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21. 发明专利

JP4059657B2 Method of manufacturing a three-dimensional photonic crystal 有权
公开(公告)号：JP4059657B2
公开(公告)日：2008-03-12
申请号：JP2001330058
申请日：2001-10-29
申请人：リンテック株式会社
发明人：正仁中林 , 安一中田 , 和義江部
IPC分类号： G02B1/02 , G02B6/13 , G02B5/18 , G02B6/12

22. 发明专利

JP3889147B2 Ferroelectric liquid crystal compounds and compositions 失效
公开(公告)号：JP3889147B2
公开(公告)日：2007-03-07
申请号：JP6557298
申请日：1998-03-16
申请人：リンテック株式会社
发明人：安一中田 , 順次渡邊
IPC分类号： C09K19/06 , C09K19/22 , G02F1/13

23. 发明专利

JP5128728B1 Phosphorescent light-emitting material, a method of manufacturing a phosphorescent light-emitting material, and a phosphorescent light-emitting element 有权
公开(公告)号：JP5128728B1
公开(公告)日：2013-01-23
申请号：JP2012540209
申请日：2012-03-05
申请人：国立大学法人九州大学 , パナソニック株式会社 , リンテック株式会社
发明人：将嗣種田 , 千波矢安達 , 琢麿安田 , 学中田 , 安一中田
IPC分类号： C09K11/06 , C07D213/16 , C07F15/00 , H05B33/14
CPC分类号： H01L51/0087 , C07D213/16 , C07F5/02 , C07F15/0086 , C09K11/06 , C09K2211/1007 , C09K2211/1014 , C09K2211/1029 , C09K2211/185 , H01L51/0072 , H01L51/008 , H01L51/009 , H01L51/5016
摘要： Provided are a phosphorescent material which is excellent in horizontal orientation and the like when a thin film is formed, a process for efficiently producing the phosphorescent material, and a light emitting element using the phosphorescent material. The present invention provides a phosphorescent material represented by the following general formula (1), a process for producing the phosphorescent material, and a light emitting element using the phosphorescent material, wherein the phosphorescent material has a straight-chain conjugated structure, a 2-phenylpyridine ligand, a central metal and a beta-diketone-type ligand, In the general formula (1), end substituents R1 and R2 each is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or the like, substituents a to l and o to s each is a hydrogen atom or the like, the central metal M is platinum or the like, and repetition numbers m and n each is an integer of 0 to 4.

24. 发明专利

JP5102921B2 A method of manufacturing a semiconductor electrode 有权
公开(公告)号：JP5102921B2
公开(公告)日：2012-12-19
申请号：JP2001081271
申请日：2001-03-21
申请人：リンテック株式会社
发明人：正仁中林 , 安一中田
IPC分类号： H01L21/288 , H01M14/00 , H01L21/28 , H01L31/04
CPC分类号： Y02E10/50

25. 发明专利

JP4869013B2 Multilayer film manufacturing method and a film forming apparatus 有权
公开(公告)号：JP4869013B2
公开(公告)日：2012-02-01
申请号：JP2006278808
申请日：2006-10-12
申请人：リンテック株式会社
发明人：安一中田 , 一也加藤
IPC分类号： B05D1/18 , B05C3/132 , B05D1/36

26. 发明专利

JP4744442B2 Antenna circuit, ic inlet and ic tag 有权
公开(公告)号：JP4744442B2
公开(公告)日：2011-08-10
申请号：JP2006528646
申请日：2005-06-20
申请人：リンテック株式会社
发明人：安一中田 , 貴一村上 , 大雅松下
IPC分类号： G06K19/10 , G06K19/07 , G06K19/077 , H01Q1/38
CPC分类号： G06K19/07749 , G06K19/0775

27. 发明专利

JP4416897B2 Production method of process materials and ic cards for Ic card manufacturing 有权
公开(公告)号：JP4416897B2
公开(公告)日：2010-02-17
申请号：JP2000040324
申请日：2000-02-17
申请人：リンテック株式会社
发明人：安一中田 , 裕一岩方
IPC分类号： G06K19/077 , B42D15/10 , C09J4/06 , C09J7/02 , C09J133/00
摘要： PROBLEM TO BE SOLVED: To provide a process material used to stably and continuously manufacture an IC card, a hand-shaped IC card manufacturing material provided with this process material, and a method to manufacture the IC card by using the process material. SOLUTION: A process material 1 for manufacturing the IC card is composed of an adhesive layer 1b and a transparent film 1a having a first face provided with the adhesive layer 1b and a second face 2 which is not provided with the adhesive layer, and the adhesive strength of the adhesive layer 1b is changed by light irradiation.

28. 发明专利

JP4274867B2 Ic tag 有权
公开(公告)号：JP4274867B2
公开(公告)日：2009-06-10
申请号：JP2003206190
申请日：2003-08-06
申请人：リンテック株式会社
发明人：安一中田 , 茂人奥地
IPC分类号： B42D15/10 , G06K19/077 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide an IC tag that resists breakage of an electronic circuit sealed in facing layers and the like. SOLUTION: An electronic-circuit-mounted base sheet where the electronic circuit comprising a circuit line and an IC chip connected to the circuit line is mounted on one surface of a base sheet is covered over both surfaces with a cushioning material having a modulus of elasticity of 1×10 5 Pa or lower at 23°C and a stress relaxation rate of 60% or higher after 1,000 seconds at 23°C, and the cushioning material is further covered over the surface with the facing layers. The electronic-circuit-mounted base sheet is thus sealed in to form the IC tag. COPYRIGHT: (C)2005,JPO&NCIPI

29. 发明专利

JP4146493B2 The heat-sensitive recording medium, the heat-sensitive coloring material, thermo-labels and heat-sensitive ink 有权
公开(公告)号：JP4146493B2
公开(公告)日：2008-09-10
申请号：JP2007031128
申请日：2007-02-09
申请人：リンテック株式会社
发明人：安一中田 , 正男小暮 , 順次渡邊 , 隆則齋藤
IPC分类号： B41M5/36 , B41M5/323 , B41M5/337 , C09D11/00 , C09K9/02

30. 发明专利

JP4127650B2 Ic tag 有权
公开(公告)号：JP4127650B2
公开(公告)日：2008-07-30
申请号：JP2003014081
申请日：2003-01-22
申请人：リンテック株式会社
发明人：安一中田 , 正輝山蔭 , 大雅松下
IPC分类号： B42D15/10 , G06K19/10 , G06K19/07 , G06K19/077 , G09F3/00
摘要： PROBLEM TO BE SOLVED: To provide an IC tag capable of surely breaking a built-in electronic circuit when the IC tag stuck to an article is peeled. SOLUTION: This IC tag comprises a first adhesive layer laminated on a base material sheet. An electronic circuit consisting of a circuit line and an IC chip connected to the electronic circuit are provided on the surface of the first adhesive layer, and at least one disconnection portion present in the circuit line is connected through a flat conductive resin layer, or an electronic circuit formed of a circuit line and a jumper wiring part and an IC chip connected to the electronic circuit are provided on the surface of the first adhesive layer, and the jumper wiring part is connected to the circuit line through a flat conductive resin layer 3 mm or more in length, whereby a second adhesive layer covering the electronic circuit and IC chip is laminated on the surface of the first layer. A release agent layer is further partially provided in a position corresponding to a circuit surface formed by the electronic circuit and IC chip in the interface between the base material sheet and the first adhesive layer. COPYRIGHT: (C)2004,JPO&NCIPI

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