMICONDUCTOR STRAIN SENSOR 有权
标题翻译：半导体应变传感器
公开(公告)号：US20110227178A1
公开(公告)日：2011-09-22
申请号：US12674419
申请日：2008-07-25
申请人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
发明人： Atsushi Kazama , Ryoji Okada , Tetsurou Kawai
IPC分类号： H01L29/84
CPC分类号： G01L1/18 , G01B7/16 , G01L1/2293
摘要： A semiconductor strain sensor having a strain sensor chip composed of a semiconductor substrate having a piezoresistive element as a strain detection section. The semiconductor strain sensor has a stable characteristic for a long period of time and a stable conversion factor of a strain generated in the strain sensor chip corresponding to a strain of an object to be measured, within a strain range of a size to be measured. The strain sensor chip is bonded to a metal base plate with a metal bonding material. The metal base plate has two or four extending members, which protrude from a side of the strain sensor chip for attaching the strain senor chip to the object to be measured. Preferably, a groove is arranged between a metal base plate undersurface area, which corresponds to the bonding area where the strain sensor chip is bonded to the metal base plate, and the undersurfaces of the extending members, and a protruding section sandwiched by the grooves is arranged on the undersurface of the metal base plate.
摘要翻译：一种半导体应变传感器，具有由具有压阻元件的半导体基板构成的应变传感器芯片作为应变检测部。半导体应变传感器在待测尺寸的应变范围内长时间地具有稳定的特性，并且在应变传感器芯片中产生的应变对应于被测量物体的应变的稳定的转换系数。应变传感器芯片用金属接合材料接合到金属基板上。金属基板具有从应变传感器芯片的一侧突出的两个或四个延伸部件，用于将应变传感器芯片附接到待测量对象。优选地，在对应于应变传感器芯片与金属基板接合的接合区域的金属底板下表面区域和延伸构件的下表面之间布置有凹槽，以及由凹槽夹持的突出部分布置在金属底板的下表面上。

23. 发明授权

US08022433B2 Semiconductor sensor device and method for manufacturing same 有权
标题翻译：半导体传感器装置及其制造方法
公开(公告)号：US08022433B2
公开(公告)日：2011-09-20
申请号：US12282986
申请日：2007-08-27
申请人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
发明人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
IPC分类号： H01L33/00 , H01L29/84 , H01L21/00
CPC分类号： G01P15/125 , B81C1/00873 , G01C19/5719 , G01P1/023 , G01P15/0802 , G01P15/123 , G01P15/18 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.
摘要翻译：提供了一种通过MEMS技术制造的半导体传感器装置，其中加工技术和/或材料技术与用于检测和测量各种物理量的半导体技术相结合。在半导体传感器装置中，消除了在帽芯片和模塑树脂中产生的裂纹，并且确保了半导体传感器芯片和盖芯片之间的气密性。通过使盖片的圆周侧表面作为湿蚀刻表面，可以消除由于切割时施加的振动引起的裂纹。此外，通过用绝缘保护膜涂覆盖芯片侧表面来确保绝缘。

24. 发明申请

US20080217752A1 Functional Device Package 有权
标题翻译：功能器件封装
公开(公告)号：US20080217752A1
公开(公告)日：2008-09-11
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/02
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种用于通过在晶片级焊接连接来密封功能器件的封装结构，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

25. 发明授权

US07184619B2 Beam direction module and optical switch using the same 失效
标题翻译：光束方向模块和光开关使用相同
公开(公告)号：US07184619B2
公开(公告)日：2007-02-27
申请号：US10890131
申请日：2004-07-14
申请人： Atsushi Kazama , Kazuyuki Fukuda , Toshiya Shiramatsu , Masaya Horino , Yasuhiro Itou
发明人： Atsushi Kazama , Kazuyuki Fukuda , Toshiya Shiramatsu , Masaya Horino , Yasuhiro Itou
IPC分类号： G02B6/26
CPC分类号： G02B6/3556 , G02B6/32 , G02B6/3512 , G02B6/3544 , G02B6/357 , G02B6/3572 , G02B6/3578 , G02B6/3584
摘要： A beam direction module which can be applied to an optical switch, comprising: a collimator support member; a first mirror substrate including first micro-mirrors, and first windows through which beams can pass; a first electrode substrate including first mirror driving electrodes, and second windows through which beams can pass; a first spacer; a second mirror substrate including second micro-mirrors, and third windows through which beams can pass; a second electrode substrate including second mirror driving electrodes, and fourth windows through which beams can pass; a second spacer; and an inter-mirror spacer, wherein the first electrode substrate, the first spacer, the first mirror substrate, the inter-mirror spacer, the second mirror substrate, the second spacer and the second electrode substrate are stacked successively on the collimator support member and fixed between caps and the collimator support member while pins protruding from the collimator support member are inserted into alignment through-holes formed.
摘要翻译：可以应用于光开关的光束方向模块，包括：准直器支撑部件; 包括第一微反射镜的第一反射镜基板和光束能穿过的第一窗口; 第一电极基板，包括第一反射镜驱动电极和光束能通过的第二窗口; 第一间隔物包括第二微反射镜的第二反射镜基板和光束能穿过的第三窗口; 第二电极基板，包括第二反射镜驱动电极和第四窗口，波束可以通过该第四窗口; 第二间隔物以及反射镜间隔件，其中所述第一电极基板，所述第一间隔件，所述第一反射镜基板，所述反射镜间隔件，所述第二反射镜基板，所述第二间隔物和所述第二电极基板依次堆叠在所述准直器支撑部件上，固定在盖和准直器支撑构件之间，而从准直器支撑构件突出的销插入形成的对准通孔中。

