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21. 发明公开

EP2668835A1 VERFAHREN ZUR INTEGRATION EINES ELEKTRONISCHEN BAUTEILS IN EINE LEITERPLATTE ODER EIN LEITERPLATTEN-ZWISCHENPRODUKT SOWIE LEITERPLATTE ODER LEITERPLATTEN-ZWISCHENPRODUKT 有权
标题翻译：方法的电子部件在一块电路板上和电路板中间集成
公开(公告)号：EP2668835A1
公开(公告)日：2013-12-04
申请号：EP12709271.6
申请日：2012-01-24
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEIDINGER, Gerald , ZLUC, Andreas , STAHR, Johannes
IPC分类号： H05K1/18
CPC分类号： H05K1/188 , F16D13/72 , F16D69/026 , F16D2069/004 , F16D2200/0073 , F16D2250/0046 , F16D2300/10 , H01L21/568 , H01L24/18 , H01L24/82 , H01L2224/73267 , H01L2224/92244 , H01L2924/12042 , H01L2924/351 , H05K1/0212 , H05K1/0271 , H05K1/09 , H05K1/182 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/30 , H05K2203/0152 , H05K2203/1469 , Y10T29/49146 , H01L2924/00
摘要： In a method for integrating at least one electronic component (31) into a printed circuit board or a printed circuit board intermediate product (37), the following steps are provided: - providing a layer (32) for at least temporarily supporting the electronic component (31), - fixing the electronic component (31) on the layer (32), - arranging a conductive layer (35) on the supporting layer (32) with at least one cutout (38) corresponding to the dimensions of the electronic component (31) to be fixed, - at least partly encapsulating or covering the component (31) fixed on the supporting layer (32) with an insulating material (36), - exposing the electronic component (31), and at least partial regions of the conductive layer (35), which adjoins the component (31) and is arranged on the supporting layer (32), and - at least partly making contact between the electronic component (31) and the conductive layer (35) adjoining the component. Furthermore, a printed circuit board (37) and a printed circuit board intermediate product having an integrated electronic component (31) are provided.

22. 发明公开

EP3231262A1 SEMIFLEXIBLE LEITERPLATTE MIT EINGEBETTETER KOMPONENTE 有权
公开(公告)号：EP3231262A1
公开(公告)日：2017-10-18
申请号：EP15808379.0
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Hannes , ZLUC, Andreas , SCHWARZ, Timo , WEIDINGER, Gerald
IPC分类号： H05K1/02 , H05K3/46 , H05K1/18 , H01L23/538 , H05K1/03 , C08J5/24
摘要： This document describes a printed circuit board and a method for producing a printed circuit board or two printed circuit boards, wherein the printed circuit board comprises (a) a dielectric layer (312), which has a planar extent parallel to an xy plane spanned by an x axis and a y axis perpendicular thereto and has a layer thickness along a z direction perpendicular to the x axis and to the y axis; (b) a metallic layer (336), which is applied areally on the dielectric layer; and (c) a component (120), which is embedded in the dielectric layer (312) and/or in a dielectric core layer (350) of the printed circuit board (300). The dielectric layer (312) comprises a dielectric material which has (i) a modulus of elasticity E in the range of between 1 and 20 GPa and (ii) a coefficient of thermal expansion along the x axis and along the y axis in the range of between 0 and 17 ppm/K.
摘要翻译：该文献描述了印刷电路板和用于制造印刷电路板或两个印刷电路板的方法，其中印刷电路板包括（a）介电层（312），该介电层具有平行于xy平面的平面范围， x轴和与其垂直的y轴，并且具有沿着垂直于x轴和y轴的z方向的层厚度; （b）金属层（336），其平面地施加在介电层上; 和（c）嵌入在印刷电路板（300）的介电层（312）和/或介电芯层（350）中的部件（120）。电介质层（312）包括电介质材料，该电介质材料具有（i）在1和20GPa之间的范围内的弹性模量E和（ii）沿x轴和沿着y轴的热膨胀系数，介于0和17ppm / K之间。

