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11. 发明授权

US08262015B2 Launching system and launching apparatus 有权
标题翻译：发射系统和发射装置
公开(公告)号：US08262015B2
公开(公告)日：2012-09-11
申请号：US12649808
申请日：2009-12-30
申请人： Yoshikatsu Kuroda , Yoshihiro Kawamata , Mika Shingo
发明人： Yoshikatsu Kuroda , Yoshihiro Kawamata , Mika Shingo
IPC分类号： B64D3/00
CPC分类号： B64D1/04 , B64D3/00 , B64G1/005
摘要： A flying object capable of being launched in air is detachably mounted on a wing body of a launching apparatus. The launching apparatus is towed by an aircraft through a cable so as to be run and taken off. After raising the launching apparatus to a launching height of the flying object by the aircraft, the flying object is released from the wing body in air and then the flying object is ignited and launched in air in a launching system. The system for launching in air can be developed without newly developing a platform as a mother ship so that a research cost can be remarkably reduced. In the case that a small artificial satellite is installed in a flying object, it is possible to develop an artificial satellite smoothly and quickly applicable to security matters and disaster observation.
摘要翻译：能够在空气中发射的飞行物体可拆卸地安装在发射装置的翼体上。发射装置由飞机通过电缆拖曳以便被运行和取下。在将发射装置升高到飞行器的飞行物体的发射高度之后，飞行物体在空中从翼体释放，然后飞行物体在发射系统中被点燃并在空气中发射。可以开发空气发射系统，而不需要开发一个作为母船的平台，从而可以显着降低研究成本。在飞行物体上安装小型人造卫星的情况下，可以平稳，快速地开发人造卫星用于安全事项和灾害观察。

12. 发明授权

US06862087B2 Radiation source position detection method, radiation source position detection system and radiation source position detection probe 有权
标题翻译：辐射源位置检测方法，辐射源位置检测系统和辐射源位置检测探头
公开(公告)号：US06862087B2
公开(公告)日：2005-03-01
申请号：US10441024
申请日：2003-05-20
申请人： Yoshikatsu Kuroda , Ryouchi Masuko , Tadayuki Takahashi , Shin Watanabe
发明人： Yoshikatsu Kuroda , Ryouchi Masuko , Tadayuki Takahashi , Shin Watanabe
IPC分类号： G01T1/29 , A61B6/00 , A61B19/00 , G01T1/169 , G01B11/26 , G01T1/24 , G01T3/00
CPC分类号： G01T1/2907 , A61B6/4429 , A61B6/547 , A61B6/583 , A61B2090/392 , G01T1/169
摘要： A radiation source position detection system is provided, wherein three radiation detectors are arranged at different positions. Based on radiations incident to each of the radiation detectors, curved surfaces where a radiation source exists are calculated. By solving equations of each of the curved surfaces simultaneously, the position of the radiation source is detected.
摘要翻译：提供了一种辐射源位置检测系统，其中三个辐射检测器被布置在不同的位置。基于入射到每个辐射检测器的辐射，计算存在辐射源的弯曲表面。通过同时求解每个曲面的方程，检测辐射源的位置。

13. 发明授权

US06275747B1 Microcomputer and its access speed control method 有权
标题翻译：微电脑及其访问速度控制方法
公开(公告)号：US06275747B1
公开(公告)日：2001-08-14
申请号：US09191377
申请日：1998-11-13
申请人： Takao Wada , Yuzo Ishibashi , Kiyoshi Kawamura , Yoshikatsu Kuroda
发明人： Takao Wada , Yuzo Ishibashi , Kiyoshi Kawamura , Yoshikatsu Kuroda
IPC分类号： G05B2100
CPC分类号： G06F11/00
摘要： A microcomputer usable for a long period of time even when disposed in a high dose radiation-exposed environment, and its access speed control method are provided. According to the microcomputer and the method, the total dose of radiation that the microcomputer receives is determined on the basis of detection signals from a radiation detecting element. Based on the determined total dose of radiation, and table data preset by tests and stored into a memory unit, a CPU controls an access speed. Moreover, the CPU, and the memory unit and a circuit interface unit that access the CPU are integrated on a single chip (ASIC) These units on the same chip are deteriorated and changed in the same direction, without fail, on exposure to radiation.
摘要翻译：即使设置在高剂量的曝光环境下也能够长时间使用的微型计算机及其存取速度控制方法。根据微型计算机和方法，基于来自辐射检测元件的检测信号确定微机接收的辐射总剂量。基于确定的辐射总剂量和通过测试预设的表数据并存储到存储器单元中，CPU控制访问速度。此外，CPU，存储器单元和访问CPU的电路接口单元集成在单个芯片（ASIC）上。同一芯片上的这些单元在暴露于辐射的同时，在相同的方向上都会相同的方向劣化并改变。

