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21. 发明授权

US08390087B2 Image sensor package structure with large air cavity 有权
标题翻译：图像传感器封装结构具有大气腔
公开(公告)号：US08390087B2
公开(公告)日：2013-03-05
申请号：US12683546
申请日：2010-01-07
申请人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nam Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
发明人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nam Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L24/73 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/15311 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.
摘要翻译：本发明公开了一种具有大空气腔的图像传感器封装结构。图像传感器封装结构包括基板，芯片，盖和封装材料。芯片与基板结合。盖的塑料片粘附到芯片上，并且盖的透明盖与塑料片组合以在芯片的增感区域上提供覆盖物以形成空气腔。封装材料布置在基板上并封装在芯片和盖子周围。具有预定厚度的塑料片可以增加透明盖和芯片之间的距离，以扩大空气腔。因此，可以提高图像传感器封装结构的图像感测效果，并且可以最小化由多次折射和多次反射引起的重影图像问题。

22. 发明授权

US08093674B2 Manufacturing method for molding image sensor package structure and image sensor package structure thereof 有权
标题翻译：图像传感器封装结构和图像传感器封装结构的制造方法
公开(公告)号：US08093674B2
公开(公告)日：2012-01-10
申请号：US12603591
申请日：2009-10-22
申请人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nan Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
发明人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nan Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
IPC分类号： H01L31/02
CPC分类号： H01L31/0203 , H01L24/97 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.
摘要翻译：公开了一种用于模制图像传感器封装结构的制造方法及其图像传感器封装结构。该制造方法包括以下步骤：提供用于封装的半成品图像传感器，在半成品图像传感器的透明盖的外围设置坝，将半成品图像传感器定位在模具内，以及注入模具复合成模具的模腔。大坝布置在透明盖的顶表面上，模具的内表面可以与坝的顶表面精确接触，从而防止注入模腔中的模具复合体被大坝溢出到透明盖。此外，大坝和模具化合物的布置可以增加包装区域，并将堵塞扩大到侵入性水分，从而提高图像传感器封装结构的可靠性。

23. 发明申请

US20110293992A1 BATTERY CONNECTION TOPOLOGY 有权
标题翻译：电池连接拓扑
公开(公告)号：US20110293992A1
公开(公告)日：2011-12-01
申请号：US12788380
申请日：2010-05-27
申请人： Chih-Cheng Hsu , Rebecca S. Ratz
发明人： Chih-Cheng Hsu , Rebecca S. Ratz
IPC分类号： H01M6/46
CPC分类号： H01M2/206 , H01M10/0525 , H01M10/42
摘要： A battery module comprising a plurality of battery cells arranged in a stacked configuration, each of the battery cells including a first terminal disposed on a first end of the battery cell and a second terminal disposed on a second end of the battery cell, wherein the first terminal of at least one of the battery cells is in direct electrical communication with the second terminal of another non-adjacent one of the battery cells.
摘要翻译：一种电池模块，包括以堆叠配置布置的多个电池单元，每个电池单元包括设置在电池单元的第一端上的第一端子和设置在电池单元的第二端上的第二端子，其中第一至少一个电池单元的端子与另一个不相邻的一个电池单元的第二端子直接电连通。

24. 发明申请

US20110274957A1 SECONDARY BATTERY MODULE AND COMPOSITE ARTICLE THEREOF 有权
标题翻译：二次电池模块及其复合材料
公开(公告)号：US20110274957A1
公开(公告)日：2011-11-10
申请号：US12773182
申请日：2010-05-04
申请人： Kuo-Huey Chen , Taeyoung Han , Bahram Khalighi , Chih-Cheng Hsu , Herman K. Phlegm , Robert D. Drexler
发明人： Kuo-Huey Chen , Taeyoung Han , Bahram Khalighi , Chih-Cheng Hsu , Herman K. Phlegm , Robert D. Drexler
IPC分类号： H01M10/50
CPC分类号： B32B15/04 , B32B7/12 , B32B9/007 , B32B9/041 , B32B15/20 , B32B2250/40 , B32B2307/202 , B32B2307/302 , B32B2307/702 , B32B2307/704 , B32B2307/732 , B32B2457/10 , C09K5/14 , H01M10/613 , H01M10/647 , H01M10/653 , H01M10/6555
摘要： A composite article for dissipating thermal energy from a secondary battery cell includes a first graphite layer, a second graphite layer spaced away from and arranged parallel to the first graphite layer, and a metal layer sandwiched between and disposed in contact with each of the first graphite layer and the second graphite layer. The composite article has a thermal conductivity of greater than or equal to about 1,200 W/mK and an electrical conductivity of greater than or equal to about 10,000 S/cm. A secondary battery module includes the composite article and a secondary battery cell having a length and an average measurable temperature along the length during operation of the secondary battery module. The composite article is disposed adjacent and in contact with the secondary battery cell to thereby dissipate thermal energy from the secondary battery cell during operation of the secondary battery module.
摘要翻译：用于从二次电池单元散发热能的复合制品包括第一石墨层，与第一石墨层间隔开并且与第一石墨层平行布置的第二石墨层，以及夹在第一石墨层和第一石墨层之间并与之配置的金属层层和第二石墨层。复合制品具有大于或等于约1200W / mK的导热系数和大于或等于约10,000S / cm的电导率。二次电池模块包括复合制品和在二次电池模块的操作期间沿长度具有长度和平均可测量温度的二次电池单元。复合制品被布置成与二次电池单元相邻并接触，从而在二次电池模块的操作期间从二次电池单元散发热能。

