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    • 14. 发明授权
    • Nanowire FET and finFET
    • 纳米线FET和finFET
    • US08536029B1
    • 2013-09-17
    • US13529334
    • 2012-06-21
    • Josephine B. ChangChung-Hsun LinJeffrey W. Sleight
    • Josephine B. ChangChung-Hsun LinJeffrey W. Sleight
    • H01L21/20H01L21/36
    • H01L21/845B82Y10/00H01L27/1211H01L29/0673H01L29/42392H01L29/775H01L29/78696
    • A method includes thinning a first region of an active layer, for form a stepped surface in the active layer defined by the first region and a second region of the active layer, depositing an planarizing layer on the active layer that defines a planar surface disposed on the active layer, etching to define nanowires and pads in the first region of the active layer, suspending the nanowires over the BOX layer, etching fins in the second region of the active layer forming a first gate stack that surrounds portion of each of the nanowires, forming a second gate stack covering a portion of the fins, and growing an epitaxial material wherein the epitaxial material defines source and drain regions of the nanowire FET and source and drain regions of the finFET.
    • 一种方法包括使有源层的第一区域变薄,以形成由有源层的第一区域和第二区域限定的有源层中的阶梯表面,在活性层上沉积限定平面的平坦化层, 有源层,蚀刻以在有源层的第一区域中限定纳米线和焊盘,将纳米线悬挂在BOX层上,蚀刻有源层的第二区域中的鳍形成围绕每个纳米线的部分的第一栅极堆叠 形成覆盖所述翅片的一部分的第二栅极堆叠,以及生长外延材料,其中所述外延材料限定所述纳米线FET的源极和漏极区域以及所述finFET的源极和漏极区域。
    • 15. 发明申请
    • 8-TRANSISTOR SRAM CELL DESIGN WITH SCHOTTKY DIODES
    • 具有肖特基二极管的8晶体管SRAM单元设计
    • US20130176769A1
    • 2013-07-11
    • US13345619
    • 2012-01-06
    • Leland ChangIsaac LauerChung-Hsun LinJeffrey W. Sleight
    • Leland ChangIsaac LauerChung-Hsun LinJeffrey W. Sleight
    • G11C11/40
    • G11C11/417G11C11/412
    • An 8-transistor SRAM cell which includes two pull-up transistors and two pull-down transistors in cross-coupled inverter configuration to form two inverters for storing a single data bit, wherein each of the inverters includes a Schottky diode; first and second pass gate transistors having a gate terminal coupled to a write word line and a source or drain of each of the pass gate transistors coupled to a write bit line; and first and second read transistors coupled to the two pull-up and two pull-down transistors, one of the read transistors having a gate terminal coupled to a read word line and a source or a drain coupled to a read bit line. In a preferred embodiment, the 8-transistor SRAM cell has column select writing enabled for writing a value to the 8-transistor SRAM cell without inadvertently also writing a value to another 8-transistor SRAM cell.
    • 一种8晶体管SRAM单元,其包括两个上拉晶体管和两个交叉耦合的反相器配置的下拉晶体管,以形成用于存储单个数据位的两个反相器,其中每个反相器包括肖特基二极管; 第一和第二栅极晶体管,其具有耦合到写入字线的栅极端子和耦合到写位线的每个通路栅极晶体管的源极或漏极; 以及耦合到所述两个上拉和两个下拉晶体管的第一和第二读取晶体管,所述读取晶体管中的一个具有耦合到读取字线的栅极端子和耦合到读取位线的源极或漏极。 在优选实施例中,8晶体管SRAM单元具有使能用于向8晶体管SRAM单元写入值的列选择写入,而无需另外向另一个8-晶体管SRAM单元写入一个值。
    • 18. 发明授权
    • Multi-gate transistor having sidewall contacts
    • 具有侧壁接触的多栅极晶体管
    • US08338256B2
    • 2012-12-25
    • US12832829
    • 2010-07-08
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • Josephine B. ChangDechao GuoShu-Jen HanChung-Hsun Lin
    • H01L21/336H01L29/76
    • H01L29/785H01L29/66795H01L2029/7858
    • A multi-gate transistor having a plurality of sidewall contacts and a fabrication method that includes forming a semiconductor fin on a semiconductor substrate and etching a trench within the semiconductor fin, depositing an oxide material within the etched trench, and etching the oxide material to form a dummy oxide layer along exposed walls within the etched trench; and forming a spacer dielectric layer along vertical sidewalls of the dummy oxide layer. The method further includes removing exposed dummy oxide layer in a channel region in the semiconductor fin and beneath the spacer dielectric layer, forming a high-k material liner along sidewalls of the channel region in the semiconductor fin, forming a metal gate stack within the etched trench, and forming a plurality of sidewall contacts within the semiconductor fin along adjacent sidewalls of the dummy oxide layer.
    • 一种具有多个侧壁触点的多栅极晶体管及其制造方法,包括在半导体衬底上形成半导体鳍片并蚀刻半导体鳍片内的沟槽,在蚀刻沟槽内沉积氧化物材料,并蚀刻氧化物材料以形成 沿着蚀刻沟槽内的暴露壁的虚拟氧化物层; 以及沿所述虚拟氧化物层的垂直侧壁形成间隔电介质层。 该方法还包括去除半导体鳍片中的沟道区域中的暴露的虚拟氧化物层并且在间隔物电介质层下方形成沿着半导体鳍片中的沟道区域的侧壁形成高k材料衬垫,在蚀刻 沟槽,并且在半导体鳍片内沿虚拟氧化物层的相邻侧壁形成多个侧壁接触。
    • 19. 发明申请
    • DIFFUSION SIDEWALL FOR A SEMICONDUCTOR STRUCTURE
    • 用于半导体结构的扩散面板
    • US20120112310A1
    • 2012-05-10
    • US13351041
    • 2012-01-16
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • H01L29/06
    • H01L21/76224H01L21/76283H01L21/84H01L27/1203
    • A method of forming diffusion sidewalls in a semiconductor structure and a semiconductor structure having diffusion sidewalls includes etching a trench into a semiconductor substrate to form first and second active regions, lining each trench with an oxide liner along exposed sidewalls of an active silicon region (RX) of the first and second active regions, removing the oxide liner formed along the exposed sidewalls of the RX region of one of the first and second active regions, forming diffusion sidewalls by epitaxially growing in-situ doped material within the exposed sidewalls of the RX region of the one of the first and second active regions, and forming an isolation region within the trench between the first and second active regions to electrically isolate the first and second active regions from each other.
    • 在半导体结构中形成扩散侧壁的方法和具有扩散侧壁的半导体结构的方法包括将沟槽蚀刻到半导体衬底中以形成第一和第二有源区,沿着有源硅区(RX )去除沿着第一和第二有源区域之一的RX区域的暴露的侧壁形成的氧化物衬垫,通过在RX的暴露侧壁内外延生长原位掺杂材料来形成扩散侧壁 区域,并且在第一和第二有源区域之间的沟槽内形成隔离区域,以将第一和第二有源区域彼此电隔离。