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21. 发明专利

AU2002317645A1 Cooling apparatus for electronic devices 未知
公开(公告)号：AU2002317645A1
公开(公告)日：2003-01-29
申请号：AU2002317645
申请日：2002-07-15
申请人： COOLIT SYSTEMS INC
发明人： SCOTT ALEXANDER ROBIN WALTER
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20

22. 发明专利

CA2352997A1 COMPUTER COOLING APPARATUS 未知
公开(公告)号：CA2352997A1
公开(公告)日：2003-01-13
申请号：CA2352997
申请日：2001-07-13
申请人： COOLIT SYSTEMS INC
发明人： SCOTT ALEXANDER
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20 , H01L23/36

23. 发明申请

WO2022195568A1 SUPERVISED CONTROL LOGIC AND RELATED SYSTEMS AND METHODS 审中-公开
公开(公告)号：WO2022195568A1
公开(公告)日：2022-09-22
申请号：PCT/IB2022/052559
申请日：2022-03-21
申请人： COOLIT SYSTEMS, INC.
发明人： SHADBOLT, Victor , COUSINS, Renee , PLACZEK, Daniel
IPC分类号： G05B19/042 , F28F27/00 , G05B23/02
摘要： A controller for controlling operation of a heater transfer system is supervised by a supervisory control logic. Supervisory control logic monitors a state-of-health of system control logic, e.g., by monitoring an output from the system control logic that is indicative of its state-of-health. In a working embodiment, supervisory control logic monitors an output signal, e.g., a strobe signal, emitted by the system control logic. Response to a detected change in the control logic's health (e.g., a deterioration in performance), the supervisory control logic can issue a command or signal, or otherwise cause the system control logic to perform a selected one or more other operations selected from a plurality of operations.

24. 发明申请

WO2014141162A1 SENSORS, MULTIPLEXED COMMUNICATION TECHNIQUES, AND RELATED SYSTEMS 审中-公开
标题翻译：传感器，多路通讯技术及相关系统
公开(公告)号：WO2014141162A1
公开(公告)日：2014-09-18
申请号：PCT/IB2014/059768
申请日：2014-03-14
申请人： COOLIT SYSTEMS, INC.
发明人： LYON, Geoff Sean , HOLDEN, Mike
IPC分类号： G05B17/02 , F24F11/04 , G01F1/05 , G01M3/00 , G01M3/02 , G06F1/20 , G01P3/00
CPC分类号： F04B49/065 , G01F1/103 , G01M3/165 , G01M3/18 , G01M3/2807 , G05B17/02 , G06F1/20 , G06F2200/201
摘要： An observed operational state can include an operational state of one or more system devices. A sensor can emit, in response to a detected observable condition reflective of a given operational state, a simulated signal reflective of a different operational state as a proxy for the detected condition. A controller receiving such a proxy signal can, at least partially responsively to the proxy signal, issue a command corresponding to the given operational state. For example, a leak detector can emit in response to a detected leak, or a flow-rate sensor can emit in response to a detected flow-rate of a liquid, a simulated fan-speed tachometer signal representative of a selected fan speed. At least partially in response to observing a simulated tachometer signal, a controller can issue a system command corresponding to an underlying system condition for which the simulated tachometer signal is a proxy.
摘要翻译：观察到的操作状态可以包括一个或多个系统设备的操作状态。传感器可以响应于反映给定操作状态的检测到的可观察条件而发射反映作为检测条件的代理的不同操作状态的模拟信号。接收这种代理信号的控制器可以至少部分地响应于代理信号发出对应于给定操作状态的命令。例如，泄漏检测器可以响应于检测到的泄漏而发射，或者流量传感器可以响应于检测到的液体流率而发射，代表所选择的风扇速度的模拟风扇转速计信号。至少部分地响应于观察模拟转速计信号，控制器可以发出对应于模拟转速计信号是代理的底层系统条件的系统命令。

25. 发明申请

WO2003055055A1 INVERTER 审中-公开
公开(公告)号：WO2003055055A1
公开(公告)日：2003-07-03
申请号：PCT/CA2002/001869
申请日：2002-12-05
申请人： COOLIT SYSTEMS INC.
发明人： SCOTT, Robert, John, Charles
IPC分类号： H02P7/628
CPC分类号： H02P27/06 , H02M1/088 , H02M1/38 , H02M7/53871
摘要： AC to DC inverters that are formed from electronic switches, such as MOSFETs, that are controlled by gating pulses obtained from comparators. The comparators compare a varying signal against two closely spaced reference voltages so as to provide gating pulses with delays needed to prevent shoot-through in the electronic switches.
摘要翻译：由诸如MOSFET的电子开关形成的AC至DC逆变器，其通过从比较器获得的选通脉冲控制。比较器将变化的信号与两个紧密间隔的参考电压进行比较，以便提供门控脉冲具有防止电子开关中的直通所需的延迟。

