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    • 16. 发明授权
    • Process for processing a conductive damper for use in speaker
    • 用于处理用于扬声器的导电阻尼器的处理
    • US06604271B2
    • 2003-08-12
    • US09749676
    • 2000-12-28
    • Toshihiro IshigakiTakeshi Tokusho
    • Toshihiro IshigakiTakeshi Tokusho
    • H01S400
    • H04R9/043H04R31/00Y10T29/49002Y10T29/49005Y10T29/4908Y10T29/49181Y10T29/4922Y10T29/49222Y10T428/268
    • A conductive damper for use in a speaker is provided, the endurance and the moldability of which are improved. A base is moved downward to allow an inner top mold to abut on a bottom mold, then the base is further moved downward to allow the inner top mold and the bottom mold to be applied pressure and the base moves down with being guided by guiding means. At this time, energizing means energizes the inner top mold to press the bottom mold, thereby corrugations for the inner part of a workpiece of the conductive damper are molded. At this time, the workpiece of the conductive damper is pulled toward the inner side thereof. Then, the base is further moved downward to press an outer top mold onto the bottom mold, thereby corrugations for the outer part of the workpiece of the conductive damper are molded.
    • 提供了用于扬声器的导电阻尼器,其耐久性和可模塑性得到改善。 底座向下移动以允许内顶模抵靠在底模上,然后底座进一步向下移动,以允许内顶模和底模施加压力,并且底座随着导向装置的引导而向下移动 。 此时,通电装置激励内顶模以压下底模,从而模制用于导电阻尼器的工件内部的波纹。 此时,导电阻尼器的工件被拉向其内侧。 然后,基底进一步向下移动以将外顶模压到底模上,从而模制导电阻尼器的工件的外部部分的波纹。
    • 18. 发明授权
    • Method for sealing liquid coolant into module
    • 将液体冷却液密封成模块的方法
    • US06457228B1
    • 2002-10-01
    • US09592649
    • 2000-06-13
    • Natsuo AraiKaoru KatayamaEiichi Kiryuu
    • Natsuo AraiKaoru KatayamaEiichi Kiryuu
    • H01S400
    • H01L21/54G06F1/20G06F2200/201H01L2224/16225H01L2224/73253H01L2924/00014Y10T29/49002Y10T29/49117Y10T29/4913H01L2224/0401
    • A module is placed inside a chamber that can be sealed hermetically. The module includes a substrate incorporating a plurality of electronic circuit parts, a frame connected to the substrate so as to enclose the plurality of electronic circuit parts, and a cover placed facing the substrate and connected to the frame so as to cover an opening portion of the frame. The pressure in the chamber is reduced to a first pressure P1, and then the pressure is increased from the first pressure P1 to a second pressure P2. A liquid is filled into the module through a hole formed in the cover within the chamber, and the pressure inside the chamber is increased from the second pressure P2 to a third pressure P3. Then, the hole of the cover in the chamber is closed to seal the module hermetically, thereby sealing the liquid in the module. Thereafter, the pressure in the chamber is increased from the third pressure P3 to an atmospheric pressure P0, and the module is taken out of the chamber.
    • 模块放置在可以密封密封的室内。 该模块包括一个内置多个电子电路部分的基板,一个连接到该基板以便封闭该多个电子电路部分的框架,以及一个面向基板并与该框架相连接的盖子,以覆盖开口部分 框架。 室中的压力降低到第一压力P1,然后压力从第一压力P1增加到第二压力P2。 液体通过形成在腔室中的盖中的孔填充到模块中,并且室内的压力从第二压力P2增加到第三压力P3。 然后,关闭室内盖的孔,密封模块,密封模块内的液体。 此后,将室内的压力从第三压力P3升高至大气压力P0,将模块从室中取出。