26. 发明授权

US07783804B2 Bus relay device and bus control system including plurality of bus masters, bus slave, interconnect section, and bridge section 有权
标题翻译：总线中继装置和总线控制系统，包括多个总线主机，总线从机，互连部分和桥接部分
公开(公告)号：US07783804B2
公开(公告)日：2010-08-24
申请号：US11984607
申请日：2007-11-20
申请人： Atsushi Kazama
发明人： Atsushi Kazama
IPC分类号： G06F13/18
CPC分类号： G06F13/4031
摘要： In the conventional bus control system, the interconnect section and the bridge section have the arbitration function. Meanwhile, the interconnect section and the bridge section were designed by different designers. Accordingly, a large number of man-hours are needed not only for designing the bridge section but also for inspecting the bridge section. To solve this problem, provided is a system comprising a plurality of bus masters coupled to a high speed bus and outputting first control signals respectively via the high speed bus; a bus slave coupled to a low speed bus and receiving a second control signal via the low speed bus; an interconnect section receiving the first control signals via the high speed bus, selecting one of the first control signals, and converting the selected one of the first signals into a third control signal relative to the second control signal; and a bridge section coupled to the low speed bus, converting the third control signal into the second control signal, and outputting the second control signal to the low speed bus. With this configuration, the bus arbitrations can be collectively controlled in the interconnect section alone. In addition, a circuit size can be reduced.
摘要翻译：在常规总线控制系统中，互连部分和桥接部分具有仲裁功能。同时，互连部分和桥接部分由不同的设计者设计。因此，不仅需要设计桥段，而且还需要大量工时来检查桥段。为了解决这个问题，提供了一种系统，包括耦合到高速总线的多个总线主机，并分别经由高速总线输出第一控制信号; 耦合到低速总线并经由低速总线接收第二控制信号的总线从设备; 互连部分，经由高速总线接收第一控制信号，选择第一控制信号中的一个，并将所选择的一个第一信号转换成相对于第二控制信号的第三控制信号; 以及耦合到所述低速总线的桥接部分，将所述第三控制信号转换为所述第二控制信号，并将所述第二控制信号输出到所述低速总线。利用这种配置，总线仲裁可以单独地在互连部分中统一控制。此外，可以减小电路尺寸。

27. 发明申请

US20090050990A1 SEMICONDUCTOR SENSOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体传感器装置及其制造方法
公开(公告)号：US20090050990A1
公开(公告)日：2009-02-26
申请号：US12282986
申请日：2007-08-27
申请人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
发明人： Takanori Aono , Ryoji Okada , Atsushi Kazama , Yoshiaki Takada
IPC分类号： H01L29/84 , H01L21/58
CPC分类号： G01P15/125 , B81C1/00873 , G01C19/5719 , G01P1/023 , G01P15/0802 , G01P15/123 , G01P15/18 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2924/1461 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Provided is a semiconductor sensor device which is manufactured by an MEMS technology wherein machining technology and/or material technology is combined with semiconductor technology for detecting and measuring various physical quantities. In the semiconductor sensor device, cracks which generate in a cap chip and a molding resin are eliminated and air-tightness between a semiconductor sensor chip and the cap chip is ensured. The cracks due to vibration applied when being cut can be eliminated by having the circumference side surface of the cap chip as a wet-etched surface. Furthermore, insulation is ensured by coating the cap chip side surface with an insulating protection film.
摘要翻译：提供了一种通过MEMS技术制造的半导体传感器装置，其中加工技术和/或材料技术与用于检测和测量各种物理量的半导体技术相结合。在半导体传感器装置中，消除了在帽芯片和模塑树脂中产生的裂纹，并且确保了半导体传感器芯片和盖芯片之间的气密性。通过使盖片的圆周侧表面作为湿蚀刻表面，可以消除由于切割时施加的振动引起的裂纹。此外，通过用绝缘保护膜涂覆盖芯片侧表面来确保绝缘。

