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    • 23. 发明授权
    • Replication tools and related fabrication methods and apparatus
    • 复制工具及相关制造方法和装置
    • US07833389B1
    • 2010-11-16
    • US11509288
    • 2006-08-24
    • W. Dennis Slafer
    • W. Dennis Slafer
    • C25D1/02
    • G03G13/32B29C35/0888B29C37/0053B29C41/045B29C41/08B29C41/14B29C2035/0827G03F7/24G03H1/028G11B7/265
    • Durable replication tools are disclosed for replication of relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including recording and developing a relief pattern on a selected surface of a support cylinder, creating a durable layer with a complementary relief replica of the pattern, separating the durable layer from the support cylinder. Apparatus are disclosed for fabricating such replication tools, including systems and apparatus for recording a desired relief pattern on a surface of a support cylinder. Also disclosed are electro deposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
    • 公开了耐用的复制工具,用于在所需介质(例如光学记录或数据存储介质)中复制浮雕图案。 公开了制造这种耐久复制工具的方法,包括在支撑圆筒的选定表面上记录和显影浮雕图案,产生具有图案的互补凸版复制品的耐用层,将耐久层与支撑筒分离。 公开了用于制造这种复制工具的装置,包括用于在支撑筒的表面上记录期望的浮雕图案的系统和装置。 还公开了用于形成具有期望的浮雕图案的耐用工具套筒的电沉积池。 复制工具浮雕功能可能具有至微米和纳米方面的关键尺寸。
    • 24. 发明申请
    • METHODS AND SYSTEMS FOR FORMING FLEXIBLE MULTILAYER STRUCTURES
    • 形成柔性多层结构的方法和系统
    • US20090136657A1
    • 2009-05-28
    • US12270650
    • 2008-11-13
    • W. Dennis Slafer
    • W. Dennis Slafer
    • B05D5/12
    • H01Q1/364B82Y10/00B82Y40/00C23C18/1605C23C18/165C25D5/022C25D7/00G03F7/0002Y10T156/1039
    • Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
    • 描述了用于制造具有导电栅格中的导电元件或孔的阵列的多层结构的技术,其可用于在柔性基板上形成频率选择表面(FSS),天线阵列等。 制造技术可以包括使用聚合物掩模或直接电介质成型。 在使用聚合物掩模的实施方案中,在基材上形成临时3D聚合物浮雕图案,并用作掩模或模板以形成所需的图案元素。 在添加工艺中,导电材料沉积在掩模表面上。 沉积后可以通过掩模去除在减法过程中,可以在形成聚合物掩模之前沉积导电层,并且可以蚀刻下面的导电层的暴露部分。 其他实施例使用电介质模制,其中模制结构本身变成FSS结构的整体和永久部分。