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11. 发明授权

US4864465A Viad chip capacitor and method for making same 失效
标题翻译： Viad片式电容器及其制作方法
公开(公告)号：US4864465A
公开(公告)日：1989-09-05
申请号：US192098
申请日：1988-05-10
申请人： William L. Robbins
发明人： William L. Robbins
IPC分类号： H01G4/232 , H01G4/30
CPC分类号： H01G4/232 , H01G4/30 , Y10T29/435
摘要： A two pole viad chip capacitor that is activatable from either of its sides having a plurality of ceramic layers in a stack, each and every layer having only two vias, a first via in a first region of each layer and a second via in a second region of each layer; a first conductor in each of the first vias; a second conductor in each of the second vias; a stack of first capacitor plates being on first alternate ceramic layers and each first plate being in electrical contact with a first conductor; and a stack of second capacitor plates, the second plates being on second alternate ceramic layers that are interdigitated with the first alternate ceramic layers and in electrical contact with a second conductor.
摘要翻译：一种双极Viad片状电容器，其可从其两侧中的任一侧激活，其中堆叠中具有多个陶瓷层，每层仅具有两个通孔，每层的第一区域中的第一通孔和第二通孔中的第二通孔每层的区域; 每个第一通孔中的第一个导体; 每个第二通孔中的第二导体; 第一电容器板堆叠在第一替代陶瓷层上，并且每个第一板与第一导体电接触; 以及一叠第二电容器板，所述第二板位于与所述第一替代陶瓷层交叉并与第二导体电接触的第二替代陶瓷层上。

12. 发明授权

US06281572B1 Integrated circuit header assembly 失效
标题翻译：集成电路接头总成
公开(公告)号：US06281572B1
公开(公告)日：2001-08-28
申请号：US08986259
申请日：1997-12-05
申请人： William L. Robbins
发明人： William L. Robbins
IPC分类号： H01L23053
CPC分类号： H01L31/0203 , H01L2224/45144 , H01L2224/73204 , H01L2924/19107 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit (IC) header subassembly includes a spacer mounted to the header. The IC die assembly, consisting of an IC die or IC die carrier assembly, is mounted to spacer which is mounted to the header. The coefficient of thermal expansion of the spacer is selected to be between the coefficient of thermal expansion of the IC die assembly and the header minimize stresses due to thermal expansion and contraction. In addition, the spacer is substantially smaller in width and length and the IC die assembly and the header whereby the IC die assembly appears to be pedestal mounted. By minimizing the length of the contacting surfaces between the spacer and the IC die assembly, the risk of warping or cracking due to differences in thermal expansion can be reduced. This allows for much larger IC dies and pixel arrays to be used.
摘要翻译：集成电路（IC）头部子组件包括安装到头部的间隔件。由IC芯片或IC芯片载体组件组成的IC模具组件安装到安装到插头的间隔件上。间隔件的热膨胀系数选择在IC模头组件的热膨胀系数和集管之间，使由于热膨胀和收缩引起的应力最小化。此外，间隔件的宽度和长度显着更小，并且IC模具组件和集管，由此IC模具组件看起来是基座安装的。通过使间隔件和IC模具组件之间的接触表面的长度最小化，可以降低由于热膨胀差异引起的翘曲或破裂的风险。这允许使用更大的IC芯片和像素阵列。

13. 发明授权

US6020646A Intergrated circuit die assembly 失效
标题翻译：集成电路模具组装
公开(公告)号：US6020646A
公开(公告)日：2000-02-01
申请号：US985807
申请日：1997-12-05
申请人： John J. Boyle , William L. Robbins
发明人： John J. Boyle , William L. Robbins
IPC分类号： H01L21/56 , H01L21/60 , H01L31/0203 , H01L23/48 , H01L27/15
CPC分类号： H01L31/0203 , H01L21/563 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05666 , H01L2224/05669 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/73203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/15787 , H01L2924/19107
摘要： An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bonding, thin film or thick film conductors can be used to interconnect the pads on the IC die to the pads on the carrier. The coefficients of the thermal expansion of the IC die and the carrier are closely matched to avoid damage to the IC die due to uneven expansion of the thinned IC die relative to the carrier. The IC die carrier assembly is better suited for ultrahigh vacuum and high temperature environments than conventional IC die carrier assemblies.
摘要翻译：集成电路（IC）模具载体组件包括安装到基板或载体的薄化IC芯片。 IC芯片通过薄层玻璃安装到载体上。载体便于固定，并在用于模具的薄片研磨过程中提供支撑。可以使用球焊，引线接合，薄膜或厚膜导体将IC管芯上的焊盘与载体上的焊盘相互连接。 IC芯片和载体的热膨胀系数紧密匹配，以避免由于薄型IC芯片相对于载体的不均匀膨胀而损坏IC芯片。 IC模具载体组件比常规IC模具载体组件更适合于超高真空和高温环境。

