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21. 发明申请

US20080136025A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20080136025A1
公开(公告)日：2008-06-12
申请号：US12068066
申请日：2008-02-01
申请人： Yoshifumi Nakamura , Junichi Ueno , Hiroyuki Imamura , Takayuki Tanaka
发明人： Yoshifumi Nakamura , Junichi Ueno , Hiroyuki Imamura , Takayuki Tanaka
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L23/49838 , H01L23/4985 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15173 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device in accordance with the present invention is a mounted body of a semiconductor chip with a plurality of electrode pads arranged in a plurality of stages and a tape wiring board, the average pitch of the electrode pads on the entire semiconductor chip can be reduced, while ensuring stable connectivity, by leading together to the outside of the semiconductor chip two or more wirings of the tape wiring board connected to the electrode pads on the inner side between the electrode pads arranged in a row on the outer periphery of the semiconductor chip.
摘要翻译：根据本发明的半导体器件是具有多个布置在多个级中的多个电极焊盘的半导体芯片的安装体和带状布线板，可以减少整个半导体芯片上的电极焊盘的平均间距同时确保稳定的连接性，通过将半导体芯片的外部引导到与半导体芯片的外周排列成一排的电极焊盘之间的内侧的电极焊盘连接的带状配线基板的两条或更多条布线。

22. 发明授权

US06729941B2 Process for manufacturing semiconductor wafer and semiconductor wafer 有权
标题翻译：制造半导体晶片和半导体晶片的工艺
公开(公告)号：US06729941B2
公开(公告)日：2004-05-04
申请号：US09926731
申请日：2001-12-10
申请人： Junichi Ueno , Hisashi Masumura , Hiromasa Hashimoto
发明人： Junichi Ueno , Hisashi Masumura , Hiromasa Hashimoto
IPC分类号： B24B722
CPC分类号： H01L21/02008 , B24B37/042 , B24B37/24 , B24D3/28 , H01L21/02024
摘要： The present invention provides a process for manufacturing a semiconductor wafer capable of effectively reducing unevenness having a wavelength of 0.5 mm or more which remains on a surface of the semiconductor wafer after a first polishing step and improving flatness thereof; and a semiconductor wafer manufactured by the manufacturing process. The manufacturing process comprises: plural polishing steps including a first polishing step and a final polishing step; and a corrective polishing step performed after the first polishing step using a polishing cloth harder than that used in the first polishing step.
摘要翻译：本发明提供一种半导体晶片的制造方法，其能够有效地减少在第一研磨工序后残留在半导体晶片的表面上的波长为0.5mm以上的波长的凹凸，并提高其平坦度。以及通过制造工艺制造的半导体晶片。制造方法包括：多个抛光步骤，包括第一抛光步骤和最终抛光步骤; 以及在第一抛光步骤之后使用比在第一抛光步骤中使用的抛光布更硬的抛光布进行的校正抛光步骤。

23. 发明授权

US4574283A Data transmission system for use in an air conditioning control apparatus 失效
标题翻译：用于空调控制装置的数据传输系统
公开(公告)号：US4574283A
公开(公告)日：1986-03-04
申请号：US451648
申请日：1982-12-20
申请人： Mutsumi Arakawa , Junichi Ueno , Yozo Kawaguchi , Norio Shimura , Shoichi Matsunaga , Kiyoshi Fukaya
发明人： Mutsumi Arakawa , Junichi Ueno , Yozo Kawaguchi , Norio Shimura , Shoichi Matsunaga , Kiyoshi Fukaya
IPC分类号： F24F11/02 , F24F11/00 , H04L1/00 , H04L12/40 , H04Q9/00 , H04Q9/14 , F24F3/00
CPC分类号： H04L1/0083 , F24F11/0009
摘要： In a data transmission system having a main controller for transmitting polling messages in a polling sequence and a plurality of terminal controllers responsive to a polling message to transmit data to the main controller, the finally polled terminal controller transmitting an END code for informing the main controller of the end of data transmission.
摘要翻译：在具有用于在轮询序列中发送轮询消息的主控制器和响应于轮询消息以向主控制器发送数据的多个终端控制器的数据传输系统中，最终被轮询的终端控制器发送用于通知主控制器的END代码的数据传输结束。

