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    • 21. 发明申请
    • Fabrication method for bipolar integrated circuits
    • 双极集成电路制造方法
    • US20060148188A1
    • 2006-07-06
    • US11028666
    • 2005-01-05
    • Xian LiuChong RenBin QiuXu Xu
    • Xian LiuChong RenBin QiuXu Xu
    • H01L21/8222
    • H01L27/0658
    • A fabrication method is applied to the bipolar integrated circuit, which combines with various patterns of the masks using in the different processes to form a combination mask. By using the combination mask, a silicon dioxide layer is etched to produce the open windows required in the different processes. Thereafter, according to the requirements of different processes, the unused windows are covered with photoresists to avoid the alignment errors resulted from the pattering and etching of different masks. Because the method doesn't need to reserve tolerance for alignment errors, the degree of integration of the semiconductor processes is enhanced and the cost of production is reduced.
    • 一种制造方法应用于双极集成电路,其结合了在不同工艺中使用的掩模的各种图案以形成组合掩模。 通过使用组合掩模,蚀刻二氧化硅层以产生不同工艺中所需的开放窗口。 此后,根据不同过程的要求,未使用的窗口被光致抗蚀剂覆盖,以避免不同掩模的图案和蚀刻产生的对准误差。 由于该方法不需要对准误差的预留容差,所以提高了半导体工艺的集成度,降低了生产成本。
    • 22. 发明申请
    • Lateral PNP transistor and the method of manufacturing the same
    • 横向PNP晶体管及其制造方法
    • US20060043528A1
    • 2006-03-02
    • US10930851
    • 2004-09-01
    • Chong RenXian LiuBin Qiu
    • Chong RenXian LiuBin Qiu
    • H01L27/082
    • H01L29/6625H01L21/8249H01L29/735
    • The present invention relates to a lateral PNP transistor and the method of manufacturing the same. The medium doping N-type base area and the light doping P− collector area were first introduced in the structure before the formation of P+ doping emitter area and the collector area. The emitter-base-collector doping profile in the lateral and the base width of LPNP were similar to NPN. The designer can optimize the doping profile and area size of each area according to the request of the current gain (Hfe), collector-base breakdown voltage (BVceo), and Early voltage (VA) of LPNP transistor. These advantages may cause to reduce the area and enhance performance of the LPNP transistor.
    • 本发明涉及一种横向PNP晶体管及其制造方法。 在掺杂发射极区域和集电极区域形成之前,首先引入介质掺杂的N型基极区域和掺杂光的P 集电极区域。 LPNP的横向和底部宽度的发射极 - 基极 - 集电极掺杂分布类似于NPN。 根据当前增益(Hfe),集电极基极击穿电压(BVceo)和LPNP晶体管的早期电压(VA)的要求,设计人员可以优化各个区域的掺杂特性和面积。 这些优点可能导致LPNP晶体管的面积减小和性能的提高。
    • 23. 发明授权
    • SIM card connector with improved grounding pin
    • SIM卡连接器带有改进的接地引脚
    • US06409529B1
    • 2002-06-25
    • US09875626
    • 2001-06-05
    • Jun Xian LiuShaoping DuJian Qiang Zhang
    • Jun Xian LiuShaoping DuJian Qiang Zhang
    • H01R2900
    • H01R13/2442
    • A Subscriber Identity Module connector (1) includes an insulative housing (10) having a front and a rear rows of recesses (11), a plurality of terminals (20) retained in the recesses with contact portions (21) extending beyond a top surface of the housing for being horizontally exerted on by a SIM card (40), and a grounding pin (30) retained in a front portion of the recess of the rear row with a transitional portion (311) extending upwardly and forwardly beyond the top surface of the housing for being horizontally exerted on by the SIM card. During insertion, a SIM card slides on the grounding pin and exerts horizontal force on the transitional portion of the grounding pin to form the working circuit after the contact pads of the card fully engage with the contact portions of the terminals.
    • 订户身份​​模块连接器(1)包括具有前排和后排凹口(11)的绝缘壳体(10),多个端子(20),其保持在凹部中,接触部分(21)延伸超过顶表面 通过SIM卡(40)水平地施加在外壳上的接地销(30),以及保持在后排的凹部的前部的接地销(30),其具有向上并向前延伸超​​过顶表面的过渡部分(311) 的壳体被水平地施加在SIM卡上。 在插入时,SIM卡在接地引脚上滑动,并在接地引脚的过渡部分施加水平力,以在卡的接触垫与端子的接触部分完全接合之后形成工作电路。
    • 27. 发明申请
    • Contacts of board-to-board connector
    • 板对板连接器的触点
    • US20070218716A1
    • 2007-09-20
    • US11803964
    • 2007-05-16
    • Jun-Xian Liu
    • Jun-Xian Liu
    • H01R12/00
    • H01R13/26H01R12/52H01R12/716
    • An electrical connector assembly includes a socket connector soldered on one circuit board and a plug connector soldered on another circuit board. The socket connector includes an insulating socket base and a plurality of first terminals received in the first terminal-receiving slots of the insulating socket base. Each first terminal successively extends to form a first terminal lead, a first inverted U-shaped portion, a base U-shaped portion and an auxiliary-clamping portion. One leg of the base U-shaped portion includes a first elastic-contact portion. The plug connector includes an insulating plug base and a plurality of second terminals received in the second terminal-receiving slots of the insulating plug base. Each second terminal successively extends to form a second terminal lead and a second inverted U-shaped portion having a second elastic-contact portion. The second inverted U-shaped portion of the second terminal is inserted into the base U-shaped portion of the first terminal, and the first elastic-contact portion contacts the second elastic-contact portion when mating. The invention can provide stable mating and electrical connection and is in compliance with recent downsizing trends.
    • 电连接器组件包括焊接在一个电路板上的插座连接器和焊接在另一个电路板上的插头连接器。 插座连接器包括绝缘插座底座和容纳在绝缘插座底座的第一端子接收槽中的多个第一端子。 每个第一端子依次延伸以形成第一端子引线,第一倒U形部分,基部U形部分和辅助夹紧部分。 基部U形部分的一条腿包括第一弹性接触部分。 插头连接器包括绝缘插头基座和容纳在绝缘插头基座的第二端子接收槽中的多个第二端子。 每个第二端子依次延伸以形成具有第二弹性接触部分的第二端子引线和第二倒U形部分。 第二端子的第二倒U形部分被插入到第一端子的基部U形部分中,并且第一弹性接触部分在配合时接触第二弹性接触部分。 本发明可以提供稳定的配合和电连接,符合最近的缩小趋势。