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    • 13. 发明公开
    • Virtual mounter system
    • VirtuelleBestückvorrichtung
    • EP1848262A1
    • 2007-10-24
    • EP06007962.1
    • 2006-04-18
    • Mirae Corporation
    • Jung, Yun GiKim, Young JooHwang, Heung Seon
    • H05K13/08
    • H05K13/08
    • A virtual mounter system is disclosed. The system can implement a mounter through an animation model or a simulation model before users substantially access a real mounter. The system can allow users to learn a necessary technology related to drive and maintenance of a mounter thorough animation or simulation for the mounter. The system can support driving environment of a real mounter to users as examples of setup and motions are displayed. The system can show contents (an assembly structure of a mounter, functions of each assembly, an operation sequence and an operation method) which is described in a user's manual for a mounter, in real time, through an animation model or a simulation model of the mounter.
    • 公开了一种虚拟贴片机系统。 该系统可以在用户基本访问真正的安装者之前,通过动画模型或模拟模型实现安装者。 该系统可以允许用户学习与安装器的驱动和维护彻底的动画或模拟相关的必要技术。 系统可以为用户提供真正的安装者的驾驶环境,显示设置和动作的示例。 该系统可以通过动画模型或模拟模型来实时显示用于安装者的用户手册中描述的内容(安装器的组装结构,每个组件的功能,操作顺序和操作方法) 安装者
    • 14. 发明公开
    • IC Sorter
    • IC分拣机
    • EP1752778A3
    • 2008-10-29
    • EP06117699.6
    • 2006-07-21
    • Mirae Corporation
    • Kim, Byoung-wooSeo, Yong-jin
    • G01R31/28B07C5/344
    • B07C5/344G01R31/2893
    • Provided are an IC sorter, a method for sorting a burn-in IC, an IC sorted using the method. The IC sorter according to one embodiment of the present invention includes a board table onto which a burn-in board is loaded, a tray loader and a tray unloader which are spaced from the board table in a first axis direction and extended parallel to each other in a second axis direction, a DC test buffer and unloading buffer which are spaced from the board table in a second axis direction with a working area of the board table in between, a sorting unit spaced from the board table, having at least one DC failure tray receiving ICs which fail a DC test and at least one sorting tray, a DC failure/loading head movable at least among a working location of the tray loader, the DC test buffer and a DC failure tray of the sorting unit, a unloading head movable at least among a working location of the tray unloader and the unloading buffer, a sorting head movable at least among the unloading buffer and the sorting tray of the sorting unit; and an insertion/removal head movable at least among the DC test buffer, the working area of the board table, and the unloading buffer.
    • 15. 发明公开
    • Handler
    • 处理器
    • EP1903343A1
    • 2008-03-26
    • EP07116109.5
    • 2007-09-11
    • Mirae Corporation
    • Ahn, Jung-ugKim, Sun-hwalChoi, Wan-heeHur, Jung
    • G01R31/28
    • G01R31/2893G01R31/2867
    • A handler is provided, including a chamber in which to-be-tested packaged chips contained in a test tray are connected to sockets of a test board, an exchanging unit exchanging the test trays with the chamber; a transferring unit transferring the test tray containing the to-be-tested packaged chips from the exchanging unit to the chamber, and transferring the test tray containing tested packaged chips from the chamber to the exchanging unit, a picker removing the tested packaged chips from the test tray staying in the exchanging unit and putting the to-be-tested packaged chips into the test tray staying in the exchanging unit; and an inserting unit including a pusher pushing the test tray to connect the to-be-tested packaged chips to the sockets of the test board, a pusher driving unit driving the pusher, a sensor sensing an amount of pressure applied by the pusher to the test tray; and a controller controlling the pusher driving unit to enable the pusher to apply a proper amount of pressure to the test tray.
    • 提供处理器,包括一个室,其中容纳在测试托盘中的待测试的封装芯片连接到测试板的插座,交换单元将测试托盘与腔室交换; 传送单元,将包含待测试的包装芯片的测试托盘从所述更换单元传送到所述室,以及将包含经测试的封装芯片的测试托盘从所述室传送到所述交换单元;拾取器,将测试的封装芯片从 测试托盘停留在更换单元中,并将待测试的封装的芯片放入留在更换单元中的测试托盘中; 以及插入单元,其包括推动所述测试托盘以将待测试的封装芯片连接到所述测试板的插座的推动器,驱动所述推动器的推动器驱动单元,感测由所述推动器施加的压力的传感器 试盘 以及控制器,其控制所述推动器驱动单元以使所述推动器能够向所述测试托盘施加适当的压力。
    • 16. 发明公开
    • Virtual education system for mounter, and method for controlling the same
    • Virtuelles Anleitungssystemfürein Montagesystem und Verfahren zu dessen Steuerung
    • EP1879160A1
    • 2008-01-16
    • EP06117152.6
    • 2006-07-13
    • Mirae Corporation
    • Jung, Yun GiKim, Young JooHwang, Heung Seon
    • G09B19/24
    • G09B19/24
    • A virtual education system for a mounter and a method for controlling the same are provided to teach users how to manipulate the mounter through virtual models (animation or simulation models) of the mounter so that they learn how to manipulate it through the same operation procedures and methods as the real ones of the mounter. A user manual containing structures and functions of elements of the mounter and operation procedures and methods thereof is provided. Virtual models representing contents of the user manual are produced to display corresponding configurations of the mounter. Specifically, virtual models representing items included in the user manual, which are associated with installation and startup of the mounter, respective structures and operations of the elements, manufacturing processes of the mounter for producing a product, and tasks in each manufacturing process, are produced to display corresponding configurations of the mounter on a screen.
