专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20060275616A1 Silane-based coupling agent 审中-公开
标题翻译：硅烷偶联剂
公开(公告)号：US20060275616A1
公开(公告)日：2006-12-07
申请号：US11144456
申请日：2005-06-03
申请人： Robert Clough , Shichun Qu , Guoping Mao
发明人： Robert Clough , Shichun Qu , Guoping Mao
IPC分类号： B32B9/04 , B32B27/32
CPC分类号： C09D4/00 , C09D183/08 , Y10T428/31938
摘要： An article having a benzocyclobutene-based resin layer and a coupling agent containing a mixture of a vinylsilane and an aminosilane.
摘要翻译：具有苯并环丁烯系树脂层和含有乙烯基硅烷和氨基硅烷的混合物的偶联剂的制品。

12. 发明授权

US07012017B2 Partially etched dielectric film with conductive features 失效
标题翻译：具有导电特性的部分蚀刻介质膜
公开(公告)号：US07012017B2
公开(公告)日：2006-03-14
申请号：US10791966
申请日：2004-03-03
申请人： Dennis M. Brunner , David L. Buster , Michael S. Graff , Daniel K. Luebbert , Nathan P. Kreutter , Rui Yang , Guoping Mao
发明人： Dennis M. Brunner , David L. Buster , Michael S. Graff , Daniel K. Luebbert , Nathan P. Kreutter , Rui Yang , Guoping Mao
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/302
CPC分类号： H01L24/10 , H01L21/4853 , H01L21/486 , H01L23/49816 , H01L23/4985 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01057 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01093 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/002 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09036 , H05K2201/09563 , H05K2201/09827 , H05K2203/0369 , H01L2924/00
摘要： Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.
摘要翻译：提供了具有凸起导电特征的部分蚀刻的电介质膜。还提供了用于在介电膜中形成凸起的导电特征的方法，该方法包括部分蚀刻介电膜。

13. 发明授权

US06379865B1 Photoimageable, aqueous acid soluble polyimide polymers 失效
标题翻译：可光成像，含水酸溶性聚酰亚胺聚合物
公开(公告)号：US06379865B1
公开(公告)日：2002-04-30
申请号：US09547390
申请日：2000-04-11
申请人： Guoping Mao , Hany B. Eitouni , Alphonsus V. Pocius , John B. Scheibner , Nanayakkara L. D. Somasiri , Nicholas A. Stacey , Alfred Viehbeck
发明人： Guoping Mao , Hany B. Eitouni , Alphonsus V. Pocius , John B. Scheibner , Nanayakkara L. D. Somasiri , Nicholas A. Stacey , Alfred Viehbeck
IPC分类号： G03F709
CPC分类号： C08G73/1007 , C08G73/1025 , G03F7/0387 , G03F7/164 , H05K3/287 , H05K2203/135 , Y10S430/136
摘要： A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.
摘要翻译：包含酸酐的可光成像的含水酸性聚酰亚胺聚合物，包括取代的二苯甲酮核，与酸酐反应形成光敏聚合物中间体的二胺和至少60摩尔的增溶胺与感光性聚合物中间体反应形成可光成像，水溶性聚酰亚胺聚合物水溶液。用于电泳沉积可光成像的含水酸性聚酰亚胺聚合物涂层的乳液包括溶解在有机溶剂中的分散相，包括可光成像的含水溶性聚酰亚胺聚合物，以及包含聚结促进剂和水的分散相。可以通过电泳沉积将乳液施加到导电结构上，以在导电结构上提供可光成像的涂层。在将涂层暴露于辐照图案之后，将可光成像的含水溶性聚酰亚胺聚合物的曝光部分光致交联，酸性显影剂水溶液除去未曝光的可光成像的酸性水溶性聚酰亚胺聚合物，以露出辐射图案的交联聚酰亚胺聚合物图像。