23. 发明公开

EP3111734A1 VERFAHREN ZUM KONTAKTIEREN EINES IN EINE LEITERPLATTE EINGEBETTETEN BAUELEMENTS SOWIE LEITERPLATTE 有权
标题翻译：方法用于接触在一块电路板上和嵌入式器件的电路板
公开(公告)号：EP3111734A1
公开(公告)日：2017-01-04
申请号：EP15716392.4
申请日：2015-02-26
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEIDINGER, Gerald , ZLUC, Andreas
IPC分类号： H05K1/18 , H05K3/10 , H01L23/538
CPC分类号： H05K1/188 , H01L23/13 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H05K3/064 , H05K3/108 , H05K3/30 , H05K2201/10674
摘要： The invention relates to a method for making contact with a component (6) embedded in a printed circuit board (13), which method has the following steps: a) providing a core (1) which has at least one insulating layer (2) and at least one conductor layer (3, 4) applied to the insulating layer (2), b) embedding at least one component (6) in a depression (5) in the insulating layer (2), wherein the contact pins (8) of the component (6) are located substantially in the plane of an outer surface of the core (1) having the at least one conductor layer (4), c) applying a varnish (9) that can be photo-structured to the one outer surface of the core (1) on which the component (6) is arranged, filling the spaces between the contact pins (8) of the component (6), d) exposing end faces of the contact pins (8) and the regions of the conductor layer (4) covered by the varnish (9) that can be photo-structured, by illuminating and developing the varnish (9) that can be photo-structured, e) by applying a semi-additive process, depositing a layer (10) of conductor material on the exposed end faces of the contact pins (8) and the exposed regions of the conductor layer (4), and forming a conductor structure (12-12), at least on the one outer surface of the core (1) on which the component (6) is arranged, and on the connecting lines (11) between the contact pins (8) and the conductor structure (12-12), and f) removing the regions of the conductor layer (4+10) that do not belong to the conductor structure (12-12).
摘要翻译：本发明涉及的方法用于接触一个部件（6）嵌入在印刷电路板（13），该方法具有以下步骤：a）提供一个芯体（1），其具有至少一个绝缘层（2）和至少一个导体层（3，4）施加到所述绝缘层（2），b）中嵌入至少一个部件（6）中的凹陷（5）的绝缘层（2）中，worin接触销（8 ）组分（6）基本上位于所述芯的外表面的平面（1），其具有至少一个导体层（4），c）将清漆（9），可光致结构化的芯的一个外表面（1）在其上的组分（6）布置，填充接触销之间的空间（8）的部件（6）中，d）将所述接触销的端面（8）和（4）包括的清漆（9）确实可以是光结构化，通过照射和由applyin显影清漆（9）确实可以是光结构化，E），导体层的区域 GA半加成法，在接触销（8）和所述导体层（4），和形成导体结构的暴露区域的露出端面沉积导体材料层（10）（12-12）至少在芯的一个外表面（1）在其上的组分（6）设置，并在接触销（8）和该导体结构（12-12），和f之间的连接线（11））去除所述导体层（4 + 10）的区域中没有不属于该导体结构（12-12）。

24. 发明公开

EP2982226A1 VERFAHREN ZUM HERSTELLEN EINES LEITERPLATTENELEMENTS 有权
标题翻译：一种用于生产电路板元件
公开(公告)号：EP2982226A1
公开(公告)日：2016-02-10
申请号：EP14718312.3
申请日：2014-03-17
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Johannes , ZLUC, Andreas
IPC分类号： H05K1/18
CPC分类号： H05K3/30 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2224/04105 , H01L2224/2402 , H01L2224/24137 , H01L2224/2732 , H01L2224/27334 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/73104 , H01L2224/73267 , H01L2224/82007 , H01L2224/82138 , H01L2224/83191 , H01L2224/83192 , H01L2224/9222 , H01L2224/92244 , H01L2924/1305 , H01L2924/13055 , H05K1/185 , H05K1/186 , H05K3/0064 , H05K3/007 , H05K3/12 , H05K3/4644 , H05K3/4697 , H01L2924/00
摘要： The invention relates to a method for producing a circuit board element having at least one electronic component (1), which component has a connection side defined by electrical contacts or a conductive layer and is connected to a temporary carrier (2) for positioning and embedded in an insulating material (9); the component (1) is attached in a specified position directly to a plastic film (2) as a temporary carrier (2), whereupon a composite layer (4, 4') having at least a carrier (7) and an electrical conductor (6), preferably also having an insulating material (5, 5A), is attached on the side of the component (1) opposite the plastic film (2), with the carrier (7) facing away from the component (1), and thereafter the plastic film (2) is removed; then the component (1) is embedded in insulating material (5A; 9). After the embedding of the component (1) in the insulating material (5A; 9), an additional composite layer (11) is preferably attached to the component (1) and the embedding of the component on the side opposite the first composite layer (4, 4').

