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    • 26. 发明申请
    • LAMINATE FOR HDD SUSPENSION AND ITS MANUFACTURE
    • 用于硬盘悬挂及其制造的层压板
    • WO1998008216A1
    • 1998-02-26
    • PCT/JP1997002850
    • 1997-08-18
    • NIPPON STEEL CHEMICAL CO., LTD.SHIMOSE, MakotoWATANABE, HisashiOKA, SeigoMATSUSHI, YujiKABEMURA, Eri
    • NIPPON STEEL CHEMICAL CO., LTD.
    • G11B05/60
    • G11B5/484G11B21/00H05K1/0346H05K1/056Y10T428/31681Y10T428/31721
    • A polyimide resin layer and a conductor layer are successively formed on a stainless steel substrate to form a laminate for HDD suspension. The linear expansion coefficient of the polyimide resin layer is within a range of 1 x 10 - 3 x 10 / DEG C. The bonding strengths between the stainless steel substrate and the polyimide resin layer and between the polyimide resin layer and the conductor layer are not less than 0.5 kg/cm. Polyimide precursor solution or polyimide resin solution is applied to the stainless steel substrate to form one or more layers with a thickness of 10 - 70 mu m. The layers are dried and subjected to a heat treatment at a temperature higher than 250 DEG C to form a polyimide resin layer whose thickness is 3 - 20 mu m and whose linear expansion coefficient is 1 x 10 - 3 x 10 / DEG C. Then the conductor layer with a thickness of 3 - 20 mu m is joined to the resin layer by thermocompression bonding. Such a laminate for HDD suspension warps little when it is subjected to an etching treatment and is suitable for HDD suspension with unified wiring.
    • 在不锈钢基板上依次形成聚酰亚胺树脂层和导体层,形成用于HDD悬浮液的层叠体。 聚酰亚胺树脂层的线膨胀系数在1×10 -6 -3×10 -5 /℃的范围内。不锈钢基材与聚酰亚胺树脂层之间和聚酰亚胺之间的结合强度 树脂层和导体层不小于0.5kg / cm 3。 将聚酰亚胺前体溶液或聚酰亚胺树脂溶液施加到不锈钢基材上以形成厚度为10至70μm的一层或多层。 将层干燥并在高于250℃的温度下进行热处理,形成厚度为3-20μm,线膨胀系数为1×10 -6 -3×10 6的聚酰亚胺树脂层, -5℃/℃,然后通过热压接合将厚度为3-20μm的导体层与树脂层接合。 这种用于HDD悬挂的层叠体经受蚀刻处理时几乎没有变化,并且适用于具有统一布线的HDD悬架。