25. 发明申请

US20110241146A1 MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MODULE WITH PACKAGE STRUCTURE 失效
标题翻译：具有封装结构的WAFER LEVEL IMAGE传感器模块的制造方法和结构
公开(公告)号：US20110241146A1
公开(公告)日：2011-10-06
申请号：US13010880
申请日：2011-01-21
申请人： Hsiu-Wen Tu , Chung-Hsien Hsin , Han-Hsing Chen , Ming-Hui Chen , Ren-Long Kuo , Chih-Cheng Hsu , Young-Houng Shiao , Tsao-Pin Chen
发明人： Hsiu-Wen Tu , Chung-Hsien Hsin , Han-Hsing Chen , Ming-Hui Chen , Ren-Long Kuo , Chih-Cheng Hsu , Young-Houng Shiao , Tsao-Pin Chen
IPC分类号： H01L31/0232 , H01L31/18 , H01L31/0203 , H01L31/0224
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L27/14687 , H01L2224/13 , H01L2924/181 , H01L2924/00
摘要： The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.
摘要翻译：本发明公开了一种具有封装结构的晶片级图像传感器模块的制造方法和结构。具有封装结构的晶片级图像传感器模块的结构包括半成品，多个焊球和密封剂。半成品包括图像感测芯片和晶片级透镜组件。密封剂设置在图像感测芯片和晶片级透镜组件的侧面上。此外，制造方法包括以下步骤：提供硅晶片，切割硅晶片，提供透镜组件晶片，制造多个半成品，执行封装工艺，安装焊球以及切割密封剂。因此，密封剂通过设置在其两侧而封装每个半成品。

26. 发明申请

US20110024862A1 IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY 有权
标题翻译：具有大气压的图像传感器包装结构
公开(公告)号：US20110024862A1
公开(公告)日：2011-02-03
申请号：US12683546
申请日：2010-01-07
申请人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nam Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
发明人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nam Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L24/73 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2924/15311 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.
摘要翻译：本发明公开了一种具有大空气腔的图像传感器封装结构。图像传感器封装结构包括基板，芯片，盖和封装材料。芯片与基板结合。盖的塑料片粘附到芯片上，并且盖的透明盖与塑料片组合以在芯片的增感区域上提供覆盖物以形成空气腔。封装材料布置在基板上并封装在芯片和盖子周围。具有预定厚度的塑料片可以增加透明盖和芯片之间的距离，以扩大空气腔。因此，可以提高图像传感器封装结构的图像感测效果，并且可以最小化由多次折射和多次反射引起的重影图像问题。

27. 发明申请

US20110024861A1 MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND IMAGE SENSOR PACKAGE STRUCTURE THEREOF 有权
标题翻译：图像传感器封装结构和图像传感器封装结构的制造方法
公开(公告)号：US20110024861A1
公开(公告)日：2011-02-03
申请号：US12603591
申请日：2009-10-22
申请人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nam Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
发明人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nam Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
IPC分类号： H01L31/02 , H01L31/18
CPC分类号： H01L31/0203 , H01L24/97 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.
摘要翻译：公开了一种用于模制图像传感器封装结构的制造方法及其图像传感器封装结构。该制造方法包括以下步骤：提供用于封装的半成品图像传感器，在半成品图像传感器的透明盖的外围设置坝，将半成品图像传感器定位在模具内，以及注入模具复合成模具的模腔。大坝布置在透明盖的顶表面上，模具的内表面可以与坝的顶表面精确接触，从而防止注入模腔中的模具复合体被大坝溢出到透明盖。此外，大坝和模具化合物的布置可以增加包装区域，并将堵塞扩大到侵入性水分，从而提高图像传感器封装结构的可靠性。