14. 发明申请

US20110024548A1 LAUNCHING SYSTEM AND LAUNCHING APPARATUS 有权
标题翻译：启动系统和启动装置
公开(公告)号：US20110024548A1
公开(公告)日：2011-02-03
申请号：US12649808
申请日：2009-12-30
申请人： Yoshikatsu Kuroda , Yoshihiro Kawamata , Mika Shingo
发明人： Yoshikatsu Kuroda , Yoshihiro Kawamata , Mika Shingo
IPC分类号： B64D3/00 , B64C3/00 , B64F1/04 , B64C37/02 , B64D1/12 , B64G1/10
CPC分类号： B64D1/04 , B64D3/00 , B64G1/005
摘要： A flying object capable of being launched in air is detachably mounted on a wing body of a launching apparatus. The launching apparatus is towed by an aircraft through a cable so as to be run and taken off. After raising the launching apparatus to a launching height of the flying object by the aircraft, the flying object is released from the wing body in air and then the flying object is ignited and launched in air in a launching system. The system for launching in air can be developed without newly developing a platform as a mother ship so that a research cost can be remarkably reduced. In the case that a small artificial satellite is installed in a flying object, it is possible to develop an artificial satellite smoothly and quickly applicable to security matters and disaster observation.
摘要翻译：能够在空气中发射的飞行物体可拆卸地安装在发射装置的翼体上。发射装置由飞机通过电缆拖曳以便被运行和取下。在将发射装置升高到飞行器的飞行物体的发射高度之后，飞行物体在空中从翼体释放，然后飞行物体在发射系统中被点燃并在空气中发射。可以开发空气发射系统，而不需要开发作为母船的平台，从而大大减少研究费用。在飞行物体上安装有小型人造卫星的情况下，可以平稳，快速地开发人造卫星，从而可以安全地进行灾害观察。

15. 发明授权

US06992297B2 Image sensor and manufacturing method thereof 有权
公开(公告)号：US06992297B2
公开(公告)日：2006-01-31
申请号：US11073730
申请日：2005-03-08
申请人： Yoshikatsu Kuroda , Tadayuki Takahashi
发明人： Yoshikatsu Kuroda , Tadayuki Takahashi
IPC分类号： G01T1/24 , H01L27/24 , H01L21/603
CPC分类号： H01L27/14676 , H01L24/11 , H01L24/13 , H01L27/14634 , H01L27/14636 , H01L27/1469 , H01L2224/11 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13109 , H01L2224/13144 , H01L2224/13609 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： An image sensor has a three-dimensional structure in which a sensor element array having a plurality of sensor elements consisting of CdTe, arranged in a two-dimensional matrix, is mounted to an IC substrate via a connection layer. The connection layer has a plurality of stud bumps and a plurality of thin film layers. The stud bumps are formed on an electrode of each IC and are provided in the connection layer in order to fetch a signal detected by each sensor element. The thin film layers are formed at the distal end of each stud bump, and are electrically connected with an electrode of each sensor element.

16. 发明授权

US10501210B2 Aerospace vehicle system 有权
公开(公告)号：US10501210B2
公开(公告)日：2019-12-10
申请号：US12254456
申请日：2008-10-20
申请人： Yoshikatsu Kuroda , Masahiro Atsumi , Naohiko Abe , Masahiro Kato
发明人： Yoshikatsu Kuroda , Masahiro Atsumi , Naohiko Abe , Masahiro Kato
IPC分类号： B64G1/24 , B64G1/00
CPC分类号： B64G1/002
摘要： In an aerospace vehicle in which a satellite is detachably adapted to the first stage rocket and the second stage rocket, an electronic device 65 is installed in the satellite 60, wherein the electronic device 65 controls the first stage rocket 10 and the second stage rocket 20 before the satellite is detached from the first stage rocket 10 and the second stage rocket 20. Thereby, it is unnecessary to provide sensors, radio devices and electronic devices for exclusive use with respect to the first stage rocket 10 and the second stage rocket 20 so that a manufacturing cost of the rockets 10 and 20 can be reduced and a total weight of the rockets 10 and 20 can become lighter by omitting these equipments. Thus, an aerospace vehicle system within the rockets 10 and 20 can be simplified and a launch of the aerospace vehicle can be prepared within a short period.