26. 发明授权

EP3231262B1 SEMIFLEXIBLE LEITERPLATTE MIT EINGEBETTETER KOMPONENTE 有权
公开(公告)号：EP3231262B1
公开(公告)日：2019-11-13
申请号：EP15808379.0
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Hannes , ZLUC, Andreas , SCHWARZ, Timo , WEIDINGER, Gerald
IPC分类号： H05K1/02 , H05K1/18 , H05K3/46 , H01L23/00 , H01L23/538 , H05K1/03 , H01L21/56 , H05K3/00

27. 发明公开

EP3231261A1 LEITERPLATTE MIT EINEM ASYMMETRISCHEN SCHICHTENAUFBAU 有权
公开(公告)号：EP3231261A1
公开(公告)日：2017-10-18
申请号：EP15808378.2
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： ZLUC, Andreas , WEIDINGER, Gerald , SCHOBER, Mario , STAHR, Hannes , SCHWARZ, Timo , GRUBER, Benjamin
IPC分类号： H05K1/02 , H05K1/03 , H05K3/46 , H05K1/18 , C08J5/24 , H01L23/538
摘要： The invention relates to a circuit board (200) having a layer structure with at least one dielectric layer (114) which has a planar extension parallel to an xy-plane that extends via an x-axis and a perpendicular y-axis, and has a layer thickness along a z-axis that is perpendicular to the x-axis and the y-axis, and with at least one metal layer (136) that is applied in a planar manner to the dielectric layer, wherein the layer composite is free from a symmetry plane along the z-axis, said symmetry plane being oriented in parallel to the xy-plane, and the dielectric layer (114) has a dielectric material which has an elastic modulus E in the region between 1 and 20 GPa, and has a thermal expansion coefficient in the region between 0 and 17 ppm/K along the x-axis and along the y-axis. The invention also relates to a method for producing a circuit board (200) of this type. The invention further relates to a method for producing a circuit board structure having two asymmetric circuit boards, and a method for producing two processed asymmetric circuit boards (500a, 500b) from a larger circuit board structure (505).
摘要翻译：本发明涉及具有层结构的电路板（200），所述层结构具有至少一个介电层（114），所述介电层具有平行于xy平面的平面延伸，所述xy平面经由x轴和垂直y轴延伸，并且具有沿垂直于所述x轴和所述y轴的z轴的层厚度，以及以平面方式施加到所述电介质层的至少一个金属层（136），其中所述层复合物是自由的从沿着z轴的对称平面开始，所述对称平面平行于xy平面取向，并且介电层（114）具有介电材料，该介电材料具有在1和20GPa之间的区域中的弹性模量E，并且在沿x轴和沿y轴的0和17ppm / K之间的区域中具有热膨胀系数。本发明还涉及用于制造这种类型的电路板（200）的方法。本发明还涉及一种用于制造具有两个不对称电路板的电路板结构的方法以及一种用于由较大电路板结构（505）制造两个经处理的不对称电路板（500a，500b）的方法。

