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    • 14. 发明申请
    • Metal/Semiconductor Compound Thin Film and a DRAM Storage Cell and Method of Making
    • 金属/半导体复合薄膜和DRAM存储单元及其制造方法
    • US20140008710A1
    • 2014-01-09
    • US13394303
    • 2011-09-28
    • Dongping WuShili ZhangZhiwei ZhuWei Zhang
    • Dongping WuShili ZhangZhiwei ZhuWei Zhang
    • H01L29/49H01L27/108
    • H01L29/4933H01L21/28525H01L27/108H01L27/10844H01L27/10855H01L27/10873
    • A metal-semiconductor-compound thin film is disclosed, which is formed between a semiconductor layer and a polycrystalline semiconductor layer, the metal-semiconductor-compound thin film having a thickness of about 2˜5 nm, so as to improve a contact between the semiconductor layer and the polycrystalline semiconductor layer. A DRAM storage cell is also disclosed. A metal-semiconductor-compound thin film having a thickness of about 2-5 nm is added between a drain region of a MOS transistor and a polycrystalline semiconductor buffer layer in the DRAM storage cell, so as to enhance read/write speed of the transistor of the DRAM storage cell while preventing excessive increase in leakage current between the drain region and a semiconductor substrate. A method for making a DRAM storage cell is also disclosed. A DRAM storage cell made using the method has a metal-semiconductor-compound thin film, with a thickness controlled at about 2˜5 nm, formed between a drain region of its MOS transitor and a polycrystalline semiconductor buffer layer, so as to enhance the performance of the DRAM storage cell.
    • 公开了一种形成在半导体层和多晶半导体层之间的金属 - 半导体化合物薄膜,其厚度为约2〜5nm的金属 - 半导体 - 化合物薄膜,从而改善了 半导体层以及多晶半导体层。 还公开了DRAM存储单元。 在DRAM存储单元中的MOS晶体管的漏极区域和多晶半导体缓冲层之间添加厚度约为2-5nm的金属半导体化合物薄膜,以提高晶体管的读/写速度 的同时防止漏极区域和半导体衬底之间的漏电流的过度增加。 还公开了一种用于制造DRAM存储单元的方法。 使用该方法制造的DRAM存储单元具有形成在其MOS跨极的漏极区域和多晶半导体缓冲层之间的厚度控制在约2〜5nm的金属 - 半导体 - 化合物薄膜,以便增强 DRAM存储单元的性能。
    • 16. 发明申请
    • Method of Making Metal/Semiconductor Compound Thin Film
    • 制造金属/半导体复合薄膜的方法
    • US20140011355A1
    • 2014-01-09
    • US13391623
    • 2011-09-28
    • Dongping WuZhiwei ZhuShili ZhangWei Zhang
    • Dongping WuZhiwei ZhuShili ZhangWei Zhang
    • H01L21/285
    • H01L21/28518H01L21/2855H01L29/456
    • The present disclosure provides a method of making metal/semiconductor compound thin films, in which a target material is partially ionized into an ionic state during metal deposition using a PVD process, so as to produce metal ions, and in which a substrate bias voltage is applied to a semiconductor substrate, causing the metal ions to accelerate into the semiconductor substrate and enter the semiconductor substrate, resulting in more metal ions diffusing to the surface of the semiconductor substrate, greater deposition depth, and increased thickness of the eventually formed metal/semiconductor compound thin film. An amount of metal ions entering the semiconductor substrate can be adjusted by adjusting the substrate bias voltage, so as to adjust the thickness of the eventually formed metal/semiconductor compound.
    • 本公开提供了一种制造金属/半导体化合物薄膜的方法,其中使用PVD工艺在金属沉积期间目标材料被部分电离成离子状态,以产生金属离子,并且其中衬底偏压为 施加到半导体衬底,使金属离子加速进入半导体衬底并进入半导体衬底,导致更多的金属离子扩散到半导体衬底的表面,更大的沉积深度和最终形成的金属/半导体的厚度增加 复合薄膜。 可以通过调整衬底偏置电压来调节进入半导体衬底的金属离子的量,以便调整最终形成的金属/半导体化合物的厚度。