28. 发明申请

US20110024610A1 IMAGE SENSOR PACKAGE STRUCTURE 有权
标题翻译：图像传感器包装结构
公开(公告)号：US20110024610A1
公开(公告)日：2011-02-03
申请号：US12579493
申请日：2009-10-15
申请人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nan Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
发明人： Hsiu-Wen Tu , Ren-Long Kuo , Young-Houng Shiao , Tsao-Pin Chen , Mon-Nan Ho , Chih-Cheng Hsu , Chin-Fu Lin , Chung-Hsien Hsin
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L23/04 , H01L23/10 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.
摘要翻译：本发明公开了一种图像传感器封装结构。图像传感器封装结构包括基板，芯片，透明盖，第一壳体和封装材料。透明盖子覆盖了芯片的敏化区域，并且还粘附在衬底上的芯片上。附着在透明盖上的第一壳体形成开口，使得光线可以穿过开口和透明盖子进入致敏区域。封装材料围绕芯片和透明盖子覆盖并填充在基板和第一壳体之间。由于布置在第一壳体和透明盖之间以及透明盖和芯片之间的粘合剂层的布置，所以来自湿气的阻塞区域被拉长。因此，可以提高图像传感器封装结构的可靠性。

29. 发明申请

US20100052360A1 Door Assembly and Method for a Vehicle 有权
标题翻译：车门和车辆方法
公开(公告)号：US20100052360A1
公开(公告)日：2010-03-04
申请号：US12199136
申请日：2008-08-27
申请人： Chih-Cheng Hsu , Albert H. Butlin , John E. Carsley , Hui-Min Huang , Stephen R. Koshorek , John N. Owens
发明人： Chih-Cheng Hsu , Albert H. Butlin , John E. Carsley , Hui-Min Huang , Stephen R. Koshorek , John N. Owens
IPC分类号： B62D25/04
CPC分类号： B60R21/0428 , B60J5/0437 , B60J5/044 , B60J5/0455 , B60R2021/0006
摘要： A door assembly for a vehicle includes an outer panel. A support panel is operatively connected to the outer panel and configured such that the support panel provides bending resistance to the outer panel when the outer panel is deflected toward the support panel during a first deflection distance of the outer panel. A cable is operatively connected in the door assembly between a first end and a second end of the outer panel such that the cable provides additional bending resistance to the outer panel when the outer panel is deflected toward the support panel during a second deflection distance of the outer panel, greater than the first deflection distance.
摘要翻译：用于车辆的门组件包括外板。支撑面板可操作地连接到外部面板并且构造成使得当外部面板在外部面板的第一偏转距离期间偏转到支撑面板时，支撑面板向外部面板提供抗弯曲性。电缆在门组件中可操作地连接在外板的第一端和第二端之间，使得当外板在外板的第二偏转距离期间朝向支撑板偏转时，电缆向外板提供额外的弯曲阻力外面板，大于第一偏转距离。

30. 发明授权

US07409386B2 Method and apparatus for executing a query on dynamic properties of objects in a database 失效
标题翻译：用于执行对数据库中对象的动态属性的查询的方法和装置
公开(公告)号：US07409386B2
公开(公告)日：2008-08-05
申请号：US11743096
申请日：2007-05-01
申请人： George F. Hongell , Chih-Cheng Hsu , Harisch R. Nayak , David J. Wisneski
发明人： George F. Hongell , Chih-Cheng Hsu , Harisch R. Nayak , David J. Wisneski
IPC分类号： G06F17/30 , G06F9/44
CPC分类号： G06F17/30607 , Y10S707/954 , Y10S707/955 , Y10S707/99932 , Y10S707/99933 , Y10S707/99934
摘要： Methods and apparatus for executing a query on dynamic properties of a plurality of objects in a database are provided. In one implementation, the method includes obtaining a query; determining that a first portion of the query comprises a method for accessing a dynamic property of the plurality of objects; obtaining mapping data associated with the dynamic property of the plurality of objects, the mapping data mapping the dynamic property to a pre-determined location in the database; translating the first portion of the query in accordance with the mapping data such that the first portion of the query is executable against the pre-determined location in the database without creating instances of the plurality of objects; executing the query including executing the translated first portion of the query without creating instances of the plurality of objects; and displaying a result of the executed query to a user.
摘要翻译：提供了用于执行对数据库中的多个对象的动态属性的查询的方法和装置。在一个实现中，该方法包括获得查询; 确定所述查询的第一部分包括用于访问所述多个对象的动态属性的方法; 获取与所述多个对象的动态属性相关联的映射数据，所述映射数据将所述动态属性映射到所述数据库中的预定位置; 根据所述映射数据翻译所述查询的第一部分，使得所述查询的所述第一部分可针对所述数据库中的预定位置执行，而不创建所述多个对象的实例; 执行所述查询，包括执行所述查询的所转换的第一部分而不创建所述多个对象的实例; 并将所执行的查询的结果显示给用户。

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