24. 发明授权

US08659254B2 Servo system, servo motor driving device, safety unit and method for controlling servo system 有权
标题翻译：伺服系统，伺服电机驱动装置，安全装置及控制伺服系统的方法
公开(公告)号：US08659254B2
公开(公告)日：2014-02-25
申请号：US13020130
申请日：2011-02-03
申请人： Junichi Ueno
发明人： Junichi Ueno
IPC分类号： G05B23/02 , G01D5/245
CPC分类号： G05B19/4062 , G05B9/02 , G05B19/18 , G05B2219/33221 , G05B2219/42306
摘要： A servo driver sets an instruction value for an operation of a servo motor based on an instruction signal from a controller. The servo driver sends the instruction value and a feedback value obtained based on a feedback signal to a safety unit. When at least one of the instruction value and the feedback value sent by the servo driver has an abnormal value, an STO signal is generated and sent to the servo driver. When the STO signal is input to the servo driver, the servo driver stops the supply of electricity to the servo motor.
摘要翻译：伺服驱动器基于来自控制器的指示信号设定用于伺服电动机的操作的指令值。伺服驱动器将指令值和基于反馈信号获得的反馈值发送到安全单元。当伺服驱动器发送的指令值和反馈值中的至少一个具有异常值时，产生STO信号并发送给伺服驱动器。当STO信号输入到伺服驱动器时，伺服驱动器停止向伺服电机供电。

25. 发明申请

US20120329373A1 DOUBLE-SIDE POLISHING APPARATUS 有权
标题翻译：双面抛光装置
公开(公告)号：US20120329373A1
公开(公告)日：2012-12-27
申请号：US13509696
申请日：2010-11-16
申请人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
发明人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
IPC分类号： B24B49/00 , B24B7/00
CPC分类号： B24B37/013 , B24B37/08
摘要： A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.
摘要翻译：一种双面抛光装置，其至少包括：上下转台，每个具有附着在其上的抛光垫; 具有形成在其中用于将晶片保持在上下转台之间的保持孔的载体; 用于在抛光期间检测晶片的厚度的传感器，所述传感器设置在设置在所述上转台上的通孔中，所述通孔沿上转盘旋转轴线的方向; 以及用于保持传感器的传感器保持器，其中传感器保持器的材料是石英。结果，提供了一种双面抛光装置，其可以通过可靠地抑制由于在晶片抛光期间产生的热的影响而可靠地抑制传感器保持器的变形，从而可以减少与目标晶片厚度的差异，从而抛光晶片。

26. 发明授权

US08118646B2 Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method 有权
标题翻译：双面抛光装置的载体，使用它的双面研磨装置和双面抛光方法
公开(公告)号：US08118646B2
公开(公告)日：2012-02-21
申请号：US13055302
申请日：2009-07-23
申请人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
发明人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
IPC分类号： B24B1/00
CPC分类号： B24B37/28
摘要： A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.
摘要翻译：一种用于双面抛光装置的载体，其至少包括：设置在上下匝台之间的载体基座，所述载体基座在其中具有保持孔，所述保持孔保持夹在所述上下转台之间的所述晶片。环形树脂环沿着保持孔的内周设置，树脂环通过与保持晶片的倒角部分接触来保护倒角部分，其中树脂环在其内周上具有凹槽，上部并且在凹槽中形成下锥形表面。使用该载体的双面研磨装置和能够减少抛光面的锥形的产生的双面研磨方法，能够在抑制晶片的外周凹陷的产生的同时提高平坦度。

27. 发明申请

US20110221377A1 SERVO SYSTEM, SERVO MOTOR DRIVING DEVICE, SAFETY UNIT AND METHOD FOR CONTROLLING SERVO SYSTEM 有权
标题翻译：伺服系统，伺服电机驱动装置，安全装置及控制伺服系统的方法
公开(公告)号：US20110221377A1
公开(公告)日：2011-09-15
申请号：US13020130
申请日：2011-02-03
申请人： Junichi UENO
发明人： Junichi UENO
IPC分类号： G05B23/02
CPC分类号： G05B19/4062 , G05B9/02 , G05B19/18 , G05B2219/33221 , G05B2219/42306
摘要： A servo driver sets an instruction value for an operation of a servo motor based on an instruction signal from a controller. The servo driver sends the instruction value and a feedback value obtained based on a feedback signal to a safety unit. When at least one of the instruction value and the feedback value sent by the servo driver has an abnormal value, an STO signal is generated and sent to the servo driver. When the STO signal is input to the servo driver, the servo driver stops the supply of electricity to the servo motor.
摘要翻译：伺服驱动器基于来自控制器的指示信号设定用于伺服电动机的操作的指令值。伺服驱动器将指令值和基于反馈信号获得的反馈值发送到安全单元。当伺服驱动器发送的指令值和反馈值中的至少一个具有异常值时，产生STO信号并发送给伺服驱动器。当STO信号输入到伺服驱动器时，伺服驱动器停止向伺服电机供电。