14. 发明授权

US4695921A Film chip capacitor 失效
标题翻译：薄膜片式电容器
公开(公告)号：US4695921A
公开(公告)日：1987-09-22
申请号：US794984
申请日：1985-11-04
申请人： William L. Robbins
发明人： William L. Robbins
IPC分类号： H01G2/06 , H01G4/008 , H01G4/06 , H01G4/232 , H01G1/13 , H01G4/08
CPC分类号： H01G4/008 , H01G2/06 , H01G4/06 , H01G4/232
摘要： A chip capacitor comprising a plurality of parallel plastic organic film ers which film layers may further include organically bonded ceramic particles, interleaved with multiple thin parallel non-precious metal electrode film layers of aluminum, copper or the like, the capacitor further comprising suitable non-precious metal end caps and connector means the surfaces of adjacent dielectric films and electrodes being bonded together using bonding agents selected to provide the mechanical stability of the film chip capacitor.
摘要翻译：一种片状电容器，包括多个平行的塑料有机膜层，膜层可以进一步包括有机结合的陶瓷颗粒，与铝，铜等的多个薄平行的非贵金属电极膜层交错，贵金属端盖和连接器意味着使用选择用于提供薄膜芯片电容器的机械稳定性的粘结剂将相邻介电膜和电极的表面粘合在一起。

15. 发明授权

US4111255A Formation of metal parts 失效
标题翻译：形成金属部件
公开(公告)号：US4111255A
公开(公告)日：1978-09-05
申请号：US779494
申请日：1977-03-21
申请人： Theodore H. Krueger, Jr. , Robert Eller , John O'Brien , William L. Robbins
发明人： Theodore H. Krueger, Jr. , Robert Eller , John O'Brien , William L. Robbins
IPC分类号： B22D21/02 , B22D27/15 , H05K3/20 , B22D27/16
CPC分类号： H05K3/20 , B22D21/027 , B22D27/15 , H05K2203/0113 , H05K2203/128
摘要： The invention provides a new apparatus and method for forming thin metal parts of simple or intricate shape and depositing the same onto selected receiving surfaces. The parts may be in the form of wire leads which are bonded to the receiving surfaces. The invention consists in providing a hollow tool which includes a porous body with an exposed surface having a selected two-dimensional or three-dimensional geometry, immersing the surface of the porous body in a melt of a metal which will not wet the surface, pulling the tool away from the metal while applying a suction force to the porous body so that a portion of the melt will adhere to the surface, bringing the tool into contact with a receiving surface, and cooling the surface and removing the suction force so that the adhering portion of the melt will be deposited as a solid or partially solidified body onto the receiving surface. The deposited part will bond securely to the receiving surface if the latter is made of a material which is wetted by the melt.

16. 发明授权

US4044816A Formation of metal parts 失效
标题翻译：金属零件的形成
公开(公告)号：US4044816A
公开(公告)日：1977-08-30
申请号：US648315
申请日：1976-01-12
申请人： Theodore H. Krueger , Robert Eller , John O'Brien , William L. Robbins
发明人： Theodore H. Krueger , Robert Eller , John O'Brien , William L. Robbins
IPC分类号： B22D21/02 , B22D27/15 , H05K3/20 , B22D25/00 , B22D27/16
CPC分类号： H05K3/20 , B22D21/027 , B22D27/15 , H05K2203/0113 , H05K2203/128
摘要： The invention provides a new apparatus and method for forming thin metal parts of simple or intricate shape and depositing the same onto selected receiving surfaces. The parts may be in the form of wire leads which are bonded to the receiving surfaces. The invention consists in providing a hollow tool which includes a porous body with an exposed surface having a selected two-dimensional or three-dimensional geometry, immersing the surface of the porous body in a melt of a metal which will not wet the surface, pulling the tool away from the melt while applying a suction force to the porous body so that a portion of the melt will adhere to the surface, bringing the tool into contact with a receiving surface, and cooling the surface and removing the suction force so that the adhering portion of the melt will be deposited as a solid or partially solidified body onto the receiving surface. The deposited part will bond securely to the receiving surface if the latter is made of a material which is wetted by the melt.
摘要翻译：本发明提供一种用于形成简单或复杂形状的薄金属部件并将其沉积到所选接收表面上的新装置和方法。部件可以是接合到接收表面的导线的形式。本发明提供一种中空工具，其包括具有选定的二维或三维几何形状的暴露表面的多孔体，将多孔体的表面浸入不会润湿表面的金属熔体中，拉动所述工具远离熔体，同时向多孔体施加吸力，使得熔体的一部分将粘附到表面，使工具与接收表面接触，并且冷却表面并除去吸力，使得将熔体的粘附部分作为固体或部分固化的体积沉积到接收表面上。如果后者由被熔体润湿的材料制成，则沉积部分将牢固地结合到接收表面。

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