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21. 发明申请

US20120243223A1 LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置包装
公开(公告)号：US20120243223A1
公开(公告)日：2012-09-27
申请号：US13411094
申请日：2012-03-02
申请人： Jae Sung YOU
发明人： Jae Sung YOU
IPC分类号： F21V13/04 , F21V7/04 , F21V7/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014
摘要： There is provided a light emitting device package, including at least one light emitting device; a lead frame electrically connected to the light emitting device; a body part supporting the light emitting device and the lead frame and including a cavity opened so as to expose the light emitting device and the lead frame; a reflecting part fitted and fixed into the cavity so as to surround the light emitting device; and a sealing part filled in the reflecting part and sealing the light emitting device.
摘要翻译：提供了一种发光器件封装，包括至少一个发光器件; 电连接到所述发光器件的引线框架; 支撑所述发光装置和所述引线框架的主体部分，并且包括敞开以使所述发光装置和所述引线框架露出的空腔; 反射部分，其被安装并固定到所述腔中以围绕所述发光器件; 以及填充在反射部中并密封发光器件的密封部。

22. 发明授权

US08785953B2 Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof 有权
标题翻译：发光二极管及其制造方法，发光二极管模块及其制造方法
公开(公告)号：US08785953B2
公开(公告)日：2014-07-22
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

23. 发明授权

US08564005B2 Light-emitting device package 失效
标题翻译：发光装置封装
公开(公告)号：US08564005B2
公开(公告)日：2013-10-22
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
IPC分类号： H01L33/50
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译：一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。

24. 发明申请

US20130003342A1 CAMERA FLASH MODULE 有权
标题翻译：相机闪光模组
公开(公告)号：US20130003342A1
公开(公告)日：2013-01-03
申请号：US13540127
申请日：2012-07-02
申请人： Jae Sung YOU
发明人： Jae Sung YOU
IPC分类号： F21V13/04
CPC分类号： G03B15/05 , G03B2215/0582 , G03B2215/0592
摘要： A camera flash module is provided. The camera flash module may include a lens having a single refractive surface and a reflector that adjusts a direction of a light emitted from the lens. Accordingly, maintaining of a distance between a light emitting device and the lens may not be needed and thus, the camera flash module may be readily manufactured and a productivity may be improved. An error rate caused by distortion in a tilt and an optical axis between the light emitting device and the lens may be reduced. The reflector may adjust a direction of a light emitted from the lens and thus, an emission pattern requested by a camera may be satisfied, and a velocity of light may be improved. The reflector may surround the lens and thus, may prevent the lens from being detached from a light emitting device package body when an external impact occurs.
摘要翻译：提供相机闪光灯模块。相机闪光灯模块可以包括具有单个折射表面的透镜和调节从透镜发射的光的方向的反射器。因此，可能不需要维持发光装置和透镜之间的距离，因此可以容易地制造照相机闪光灯模块并且可以提高生产率。可以减少由发光器件和透镜之间的倾斜和光轴的失真引起的误差率。反射器可以调节从透镜发射的光的方向，从而可以满足由照相机请求的发射图案，并且可以提高光速。反射器可以围绕透镜，因此，当外部冲击发生时，可以防止透镜从发光器件封装体脱离。

25. 发明申请

US20120176801A1 FLASH LENS AND FLASH MODULE EMPLOYING THE SAME 审中-公开
标题翻译：闪光灯和使用其的闪光灯组件
公开(公告)号：US20120176801A1
公开(公告)日：2012-07-12
申请号：US13312268
申请日：2011-12-06
申请人： Jae-sung YOU
发明人： Jae-sung YOU
IPC分类号： F21V5/04
CPC分类号： G03B15/05 , G03B2215/0567 , H01L33/58
摘要： A flash lens and a flash module. The flash lens includes a circular first incidence surface on which light emitted from a light source in a center direction is incident; a second incidence surface arranged to be tilted with respect to an optical axis and on which light emitted from the light source in a lateral direction is incident; a reflective surface that reflects light incident from the second incidence surface; a bottom surface that connects the second incidence surface and the reflective surface; and a circular emission surface that emits light transmitted through the first incidence surface and light reflected by the reflective surface. The flash module includes an LED chip; and the flash lens of claim 1 that is arranged above the LED chip.
摘要翻译：闪光灯镜头和闪光灯模块。闪光灯透镜包括从中心方向从光源发射的光入射的圆形第一入射面; 第二入射面，被布置成相对于光轴倾斜，并且沿着横向方向从光源发射的光入射; 反射从第二入射面入射的光的反射面; 连接第二入射表面和反射表面的底表面; 以及发出透过第一入射面的光和被反射面反射的光的圆形发射面。闪光灯模块包括一个LED芯片; 以及布置在LED芯片上方的权利要求1所述的闪光镜头。