26. 发明申请

WO2003007372A2 COMPUTER COOLING APPARATUS 审中-公开
标题翻译：电脑冷却装置
公开(公告)号：WO2003007372A2
公开(公告)日：2003-01-23
申请号：PCT/CA2002/001078
申请日：2002-07-15
申请人： COOLIT SYSTEMS INC. , SCOTT, Alexander, Robin, Walter
发明人： SCOTT, Alexander, Robin, Walter
IPC分类号： H01L23/473
CPC分类号： F28F3/12 , G06F1/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body. The chiller circulates the fluid through a chiller and the fluid heat exchanger.
摘要翻译：一种用于冷却包括流体热交换器，冷却器和泵的电子设备的设备。流体热交换器将热量从电子设备的表面的热部分传递到流体，并且具有可以使流体循环通过的主体。主体具有突起，其具有可以与热部分热耦合的第一表面，使得主体的表面足够远离电子设备的表面，足够的环境空气可以在其间循环，从而基本上防止冷凝形成在电子设备的表面上并且当流体被冷却至至少环境空气的露点并循环通过本体时，在热交换器上形成和滴落。当流体循环通过本体时，导热路径从第一表面提供到主体的热耦合到流体的区域。冷却器将流体循环通过冷却器和流体热交换器。

27. 发明公开

EP1507290A3 Heat Sink 审中-公开
标题翻译：散热器
公开(公告)号：EP1507290A3
公开(公告)日：2005-06-01
申请号：EP04254771.1
申请日：2004-08-07
申请人： Coolit Systems Inc.
发明人： Scott, Alexander Robin Walter
IPC分类号： H01L23/467
CPC分类号： H01L35/30 , F28F3/02 , H01L23/3672 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.
摘要翻译：描述了散热器用于直接或间接（即通过液体冷却剂）从至少一个电子设备（例如微处理器）提取热量。散热器包括第一热板，第二热板以及与第一热板和第二热板一体并在其间延伸的多个翅片。

28. 发明公开

EP1410438A2 COOLING APPARATUS FOR ELECTRONIC DEVICES 审中-公开
标题翻译： COOLER电子元器件
公开(公告)号：EP1410438A2
公开(公告)日：2004-04-21
申请号：EP02747120.0
申请日：2002-07-15
申请人： Coolit Systems Inc.
发明人： SCOTT, Alexander, Robin, Walter
IPC分类号： H01L23/473 , G06F1/20
CPC分类号： F28F3/12 , G06F1/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for cooling an electronic device that includes a fluid heat exchanger, a chiller, and a pump. The fluid heat exchanger transfers heat from a hot portion of the surface of the electronic device to a fluid and has a body through which the fluid may be circulated. The body has a protrusion having a first surface that may be thermally coupled to the hot portion such that the surface of the body is sufficiently distant from the surface of the electronic device that sufficient ambient air may circulate therebetween so as to substantially prevent condensation from forming on the surface of the electronic device and from forming on and dripping from the heat exchanger when the fluid is cooled to at least the dew point of the ambient air and circulated through the body. A heat-conducting path is provided from the first surface to a region of the body that is thermally coupled to the fluid when the fluid is circulated through the body. The chiller circulates the fluid through a chiller and the fluid heat exchanger.

29. 发明公开

EP1684344A2 Heat sink 审中-公开
标题翻译： Kühlkörper
公开(公告)号：EP1684344A2
公开(公告)日：2006-07-26
申请号：EP06250329.7
申请日：2006-01-21
申请人： Coolit Systems Inc.
发明人： Scott, Alexander Robin Walter
IPC分类号： H01L23/473
CPC分类号： H01L23/467 , F28D2021/0029 , F28F1/24 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes: a first end; a second end; an exterior surface; a plurality of fins including a first fin and a second fin adjacent the first fin, each of the first fin and the second fin being substantially annular in form with an opening formed therethrough; a fin space between the first fin and the second fin to permit the flow of heat transfer fluid therethrough; a duct extending through the plurality of fins into which the fin space opens, the duct formed at least in part by corresponding arrangement of the openings of the first fin and the second fm, the duct opening at the first end of the heat sink to the exterior surface; and a thermal plate in heat conducting communication with the first fin and the second fin.
摘要翻译：散热器包括：第一端; 第二端外表面多个翅片，其包括与所述第一翅片相邻的第一翅片和第二翅片，所述第一翅片和所述第二翅片中的每一个基本上为环形，其中形成有开口; 第一翅片和第二翅片之间的翅片空间，以允许传热流体流过其中; 延伸穿过翅片空间打开的多个翅片的管道，至少部分地由第一翅片和第二fm的开口的相应布置形成的管道，在散热片的第一端处的管道开口外表面以及与第一翅片和第二翅片导热连通的热板。

30. 发明公开

EP1507290A2 Heat Sink 审中-公开
标题翻译： Wärmesenke
公开(公告)号：EP1507290A2
公开(公告)日：2005-02-16
申请号：EP04254771.1
申请日：2004-08-07
申请人： Coolit Systems Inc.
发明人： Scott, Alexander Robin Walter
IPC分类号： H01L23/467
CPC分类号： H01L35/30 , F28F3/02 , H01L23/3672 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.
摘要翻译：描述了用于从至少一个电子设备（例如微处理器）直接或间接（即通过液体冷却剂）提取热量的散热器。散热器包括第一热板，第二热板和与第一热板和第二热板两者成一体并在其之间延伸的多个翅片。

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