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21. 发明申请

US20070089504A1 Gas flow measuring apparatus 审中-公开
标题翻译：气体流量计
公开(公告)号：US20070089504A1
公开(公告)日：2007-04-26
申请号：US11483549
申请日：2006-07-11
申请人： Keiji Hanzawa , Satoshi Shimada , Akio Yasukawa , Naoki Saito , Keiichi Nakada , Izumi Watanabe
发明人： Keiji Hanzawa , Satoshi Shimada , Akio Yasukawa , Naoki Saito , Keiichi Nakada , Izumi Watanabe
IPC分类号： G01F1/68
CPC分类号： G01F1/6845 , G01F1/692 , H01L2924/0002 , H01L2924/00
摘要： A gas flow measuring apparatus includes a detecting element including a heating resistor and a thermo-sensitive resistor disposed on a diaphragm and external terminals connected to the heating resistor and the thermo-sensitive resistor, and a flow rate detecting unit which controls heating temperature of the heating resistor and which detects a flow rate of gas according to a change in a resistance value of the heating resistor or the thermo-sensitive resistor. The detecting element includes a resistor area in which the heating resistor and the thermo-sensitive resistor are formed and a fixed section area in which the external terminals are formed. A stress mitigating unit is formed between the resistor area and the fixed section area.
摘要翻译：一种气体流量测量装置，包括检测元件，该检测元件包括加热电阻器和设置在隔膜上的热敏电阻器和连接到加热电阻器和热敏电阻器的外部端子，以及流量检测单元，其控制加热电阻器，其根据加热电阻器或热敏电阻器的电阻值的变化来检测气体的流量。检测元件包括其中形成有加热电阻器和热敏电阻器的电阻器区域和形成有外部端子的固定部分区域。在电阻器区域和固定部分区域之间形成减压单元。

22. 发明授权

US07062964B2 Heating resistor type flow measuring device 有权
标题翻译：加热电阻式流量测量装置
公开(公告)号：US07062964B2
公开(公告)日：2006-06-20
申请号：US10478325
申请日：2001-05-24
申请人： Naoki Saito , Masayuki Kozawa , Shinya Igarashi , Hiromu Kikawa , Akio Yasukawa , Akira Takasago
发明人： Naoki Saito , Masayuki Kozawa , Shinya Igarashi , Hiromu Kikawa , Akio Yasukawa , Akira Takasago
IPC分类号： G01F1/68
CPC分类号： G01F1/684 , F02D41/187 , G01F1/6842 , G01F1/688 , G01F1/69 , G01F5/00
摘要： A heating resistor type flow measuring device comprising a housing having a support part provided between a frame body and a connector and connected to the mounting part of a fluid passage, a flow rate detection element held on the frame body side of the housing, and an electronic circuit held on the housing and connected electrically to the flow rate detection element and the connector, wherein the electronic circuit is held on the frame body side of the housing and positioned in the fluid passage, a member with the rigidity higher than the material of the main structural member of the housing is formed integrally with the support part, the housing is fixed to the fluid passage through the member with high rigidity. A metal plate is inserted into the support part so as to increase rigidity. Further, a distance is provided between the support part and a metal plate forming a route for conducting the heat transferred to the metal base fixing an electronic circuit substrate by a plastic mold so as to form a structure obstructing a heat transfer, or a clearance is provided in a portion spaced by the plastic mold between the support part and the metal base so as to form a structure obstructing a heat transfer.
摘要翻译：一种加热电阻器型流量测量装置，包括：壳体，其具有设置在框体和连接器之间的支撑部，并且连接到流体通道的安装部分;流量检测元件，其保持在壳体的框体侧;以及电子电路保持在壳体上并与流量检测元件和连接器电连接，其中电子电路被保持在壳体的框架主体侧并且定位在流体通道中，刚性高于壳体的主结构构件与支撑部一体地形成，壳体通过构件以高刚性固定到流体通道。将金属板插入支撑部，以增加刚性。此外，在支撑部分和金属板之间设置一个距离，该金属板形成用于传导通过塑料模具固定电子电路基板的传送到金属基座的热量的路线，以形成阻碍热传递的结构，或者间隙为设置在由塑料模具在支撑部分和金属基座之间间隔开的部分中，以形成阻碍热传递的结构。