28. 发明公开

EP3008753A1 LEISTUNGSMODUL 有权
公开(公告)号：EP3008753A1
公开(公告)日：2016-04-20
申请号：EP14726506.0
申请日：2014-05-06
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： STAHR, Johannes , ZLUC, Andreas , GROBER, Gernot , SCHWARZ, Timo
IPC分类号： H01L23/36 , H01L23/373 , H01L23/538 , H01L23/498
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/36 , H01L23/367 , H01L23/3735 , H01L23/49833 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/06181 , H01L2224/18 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2924/0002 , H01L2924/00
摘要： A power module having a printed circuit board core (1) that contains at least one electronic power component (7) embedded in an insulating layer (4), the core being arranged between two heat dissipation plates (2, 3), wherein each heat dissipation plate has a metal exterior layer (2a, 3a) and a metal interior layer (2i, 3i) that is electrically isolated from the latter by a thermally conductive, electrically insulating intermediate layer (2z, 3z), and electrode connections of the at least one power component are guided out of the core via connecting lines, wherein the printed circuit board core (1) has a conductor layer (5, 6) on both sides of the insulating layer (4), at least one conductor layer (5) is structured at least in sections and each conductor layer (5, 6) is connected, at least in sections, to a metal interior layer (2i, 3i) of the heat dissipation plate (2, 3) via a conductive, metal intermediate ply (16o, 16u), contacts (11) run from the structured conductor layer to the electrode connections of the at least one power component (7), and at least one power connection (7s) of the at least one power component (7) is connected to at least one section of the metal interior layer (2i) of the heat dissipation plate, which forms part of the connecting line to the electrode connection, via a contact (11), a section of a structured conductor layer (5) and the conductive, metal intermediate ply (16o).
摘要翻译：一种功率模块，其具有包含嵌入绝缘层（4）中的至少一个电子功率部件（7）的印刷电路板芯（1），所述芯布置在两个散热板（2,3）之间，其中每个热量所述散热板具有金属外层（2a，3a）和金属内层（2i，3i），所述金属内层通过导热的电绝缘中间层（2z，3z）与金属内层（2i，3i）电绝缘，所述金属内层其中印刷电路板芯（1）在绝缘层（4）的两侧上具有导体层（5,6），至少一个导体层（5））至少部分地构造并且每个导体层（5,6）至少部分地经由导电的金属中间体（3）与散热板（2,3）的金属内层（2i，3i）连接，层（16o，16u），触点（11）从结构化的导体层延伸到层所述至少一个功率部件（7）的电极连接以及所述至少一个功率部件（7）的至少一个功率连接（7s）连接到所述热量的所述金属内层（2i）的至少一个区段其通过接触件（11），结构化导体层（5）的一部分和导电金属中间层（16o）形成到电极连接的连接线的一部分。

29. 发明授权

EP2119327B1 VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINER FLÄCHIGEN MATERIALSCHICHT 有权
标题翻译： VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINERFLÄCHIGENMATERIALSCHICHT
公开(公告)号：EP2119327B1
公开(公告)日：2011-10-26
申请号：EP08700293.7
申请日：2008-01-30
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEIDINGER, Gerald , LEITGEB, Markus , STAHR, Johannes , WEICHSLBERGER, Günther , ZLUC, Andreas
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/00 , H05K1/183 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , Y10T29/49155
摘要： The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.
摘要翻译：本发明涉及一种用于去除在连接步骤中连接到至少一个其它基本平坦的材料层（9）的基本平坦的材料层（2）的一部分的方法。根据本发明，其中材料层（2,9）不直接互连的区域设置在部件（11）稍后被移除的区域中，所述第一区域通过施加材料（8）来提供，所述材料防止待彼此相互连接的材料层。本发明还涉及一种多层结构以及该方法和多层结构的使用，特别是用于制造多层印刷电路板。

30. 发明公开

EP2286644A1 VERFAHREN ZUR INTEGRATION WENIGSTENS EINES ELEKTRONISCHEN BAUTEILS IN EINE LEITERPLATTE SOWIE LEITERPLATTE 有权
标题翻译：方法对于至少一个电子部件的电路板和电路板集成
公开(公告)号：EP2286644A1
公开(公告)日：2011-02-23
申请号：EP09753314.5
申请日：2009-05-29
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEICHSLBERGER, Günther , KRIECHBAUM, Arno , MORIANZ, Mike , HASLEBNER, Nikolai , STAHR, Johannes , HARING, Fritz , FREYDL, Gerhard , KOERTVELYESSY, Andrea , BEESLEY, Mark , ZLUC, Andreas , SCHRITTWIESER, Wolfgang
IPC分类号： H05K1/18
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24137 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15174 , H01L2924/351 , H05K1/0206 , H05K1/185 , H05K3/305 , H05K3/4652 , H05K2201/0355 , H05K2201/09845 , H05K2201/10507 , H05K2201/10674 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要： In a method for integrating at least one electronic component into a printed circuit board, the following steps are provided: providing a layer (4) of a printed circuit board for supporting the electronic component (1, 2, 3), applying an adhesive (5) to a surface of the layer (4), fixing the electronic component (1, 2, 3) on the layer (4) by means of the adhesive (5), applying or arranging at least one electrically conductive layer (8) on or at the component (1, 2, 3) at the side or surface remote from the adhesive (5), and patterning the electrically conductive layer (8) in accordance with the contacts (7) of the electronic component (1, 2, 3) and/or in accordance with conductor tracts to be formed on the printed circuit board. A printed circuit board produced in accordance with this method is furthermore provided.

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