14. 发明授权

US08835915B2 Assembly and electronic devices including the same 有权
标题翻译：组装和电子设备包括相同
公开(公告)号：US08835915B2
公开(公告)日：2014-09-16
申请号：US13880914
申请日：2011-11-17
申请人： Robert S. Clough , James C. Novack , David H. Redinger , Guoping Mao , Michael E. Griffin
发明人： Robert S. Clough , James C. Novack , David H. Redinger , Guoping Mao , Michael E. Griffin
IPC分类号： H01L51/05 , H01L51/00
CPC分类号： H01L51/0537 , H01L51/004 , H01L51/0055 , H01L51/0094 , H01L51/052
摘要： An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a crosslinked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.
摘要翻译：组件包括与半导体层接触的电介质层。介电层包括具有异氰脲酸酯基团的交联聚合物材料，其中介电层不含氧化锆颗粒。半导体层包括非聚合有机半导体材料，并且基本上不含电绝缘聚合物。还公开了包括组件的电子部件和装置。

15. 发明申请

US20130256640A1 ASSEMBLY AND ELECTRONIC DEVICES INCLUDING THE SAME 有权
标题翻译：包括其的组装和电子设备
公开(公告)号：US20130256640A1
公开(公告)日：2013-10-03
申请号：US13880914
申请日：2011-11-17
申请人： Robert S. Clough , James C. Novack , David H. Redinger , Guoping Mao , Michael E. Griffin
发明人： Robert S. Clough , James C. Novack , David H. Redinger , Guoping Mao , Michael E. Griffin
IPC分类号： H01L51/05
CPC分类号： H01L51/0537 , H01L51/004 , H01L51/0055 , H01L51/0094 , H01L51/052
摘要： An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a cross-linked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.
摘要翻译：组件包括与半导体层接触的电介质层。电介质层包括具有异氰脲酸酯基团的交联聚合物材料，其中介电层不含氧化锆颗粒。半导体层包括非聚合有机半导体材料，并且基本上不含电绝缘聚合物。还公开了包括组件的电子部件和装置。

16. 发明申请

US20070085194A1 DIELECTRIC COMPOSITE MATERIAL 审中-公开
公开(公告)号：US20070085194A1
公开(公告)日：2007-04-19
申请号：US11558133
申请日：2006-11-09
申请人： Guoping Mao , Shichun Qu , Fuming Li , Robert Clough , Nelson O'Bryan
发明人： Guoping Mao , Shichun Qu , Fuming Li , Robert Clough , Nelson O'Bryan
IPC分类号： H01L23/12 , H01L23/053 , H01L23/14 , H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： C08L65/00 , H01L23/49822 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0373 , H05K3/4626 , H05K2201/0209 , H05K2201/0239 , H01L2924/00
摘要： A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

17. 发明申请

US20050186404A1 Etched polycarbonate films 审中-公开
标题翻译：蚀刻聚碳酸酯膜
公开(公告)号：US20050186404A1
公开(公告)日：2005-08-25
申请号：US10784398
申请日：2004-02-23
申请人： Guoping Mao , Rui Yang , John Schultz
发明人： Guoping Mao , Rui Yang , John Schultz
IPC分类号： C08J7/12 , H05K3/00 , B60R13/00
CPC分类号： C08J7/12 , C08J2369/00 , H05K3/002 , H05K2203/0793 , H05K2203/122 , Y10T428/24917
摘要： Disclosed herein is a composition for etching a polycarbonate film comprising an alkali metal salt and an amine solubilizer. Also disclosed is a method for etching polycarbonate films with the etchant and an article containing the etched film. The article is useful for, e.g., flexible circuits and carrier tapes.
摘要翻译：本文公开了一种用于蚀刻包含碱金属盐和胺增溶剂的聚碳酸酯膜的组合物。还公开了用蚀刻剂和含有蚀刻膜的制品蚀刻聚碳酸酯膜的方法。该物品对于例如柔性电路和载带是有用的。

