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    • 22. 发明授权
    • Surface mounting structure and surface mount type electronic component included therein
    • 其中包括表面安装结构和表面贴装型电子部件
    • US06246013B1
    • 2001-06-12
    • US09536973
    • 2000-03-28
    • Ryuhei YoshidaTsuneo Amano
    • Ryuhei YoshidaTsuneo Amano
    • H05K116
    • H05K1/182H03H9/0514H03H9/0547H03H9/0557H03H9/105H05K3/321
    • A surface mounting structure is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The surface mount type electronic component includes a piezoelectric component element including an insulating substrate, and a piezo-resonator mounted on a mounting surface of the insulating substrate. The piezoelectric component element is mounted on a printed circuit board, with the mounting surface being arranged to face a surface of the printed circuit board. A recess is formed in the printed circuit board and a portion of the piezoelectric component element is accommodated in the recess. A conductive adhesive is located on external connection electrodes provided on the mounting surface and is firmly attached to circuit patterns on the printed circuit board so that the piezoelectric component element is fixed to the printed circuit board. Further, the external connection electrodes are electrically connected to the circuit patterns.
    • 布置表面安装结构以最小化电子部件的高度尺寸。 表面安装型电子部件设置在表面安装结构上。 表面安装型电子部件包括具有绝缘基板的压电元件元件和安装在绝缘基板的安装面上的压电谐振器。 压电元件安装在印刷电路板上,安装表面设置成面对印刷电路板的表面。 在印刷电路板中形成凹部,并且压电元件的一部分容纳在凹部中。 导电粘合剂位于设置在安装表面上的外部连接电极上,并牢固地附着在印刷电路板上的电路图案上,使压电元件固定在印刷电路板上。 此外,外部连接电极电连接到电路图案。