28. 发明申请

US20070272015A1 ANGULAR RATE SENSOR 审中-公开
标题翻译：角速率传感器
公开(公告)号：US20070272015A1
公开(公告)日：2007-11-29
申请号：US11752335
申请日：2007-05-23
申请人： Atsushi Kazama , Shigeo Nakamura
发明人： Atsushi Kazama , Shigeo Nakamura
IPC分类号： G01P9/02 , G01P9/04 , G01P1/04
CPC分类号： G01P15/125 , G01C19/5712 , G01P2015/0814
摘要： An angular rate sensor formed into a planar shape, which detects an angular rate around a first axis in the plane, includes a rotating oscillator rotatably supported in the plane and around the rotational axis in a direction of a second axis perpendicular to the first axis; vibration generating means which rotationally vibrates the rotating oscillator; and a first detecting oscillator and a second detecting oscillator which are disposed inside the rotating oscillator and separately on the right side and the left side of the rotational axis, and which are supported as being displaceable in a direction of the second axis. A first detecting unit and a second detecting unit, which detect vibrations of the respective first and second detecting oscillators in the direction of the second axis due to the Coriolis force, are respectively provided closer to the rotational axis than the first and second detecting oscillators are.
摘要翻译：形成为平面形状的角速度传感器，其检测所述平面中的第一轴周围的角速度，包括旋转振荡器，所述旋转振荡器在垂直于所述第一轴线的第二轴线的方向上可旋转地支撑在所述平面中并且围绕所述旋转轴线; 使旋转振荡器旋转振动的振动产生装置; 以及第一检测振荡器和第二检测振荡器，其分别设置在旋转振荡器的内部，并且分别位于旋转轴的右侧和左侧，并且被支撑为可沿第二轴线的方向移位。第一检测单元和第二检测单元分别设置为比第一和第二检测振荡器更靠近旋转轴设置检测相应的第一和第二检测振荡器在第二轴方向上由于科里奥利力的振动。。

29. 发明申请

US20070016709A1 Bus control system and a method thereof 审中-公开
标题翻译：总线控制系统及其方法
公开(公告)号：US20070016709A1
公开(公告)日：2007-01-18
申请号：US11476698
申请日：2006-06-29
申请人： Atsushi Kazama
发明人： Atsushi Kazama
IPC分类号： G06F13/36
CPC分类号： G06F13/364
摘要： A bus control system includes a plurality of bus masters commonly connected to a bus, a bus arbiter for arbitrating use of the bus between the plurality of bus masters according to any one of a plurality of predetermined arbitration algorithms, and an arbitration algorithm control unit for switching the plurality of arbitration algorithms.
摘要翻译：总线控制系统包括通常连接到总线的多个总线主机，用于根据多个预定仲裁算法中的任何一个来仲裁在多个总线主机之间使用总线的总线仲裁器，以及仲裁算法控制单元，切换多个仲裁算法。

30. 发明申请

US20050258736A1 Display apparatus, its display module and display panel 审中-公开
标题翻译：显示装置，显示模块和显示面板
公开(公告)号：US20050258736A1
公开(公告)日：2005-11-24
申请号：US11133305
申请日：2005-05-20
申请人： Atsushi Kazama , Takeshi Terasaki , Makoto Kitano , Tatsuya Nagata , Takashi Fujimura
发明人： Atsushi Kazama , Takeshi Terasaki , Makoto Kitano , Tatsuya Nagata , Takashi Fujimura
IPC分类号： H01J29/86 , G09F9/00 , G09F9/30 , G09F9/313 , H01J1/62 , H01J29/87 , H01J31/12 , H01J63/04
CPC分类号： H01J31/123 , H01J29/87
摘要： To achieve high resolution, lightening, and thinning in a display apparatus, the display apparatus includes a thin display panel and a control unit. The display panel includes an anode substrate, a cathode substrate forming an electron emitting chamber vacuously sealed between itself and the anode substrate, phosphors formed on the anode substrate, and a pressure support formed on the back of the electron emitting chamber side of the cathode substrate. The pressure support includes a vacuum seal member forming a pressure supporting chamber vacuously sealed between itself and the cathode substrate independently of the electron emitting chamber, and a reinforcement member which is formed of a member having a gap, which is sandwiched between the vacuum seal member and cathode substrate in the pressure supporting member, and at least both end portions of which span a bonding area of the cathode substrate for the anode substrate.
摘要翻译：为了在显示装置中实现高分辨率，减轻和减薄，显示装置包括薄的显示面板和控制单元。显示面板包括阳极基板，形成在其自身与阳极基板之间真空密封的电子发射室的阴极基板，形成在阳极基板上的荧光体和形成在阴极基板的电子发射室侧背面的压力支架。压力支架包括一个真空密封件，该真空密封件形成一个与电子发射室无关地密封在其本身与阴极基板之间的压力支撑室;以及一个加强件，该加强件由一个具有间隙的部件形成，该加强件夹在真空密封件和阴极基板，并且其至少两端部跨越阳极基板的阴极基板的接合区域。

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