23. 发明授权

US06410978B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06410978B1
公开(公告)日：2002-06-25
申请号：US09370990
申请日：1999-08-10
申请人： Akio Yasukawa , Hirohisa Yamamura , Tatsuya Shigemura
发明人： Akio Yasukawa , Hirohisa Yamamura , Tatsuya Shigemura
IPC分类号： H01L2334
CPC分类号： H01L23/473 , H01L23/13 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K2201/09745 , H05K2201/10674 , H01L2924/00
摘要： A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.
摘要翻译：提供了一种半导体装置，其中可以防止在其操作期间由于重复打开和关闭电源而发生安装在基座上的半导体芯片下方的焊料层的疲劳失效，即形成凹部在半导体芯片下面的部分的基部中，以防止在基底中发生热膨胀。

24. 发明授权

US06265784B1 Resin sealed semiconductor device having improved arrangement for reducing thermal stress within the device 有权
标题翻译：树脂密封的半导体器件具有改进的装置，用于降低装置内的热应力
公开(公告)号：US06265784B1
公开(公告)日：2001-07-24
申请号：US09437266
申请日：1999-11-10
申请人： Kenya Kawano , Hiroaki Doi , Akio Yasukawa , Hideo Miura
发明人： Kenya Kawano , Hiroaki Doi , Akio Yasukawa , Hideo Miura
IPC分类号： H01L2300
CPC分类号： H01L21/563 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/83859 , H01L2224/83951 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2224/05599
摘要： A resin sealed semiconductor device is provided with an organic resin wiring substrate, an LSI chip having a semiconductor integrated circuit and mounted in a bare chip package form to the organic resin wiring substrate through a plurality of electrical bonding members, and a resin charged into a gap portion between the organic resin wiring substrate and the LSI chip. In this resin sealed semiconductor device, a modulus of longitudinal elasticity of the resin to be charged, its coefficient of linear thermal expansion and its fillet shape are optimized. The resin charged is also preferably colored in black to minimize adverse effects of visible rags on the LSI chip.
摘要翻译：树脂密封半导体器件具有有机树脂布线基板，具有半导体集成电路的LSI芯片，并且通过多个电接合部件以裸芯片封装形式安装到有机树脂布线基板，并且将树脂装入有机树脂布线基板和LSI芯片之间的间隙部分。在这种树脂密封半导体器件中，优化被充电树脂的纵向弹性模量，线性热膨胀系数和圆角形状。充电的树脂还优选用黑色着色，以尽可能减少LSI芯片上的可见抹布的不良影响。

25. 发明授权

US4838046A Cover for a dampening roller of an offset press 失效
标题翻译：胶印机的阻尼辊盖
公开(公告)号：US4838046A
公开(公告)日：1989-06-13
申请号：US904801
申请日：1986-09-08
申请人： Akio Yasukawa
发明人： Akio Yasukawa
IPC分类号： B41F7/24 , B41F7/26 , B41N7/04 , D04B1/00 , D04B1/20
CPC分类号： D04B1/20 , B41N7/04 , D04B1/00 , B41N2207/02 , B41N2207/14
摘要： A cover for a damping roller of an offset press is comprising a tubular knitted fabric having two water-shrinkable ground yarns and the hydrophilic pile yarns. The ground yarns are intertwined and respectively form a tubular plain weft-knitted structure in which two ground yarns are alternately knitted so that wales formed by one ground yarn are interposed between two adjacent wales formed by the other ground yarn so that all the wales appear on the face of the fabric. The courses of each plain knitted structure include long sinker loops, the ground yarns being knitted into the respective plain-knitted ground fabric structure to form raised loops. The cover has high shrinking percentages both in radial and axial directions.
摘要翻译：胶版印刷机的阻尼辊的盖子包括具有两个水收缩底纱和亲水绒毛纱线的管状针织物。地面纱线相互缠绕并分别形成一个管状平纹纬编结构，其中两根地纱是交替编织的，使得由一条地面纱线形成的纵行线介于由另一条地面纱线形成的两条相邻的纵行之间，使得所有的纵行出现在面料的面料。每个平针织结构的横列包括较长的沉降圈，将地面纱针织成相应的平针织物织物结构以形成凸起的环。盖子在径向和轴向都具有高收缩率。