26. 发明申请

US20120168798A1 LED PACKAGE 审中-公开
标题翻译： LED封装
公开(公告)号：US20120168798A1
公开(公告)日：2012-07-05
申请号：US13226090
申请日：2011-09-06
申请人： Cheon Ho Park , Jae Sung You
发明人： Cheon Ho Park , Jae Sung You
IPC分类号： H01L33/58
CPC分类号： H01L33/58
摘要： A light emitting device (LED) package is disclosed. The light emitting device package includes a light emitting device, a substrate on which the light emitting device is mounted in plural; and a lens mounted on the substrate so as to cover and seal the light emitting device and having an accommodating groove formed in a lower surface thereof contacting the substrate, the accommodating groove accommodating the light emitting device, and a concave portion formed in an upper surface thereof in such a manner as to be disposed at a position corresponding to the light emitting device, wherein the concave portion has a radius of curvature on an optical axis of the lens and is formed to be depressed from the upper surface to the lower surface.
摘要翻译：公开了一种发光器件（LED）封装。发光器件封装包括发光器件，多个安装有发光器件的衬底; 以及安装在基板上的透镜，以覆盖和密封发光器件，并且具有形成在其与接触基板的下表面中的容纳槽，容纳发光器件的容纳槽和形成在上表面中的凹部其设置在与发光装置相对应的位置，其中凹部具有在透镜的光轴上的曲率半径，并且形成为从上表面到下表面压下。

27. 发明授权

US08927305B2 Method of manufacturing light emitting device 有权
标题翻译：制造发光器件的方法
公开(公告)号：US08927305B2
公开(公告)日：2015-01-06
申请号：US13562019
申请日：2012-07-30
申请人： Jong Sup Song , Jae Sung You , Tae Gyu Kim
发明人： Jong Sup Song , Jae Sung You , Tae Gyu Kim
IPC分类号： H01L21/00 , H01L33/52 , H01L33/50
CPC分类号： H01L33/52 , H01L33/505 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
摘要： There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.
摘要翻译：提供一种制造发光器件的方法，该方法包括：将多个发光器件安装在粘合剂层上; 使用按压构件将多个发光装置的上表面布置成水平布置; 通过施加包括至少一种荧光体材料的树脂来形成覆盖所述粘合剂层上的所述多个发光器件的波长转换部分; 使用所述按压部件对所述波长转换部的上表面进行平面化; 以及从所述多个发光器件分离所述粘合剂层。

28. 发明授权

US08841693B2 Light emitting device package and manufacturing method thereof 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US08841693B2
公开(公告)日：2014-09-23
申请号：US13427575
申请日：2012-03-22
申请人： Jae Sung You , Young Hee Song
发明人： Jae Sung You , Young Hee Song
IPC分类号： H01L33/00 , H01L33/50 , H01L23/00 , H01L33/64 , H01L33/62 , H01L33/48
CPC分类号： H01L33/505 , H01L24/32 , H01L33/486 , H01L33/504 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/15787 , H01L2933/0033 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： There is provided a light emitting device package including: a substrate having a cavity formed therein; a heat sink provided on a bottom surface of the cavity to be adjacent to an inner wall of the cavity; a light emitting device mounted on the heat sink; and a phosphor layer provided within the cavity and covering the heat sink and the light emitting device.
摘要翻译：提供了一种发光器件封装，包括：其中形成有腔的衬底; 散热器，设置在所述空腔的底表面上以与所述空腔的内壁相邻; 安装在散热器上的发光器件; 以及设置在所述腔内并覆盖所述散热器和所述发光器件的荧光体层。

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