17. 发明授权

US07041981B2 Image sensor and manufacturing method thereof 有权
公开(公告)号：US07041981B2
公开(公告)日：2006-05-09
申请号：US10871029
申请日：2004-06-21
申请人： Yoshikatsu Kuroda , Tadayuki Takahashi
发明人： Yoshikatsu Kuroda , Tadayuki Takahashi
IPC分类号： G01T1/24
CPC分类号： H01L27/14676 , H01L24/11 , H01L24/13 , H01L27/14634 , H01L27/14636 , H01L27/1469 , H01L2224/11 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13 , H01L2224/1308 , H01L2224/13082 , H01L2224/13109 , H01L2224/13144 , H01L2224/13609 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： An image sensor has a three-dimensional structure in which a sensor element array having a plurality of sensor elements consisting of CdTe, arranged in a two-dimensional matrix, is mounted to an IC substrate via a connection layer. The connection layer has a plurality of stud bumps and a plurality of thin film layers. The stud bumps are formed on an electrode of each IC and are provided in the connection layer in order to fetch a signal detected by each sensor element. The thin film layers are formed at the distal end of each stud bump, and are electrically connected with an electrode of each sensor element.

18. 发明授权

US08222724B2 Semiconductor element module and method for manufacturing the same 有权
标题翻译：半导体元件模块及其制造方法
公开(公告)号：US08222724B2
公开(公告)日：2012-07-17
申请号：US12866322
申请日：2008-02-14
申请人： Daishi Ueno , Taro Wada , Masahiro Funayama , Yoshikatsu Kuroda , Yuichi Kondo , Shinichi Kobayashi , Koji Nakano , Kenj Fujiwara , Teruo Takeshita
发明人： Daishi Ueno , Taro Wada , Masahiro Funayama , Yoshikatsu Kuroda , Yuichi Kondo , Shinichi Kobayashi , Koji Nakano , Kenj Fujiwara , Teruo Takeshita
IPC分类号： H01L23/02
CPC分类号： H01L23/5385 , H01L23/051 , H01L23/3735 , H01L24/19 , H01L25/072 , H01L25/18 , H01L2924/01079 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： An object is to provide a semiconductor element module having high reliability, superior electric connection and thermal connection and capable of securing sufficient cooling performance, and also to provide a method for manufacturing the same. The semiconductor element module (1) comprises an IGBT (2) and a diode (3) having electrodes formed on surfaces of both sides thereof, a ceramic substrate (7), in which thermal conductivity is high, having wiring circuit layers (4, 5) formed on the surface thereof for bonding to surfaces of one side of the IGBT (2) and the diode (3), a ceramic substrate (8), in which thermal conductivity is high, having a wiring circuit layer (6) formed on the surface thereof for bonding to surfaces of other side of the IGBT (2) and the diode (3), and a sealing member (11) which is sandwiched between the outer edges of the ceramic substrates (7, 8) for sealing inside thereof; and these members are bonded by room-temperature bonding.
摘要翻译：本发明的目的是提供具有高可靠性，优良的电连接和热连接并且能够确保足够的冷却性能的半导体元件模块，并且还提供其制造方法。半导体元件模块（1）包括IGBT（2）和二极管（3），二极管（3）具有形成在其两侧表面的电极，陶瓷基板（7），其导热率高，具有布线电路层（4， 5），其形成在IGBT（2）和二极管（3）的一侧的表面上，形成导热性高的陶瓷基板（8），具有形成有布线电路层（6）的陶瓷基板在其表面上连接到IGBT（2）和二极管（3）的另一侧的表面，以及密封构件（11），其夹在陶瓷基板（7,8）的外边缘之间用于密封内部的; 并且这些构件通过室温粘合而结合。