26. 发明授权

US4604496A Ceramic multilayer wiring board 失效
标题翻译：陶瓷多层布线板
公开(公告)号：US4604496A
公开(公告)日：1986-08-05
申请号：US640582
申请日：1984-08-14
申请人： Shosaku Ishihara , Takashi Kuroki , Gyozo Toda , Akio Yasukawa , Tatsuji Sakamoto
发明人： Shosaku Ishihara , Takashi Kuroki , Gyozo Toda , Akio Yasukawa , Tatsuji Sakamoto
IPC分类号： H05K3/46 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/42 , H05K1/02
CPC分类号： H05K3/42 , H05K3/4061 , H05K1/0306 , H05K1/092 , H05K2201/0191 , H05K2201/096 , H05K2201/09845 , H05K3/4611 , H05K3/4629
摘要： A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.
摘要翻译：提供一种陶瓷多层布线板，其中设置在其上的陶瓷绝缘层和布线图案通过填充形成在陶瓷绝缘层中的通孔的导体连接。通孔形成为使陶瓷多层布线基板的贯通孔的表面部的直径比表层部之间的贯通孔的内部的直径小。这可以防止板在通孔周围破裂。

27. 发明授权

US4319397A Method of producing semiconductor displacement transducer 失效
标题翻译：半导体位移传感器的制造方法
公开(公告)号：US4319397A
公开(公告)日：1982-03-16
申请号：US165985
申请日：1980-07-07
申请人： Masanori Tanabe , Satoshi Shimada , Akio Yasukawa , Hideyuki Nemoto , Motohisa Nishihara , Masatoshi Tsuchiya , Ko Soeno
发明人： Masanori Tanabe , Satoshi Shimada , Akio Yasukawa , Hideyuki Nemoto , Motohisa Nishihara , Masatoshi Tsuchiya , Ko Soeno
IPC分类号： G01D5/16 , H01L29/84 , H01L21/58
CPC分类号： H01L29/84 , Y10T29/49103
摘要： A strain gauge is formed on one main surface of a semiconductor single crystal substrate while an insulating oxide film is formed on the other main surface of the substrate. A metal junction layer including several layers inclusive of eutectic alloy layers is formed on the surface of the insulating oxide film and the thus prepared structure is mounted on a metal strain generator. By heating this assembly to temperatures approximating to the eutectic point of the eutectic alloy layer, the semiconductor substrate and the metal strain generator are joined together.
摘要翻译：在半导体单晶基板的一个主表面上形成应变计，同时在基板的另一个主表面上形成绝缘氧化膜。在绝缘氧化膜的表面上形成包括共晶合金层的数层的金属接合层，将这样制作的结构安装在金属应变发生器上。通过将该组件加热到接近共晶合金层的共晶点的温度，将半导体衬底和金属应变发生器连接在一起。

28. 发明申请

US20110072897A1 Heating Resistance Type Air Flow Rate Measuring Device 审中-公开
标题翻译：加热电阻型空气流量测量装置
公开(公告)号：US20110072897A1
公开(公告)日：2011-03-31
申请号：US12829105
申请日：2010-07-01
申请人： Rintaro MINAMITANI , Keiji Hanzawa , Akio Yasukawa , Yasuo Onose
发明人： Rintaro MINAMITANI , Keiji Hanzawa , Akio Yasukawa , Yasuo Onose
IPC分类号： G01F1/692
CPC分类号： G01F1/692 , G01F1/6845 , G01F15/006 , G01F15/12
摘要： A temperature of the heating resistor is set at a temperature equal to or higher than a temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Alternatively, when a heating resistance type air flow rate measuring device starts to operate or stops operating, the temperature of the heating resistor may be set at a temperature equal to or higher than the temperature, at which liquid droplets contacting a surface of the heating resistor evaporate and disappear by film boiling. Moreover, a water-repellent and oil-repellent protective coating may be provided on the surface of the heating resistor.
摘要翻译：加热电阻器的温度被设定为等于或高于与加热电阻器的表面接触的液滴蒸发并通过薄膜沸腾而消失的温度。或者，当加热电阻型空气流量测量装置开始运行或停止运行时，加热电阻器的温度可以设定在等于或高于液滴接触加热电阻器的表面的温度通过薄膜沸腾蒸发并消失。此外，可以在加热电阻器的表面上设置防水和防油涂层。