    • 提供了一种用于安装者的虚拟教育系统及其控制方法,以教导用户如何通过安装者的虚拟模型(动画或模拟模型)来操纵安装者,以便他们学习如何通过相同的操作步骤操纵它, 方法作为安装者的真正的方法。 提供了一种包含安装器元件的结构和功能的用户手册及其操作步骤及方法。 产生表示用户手册内容的虚拟模型,以显示贴片机的相应配置。 特别地,生成表示与安装器的安装和启动相关的用户手册中包括的项目的各个构件和操作,用于生产产品的安装器的制造过程以及每个制造过程中的任务的虚拟模型, 以在屏幕上显示贴片机的相应配置。
    • 19. 发明公开
    • Surface mounting device
    • Vorrichtung zurOberflächenmontage
    • EP1063875A1
    • 2000-12-27
    • EP99122961.8
    • 1999-11-18
    • Mirae Corporation
    • Yi, Yun Hyung
    • H05K13/04
    • H05K13/0413Y10T29/4913Y10T29/49131
    • The present invention relates to a surface mounting device, and more particularly to a surface mounting device in which a working can be performed more efficiently and correctly by providing at least one or more moving means movable integrally or independently to a predetermined portion of a X-Y gantry. The present invention provides a surface mounting device including: at least one or more X, Y frame for moving in a predetermined direction integrally or independently; main driving means disposed at the selected portion of the X, Y frame for driving X, Y frame; at least one or more moving means disposed at one of the X, Y frame and having at least one or more manipulator movable in a predetermined direction integrally or independently; sub driving means for driving the moving means integrally or independently; at least one or more head and vision portion disposed at the moving means; and a component supplying portion for supplying a component to the head.
    • 表面安装装置技术领域本发明涉及一种表面安装装置,更具体地说,涉及一种表面安装装置,其中通过提供至少一个或多个可与XY台架的预定部分一体地或独立地移动的移动装置,可以更有效和更正确地进行加工 。 本发明提供了一种表面安装装置,包括:至少一个或多个X,Y框架,用于沿预定方向一体地或独立地移动; 主驱动装置设置在用于驱动X,Y框架的X,Y框架的选定部分; 至少一个或多个移动装置,其设置在所述X,Y框架中的一个上,并且具有至少一个或多个可沿整个或独立地沿预定方向移动的操纵器; 副驱动装置,用于一体地或独立地驱动移动装置; 设置在移动装置处的至少一个或多个头部和视觉部分; 以及用于将部件供给到头部的部件供给部。
    • 20. 发明公开
    • Chamber for an IC module handler
    • Kammerfüreine Handhabungsvorrichtungfürein IC-Modul
    • EP0995998A2
    • 2000-04-26
    • EP99120694.7
    • 1999-10-19
    • Mirae Corporation
    • An, Tae SungPark, Chan HoMoon, Yong SooSeong, Eun HyoungKim, Ku Kyong
    • G01R31/316
    • G01R31/2862
    • The present invention relates to an improved chamber for a module IC handler including a pre-heater for appropriately heating at a set temperature, that is, a generated temperature while a carrier served with a plurality of module ICs is moved, and a test site for enabling an outside tester to test by being pushed the carrier by a pusher. The present invention provides a chamber for a module IC handler including: a receiving piece installed at the lower plate of a chamber and formed with a plurality of receiving grooves at the upper surface thereof for being placed a carrier served with a module IC; an operating piece disposed in a predetermined portion of the receiving piece, disposed at the lowest point thereof in the upper surface of the receiving piece and formed at the upper surface thereof with a receiving groove same interval to the receiving groove of the receiving piece for performing up/down movement and advance/retreat movement; operating piece up/down movement means for going up/down the operating piece to be higher the upper surface thereof than the upper surface of the receiving piece; operating piece advance/retreat movement means for advancing/retreating the operating piece by one pitch same to the interval between the receiving grooves; and feeding means for holding the carrier on the feeding path served with the module IC heated at the test condition and for feeding toward the test site.
    • 本发明涉及一种用于模块IC处理器的改进室,其包括用于在设定温度下进行适当加热的预热器,即,在与多个模块IC一起使用的载体移动时产生的温度,以及用于 使外部测试仪能够通过推动器推动载体进行测试。 本发明提供了一种用于模块IC处理器的室,包括:容纳件,安装在室的下板处,并在其上表面形成有多个接收槽,用于放置一个载有模块IC的载体; 设置在接收片的预定部分中的操作件,设置在接收片的上表面的最低点处,并在其上表面处形成与接收片的接收槽相同的间隔的接收槽,用于执行 上下移动和前进/后退运动; 操作件上/下移动装置,用于使操作件上/下操作成高于其接收件的上表面的上表面; 操作件前进/后退移动装置,用于使操作件前进/后退一个间距到接收槽之间的间隔; 以及供给装置,用于将载体保持在与在试验状态下加热的模块IC一起供给的进给路径上,并且朝向试验部位供给。