19. 发明申请

US20110260071A1 COMPTON CAMERA 有权
公开(公告)号：US20110260071A1
公开(公告)日：2011-10-27
申请号：US13059715
申请日：2009-08-21
申请人： Mitsutaka Yamaguchi , Hirofumi Shimada , Takashi Nakano , Naoki Kawachi , Kazuo Arakawa , Tadayuki Takahashi , Shin Watanabe , Shinichiro Takeda , Hirokazu Odaka , Yoshikatsu Kuroda , Masahiro Kato , Kei Genba
发明人： Mitsutaka Yamaguchi , Hirofumi Shimada , Takashi Nakano , Naoki Kawachi , Kazuo Arakawa , Tadayuki Takahashi , Shin Watanabe , Shinichiro Takeda , Hirokazu Odaka , Yoshikatsu Kuroda , Masahiro Kato , Kei Genba
IPC分类号： G01T1/24
CPC分类号： G01T1/249 , G01T1/24 , G01T1/242
摘要： Plural camera heads are each placed in a position capable of detection of radiation emitted from a radiation source. Compton cones obtained from the detection data output from each of the plural camera heads are projected onto three-dimensional space and an image based on the radiation source is reconstructed. In addition, projected images from projecting Compton cones obtained from the detection data output from each camera head onto two-dimensional planes are also employed for determining a three-dimensional space excluding regions where the radiation source is not present. Reconstruction of images based on the radiation source is then performed within the determined three-dimensional space.
摘要翻译：多个相机头每个放置在能够检测从辐射源发射的辐射的位置。从多个相机头中的每一个输出的检测数据获得的康普顿锥被投影到三维空间上，并重建基于辐射源的图像。此外，从每个相机头输出的检测数据获得的投影康普顿锥的投影图像也被用于确定不存在辐射源的区域之外的三维空间。然后在确定的三维空间内执行基于辐射源的图像的重建。

20. 发明申请

US20110062600A1 SEMICONDUCTOR ELEMENT MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体元件元件及其制造方法
公开(公告)号：US20110062600A1
公开(公告)日：2011-03-17
申请号：US12866322
申请日：2008-02-14
申请人： Daishi Ueno , Taro Wada , Masahiro Funayama , Yoshikatsu Kuroda , Yuichi Kondo , Shinichi Kobayashi , Koji Nakano , Kenj Fujiwara , Teruo Takeshita
发明人： Daishi Ueno , Taro Wada , Masahiro Funayama , Yoshikatsu Kuroda , Yuichi Kondo , Shinichi Kobayashi , Koji Nakano , Kenj Fujiwara , Teruo Takeshita
IPC分类号： H01L23/48 , H01L21/28
CPC分类号： H01L23/5385 , H01L23/051 , H01L23/3735 , H01L24/19 , H01L25/072 , H01L25/18 , H01L2924/01079 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： An object is to provide a semiconductor element module having high reliability, superior electric connection and thermal connection and capable of securing sufficient cooling performance, and also to provide a method for manufacturing the same. The semiconductor element module (1) comprises an IGBT (2) and a diode (3) having electrodes formed on surfaces of both sides thereof, a ceramic substrate (7), in which thermal conductivity is high, having wiring circuit layers (4, 5) formed on the surface thereof for bonding to surfaces of one side of the IGBT (2) and the diode (3), a ceramic substrate (8), in which thermal conductivity is high, having a wiring circuit layer (6) formed on the surface thereof for bonding to surfaces of other side of the IGBT (2) and the diode (3), and a sealing member (11) which is sandwiched between the outer edges of the ceramic substrates (7, 8) for sealing inside thereof; and these members are bonded by room-temperature bonding.
摘要翻译：本发明的目的是提供具有高可靠性，优良的电连接和热连接并且能够确保足够的冷却性能的半导体元件模块，并且还提供其制造方法。半导体元件模块（1）包括IGBT（2）和二极管（3），二极管（3）具有形成在其两侧表面的电极，陶瓷基板（7），其导热率高，具有布线电路层（4， 5），其形成在IGBT（2）和二极管（3）的一侧的表面上，形成导热性高的陶瓷基板（8），具有形成有布线电路层（6）的陶瓷基板在其表面上连接到IGBT（2）和二极管（3）的另一侧的表面，以及密封构件（11），其夹在陶瓷基板（7,8）的外边缘之间用于密封内部的; 并且这些构件通过室温粘合而结合。

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