29. 发明授权

US06698282B2 Heated type air flow rate sensor and its forming method 失效
标题翻译：加热式空气流量传感器及其成型方法
公开(公告)号：US06698282B2
公开(公告)日：2004-03-02
申请号：US09811439
申请日：2001-03-20
申请人： Akio Yasukawa , Rintaro Minamitani , Shinya Igarashi , Masamichi Yamada , Akira Koide
发明人： Akio Yasukawa , Rintaro Minamitani , Shinya Igarashi , Masamichi Yamada , Akira Koide
IPC分类号： G01F168
CPC分类号： F02D41/187 , G01F1/6845
摘要： The object of this invention is to provide a heated type air flow rate sensor for measuring an air flow rate using heat generating resistive element or resistor formed within a diaphragm of which periphery is fixed, in which diaphragm destruction due to the collusion of dust is adapted to be prevented. Tapers of two or more stages are formed at a diaphragm fixing flange, and the angle of the most inside taper is made smaller than the angle of the taper which is outside with respect to the most inside taper. When dust collides with the diaphragm and the kinetic energy is transformed into distortion energy, the diaphragm destruction is avoided by making small the slope of the load-displacement curve at the neighborhood of the diaphragm flange to make the generated load small.
摘要翻译：本发明的目的是提供一种加热式空气流量传感器，用于使用在其周边固定的隔膜中形成的发热电阻元件或电阻器来测量空气流量，其中由于灰尘共谋而造成的隔膜破坏在隔膜固定凸缘上形成两级或更多级的塔，最内侧锥形的角度比相对于最内侧的锥度的外侧锥形的角度小。当灰尘与隔膜和动能被转化为变形能量，通过使膜片法兰附近的负载 - 位移曲线的斜率变小，避免了膜片的破坏，使得产生的载荷变小。

30. 发明授权

US06414867B2 Power inverter 失效
标题翻译：电源逆变器
公开(公告)号：US06414867B2
公开(公告)日：2002-07-02
申请号：US09784117
申请日：2001-02-16
申请人： Osamu Suzuki , Heikichi Kuwabara , Akio Yasukawa , Mitsuyuki Hombu , Hirohisa Yamamura , Sanshirou Obara , Kaname Sasaki
发明人： Osamu Suzuki , Heikichi Kuwabara , Akio Yasukawa , Mitsuyuki Hombu , Hirohisa Yamamura , Sanshirou Obara , Kaname Sasaki
IPC分类号： H02M100
CPC分类号： H02M7/003 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A heat sink or cooling case has a cooling channel and at least one opening formed to face part of the channel. A first seal is provided outside the at least one opening. A cooling case has a groove located outside the first seal. Holes are discretely formed in the groove and lead from the groove to an exterior of the cooling case. A second seal is provided outside the groove. A radiating plate constituting a circuit case is mounted on the heat sink by using a clamping device inside or outside the second seal.
摘要翻译：散热器或冷却箱具有冷却通道和形成为面对通道的一部分的至少一个开口。第一密封件设置在至少一个开口的外部。冷却箱具有位于第一密封件外部的凹槽。孔分离地形成在凹槽中并从凹槽引导到冷却箱的外部。第二密封件设置在凹槽外部。构成电路壳体的散热板通过在第二密封件的内部或外部使用夹紧装置安装在散热器上。

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