28. 发明申请

US20110104995A1 CARRIER FOR A DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING APPARATUS USING THIS CARRIER, AND DOUBLE-SIDE POLISHING METHOD 有权
标题翻译：双面抛光装置的承载器，使用该载体的双面抛光装置和双面抛光方法
公开(公告)号：US20110104995A1
公开(公告)日：2011-05-05
申请号：US12863674
申请日：2009-02-16
申请人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
发明人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/28 , B24B37/042 , B24B37/08
摘要： A carrier for a double-side polishing apparatus comprising at least: a metallic carrier base that is arranged between upper and lower turn tables having polishing pads attached thereto and has a holding hole formed therein to hold a wafer sandwiched between the upper and lower turn tables at the time of polishing; and a ring-like resin insert that is arranged along an inner peripheral portion of the holding hole of the carrier base and is in contact with a peripheral portion of the held wafer, wherein an inner peripheral end portion of the holding hole of the carrier base has an upwardly opening tapered surface, an outer peripheral portion of the ring-like insert has a reverse tapered surface with respect to the tapered surface of the holding hole of the carrier base, and the resin insert is fitted in the holding hole of the carrier base through the tapered surface.
摘要翻译：一种用于双面抛光装置的载体，至少包括：金属载体基座，其布置在上下转台之间，具有安装在其上的抛光垫，并具有形成在其中的保持孔，以夹持夹在上下转台之间的晶片抛光时; 以及环状树脂插入件，其沿着所述承载基座的保持孔的内周部配置并与所述保持晶片的周边部分接触，其中，所述承载器基座的所述保持孔的内周端部具有向上开口的锥形表面，环形插入件的外周部分相对于承载器基座的保持孔的锥形表面具有倒锥形表面，并且树脂插入件装配在载体的保持孔中基部通过锥形表面。

29. 发明申请

US20090124175A1 Double-Side Polishing Method for Wafer 失效
标题翻译：晶圆双面抛光方法
公开(公告)号：US20090124175A1
公开(公告)日：2009-05-14
申请号：US11988830
申请日：2006-06-28
申请人： Junichi Ueno , Syuichi Kobayashi
发明人： Junichi Ueno , Syuichi Kobayashi
IPC分类号： B24B1/00 , B24B7/26 , B24B57/02
CPC分类号： B24B37/08 , H01L21/02024
摘要： There is provided a double-side polishing method for a wafer of sandwiching a wafer held in a carrier between upper and lower turn tables each having a polishing pad attached thereto and simultaneously polishing both surfaces of the wafer while supplying a slurry to a space between the upper and lower turn tables from a plurality of slurry supply holes provided in the upper turn table, wherein a polishing amount at an outer peripheral portion of the wafer to be polished is adjusted and outer peripheral sag of the wafer is suppressed by supplying the slurry in such a manner that an amount of the slurry supplied from the slurry supply holes provided on an outer side relative to the center of rotation of the upper turn table becomes larger than an amount of the slurry supplied from the slurry supply holes provided on an inner side relative to the same at the time of polishing both the surfaces of the wafer. As a result, the double-side polishing method which can suppress occurrence of the outer peripheral sag of the wafer when the wafer is subjected to double-side polishing can be provided.
摘要翻译：提供了一种用于将保持在载具上的晶片夹持在上下转台之间的晶片的双面抛光方法，每个晶片具有附接到其上的抛光垫，同时抛光晶片的两个表面，同时将浆料供应到设置在上转台中的多个浆料供给孔的上下转盘，其中调整抛光晶片的外周部分的抛光量，并通过将浆料供给来抑制晶片的外周下垂从设置在上转台的旋转中心的外侧的浆料供给孔供给的浆料的量比从设置在内侧的浆料供给孔供给的浆料的量大相对于在抛光晶片的两个表面时相同。结果，可以提供可以抑制当晶片进行双面抛光时晶片的外周下垂的发生的双面研磨方法。

30. 发明授权

US07119514B2 Inverter 有权
标题翻译：逆变器
公开(公告)号：US07119514B2
公开(公告)日：2006-10-10
申请号：US11335434
申请日：2006-01-18
申请人： Hiroshi Shimizu , Junichi Ueno , Kimikazu Kubo , Takashi Asai , Masakazu Komatsu , Yasuyuki Tagano , Toshiyuki Ozaki
发明人： Hiroshi Shimizu , Junichi Ueno , Kimikazu Kubo , Takashi Asai , Masakazu Komatsu , Yasuyuki Tagano , Toshiyuki Ozaki
IPC分类号： H02P5/34
CPC分类号： G05B23/0235
摘要： An inverter has a measuring part that measures an operating time such as the time interval from when a command to start a specified operation by an associated system until a signal indicating the completion of the operation is received. A comparing part compares this measured operating time with a threshold value stored in a memory and an abnormal condition is reported to a host system, depending on the result of the comparison.
摘要翻译：逆变器具有测量部件，其测量诸如从相关联的系统开始指定操作的命令之间的时间间隔，直到接收到指示操作完成的信号为止的操作时间。比较部分将该测量的操作时间与存储在存储器中的阈值进行比较，并且根据比较的结果将异常状况报告给主机系统。

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