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    • 22. 发明授权
    • Highly stable packaging substrates
    • 高度稳定的包装基材
    • US06346296B1
    • 2002-02-12
    • US09396106
    • 1999-09-14
    • Thomas McCarthyMichael WagamanDavid Schwind
    • Thomas McCarthyMichael WagamanDavid Schwind
    • B05D302
    • H01L23/293C08G61/00C08G61/02C08G61/08H01L2924/0002H01L2924/09701H05K1/0313Y10T442/2057H01L2924/00
    • A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.
    • 一种制备高度稳定的包装基材的方法,其中提供了具有第一主链和第一乙炔基的第一前体,以及具有第二主链和第二乙炔基的第二前体。 此外提供了具有第一和第二反应性基团的交联剂。 将第一前体,第二前体,交联剂和溶剂施加到表面上以形成电绝缘层。 第一个乙炔基与第一个碳 - 碳键形成反应中的第一个反应性基团反应,第二个乙炔基在第二个碳 - 碳键形成反应中与第二个反应性基团反应,使第一个主链与第二个主链交联 ,从而形成封装基板。 在另外的步骤中除去溶剂。