18. 发明授权

US06686308B2 Supported nanoparticle catalyst 失效
标题翻译：负载纳米粒子催化剂
公开(公告)号：US06686308B2
公开(公告)日：2004-02-03
申请号：US10005524
申请日：2001-12-03
申请人： Shane Shanhong Mao , Guoping Mao
发明人： Shane Shanhong Mao , Guoping Mao
IPC分类号： B01J2118
CPC分类号： H01M4/92 , B01J21/18 , B01J23/42 , B01J23/462 , B01J35/0013 , B01J37/0203 , B01J37/0211 , B01J37/031 , H01M4/926 , H01M8/1004 , H01M2008/1095 , Y02P70/56
摘要： A supported catalyst is provided comprising catalyst metal nanoparticles having an average particle size of 3.0 nm or less, or more typically 2.0 nm or less, and typically having a standard deviation of particle size of 0.5 nm or less, which are supported on support particles at a loading of 30% or more. Typical catalyst metals are selected from platinum, palladium, ruthenium, rhodium, iridium, osmium, molybdenum, tungsten, iron, nickel and tin. Typical support particles are carbon. A method of making a supported catalyst is provided comprising the steps of: a) providing a solution of metal chlorides of one or more catalyst metals in solvent system containing at least one polyalcohol, typically ethylene glycol containing less than 2% water; b) forming a colloidal suspension of unprotected catalyst metal nanoparticles by raising the pH of the solution, typically to a pH of 10 or higher, and heating said solution, typically to 125 ° C. or higher; c) adding support particles to the colloidal suspension; and d) depositing the unprotected catalyst metal nanoparticles on the support particles by lowering the pH of said suspension, typically to a pH of 6.5 or lower.
摘要翻译：提供了一种负载型催化剂，其包含平均粒径为3.0nm以下，更通常为2.0nm以下的催化剂金属纳米颗粒，通常具有0.5nm以下的粒径的标准偏差，负载在载体颗粒上装载30％以上。典型的催化剂金属选自铂，钯，钌，铑，铱，锇，钼，钨，铁，镍和锡。典型的载体颗粒是碳。提供一种制备负载型催化剂的方法，包括以下步骤：a）在含有至少一种多元醇（通常含有少于2％水的乙二醇）的溶剂体系中提供一种或多种催化剂金属的金属氯化物溶液; b）通过将溶液的pH提高至10或更高的pH而形成未保护的催化剂金属纳米颗粒的胶态悬浮液，并将所述溶液加热至125℃或更高; c）将胶体悬浮液中的载体颗粒加入; 和d）通过降低所述悬浮液的pH，将未保护的催化剂金属纳米颗粒沉积在载体颗粒上，通常达到6.5或更低的pH。

19. 发明授权

US06559245B2 Photoimageable, aqueous acid soluble polyimide polymers 失效
公开(公告)号：US06559245B2
公开(公告)日：2003-05-06
申请号：US10038270
申请日：2002-01-03
申请人： Guoping Mao , Nanayakkara L. D. Somasiri , Nicholas A. Stacey
发明人： Guoping Mao , Nanayakkara L. D. Somasiri , Nicholas A. Stacey
IPC分类号： C08F28304
CPC分类号： C08G73/1007 , C08G73/1025 , G03F7/0387 , G03F7/164 , H05K3/287 , H05K2203/135 , Y10S430/136
摘要： A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.

20. 发明授权

US5290397A Bilayer resist and process for preparing same 失效
标题翻译：双层抗蚀剂及其制备方法
公开(公告)号：US5290397A
公开(公告)日：1994-03-01
申请号：US934088
申请日：1992-08-21
申请人： Christopher K. Ober , Allen H. Gabor , Eric A. Lehner , Guoping Mao , Lizabeth A. Schneggenburger
发明人： Christopher K. Ober , Allen H. Gabor , Eric A. Lehner , Guoping Mao , Lizabeth A. Schneggenburger
IPC分类号： G03F7/075 , H01L21/027 , B44C1/22 , B29C37/00
CPC分类号： G03F7/075 , H01L21/0274
摘要： A resist pattern on a substrate is formed using an imageable resist layer on the surface of a substrate. The imageable resist layer comprises a silicon-incorporated polystyrene-diene block copolymer having a silicon weight percent of at least about 5 percent. The imageable layer is prepared by reacting a polystyrene-diene block copolymer with a silicon-containing compound in the presence of a platinum catalyst. In a preferred embodiment, the poly(styrene)-diene block copolymers are hydrosilylated by hydrosiloxanes using a platinum-divinyl tetramethyl disiloxane catalyst.
摘要翻译：使用基板表面上的可成像抗蚀剂层形成基板上的抗蚀剂图案。可成像抗蚀剂层包含硅重量百分比至少约5％的掺入硅的聚苯乙烯 - 二烯嵌段共聚物。通过在铂催化剂存在下使聚苯乙烯 - 二烯嵌段共聚物与含硅化合物反应来制备可成像层。在一个优选的实施方案中，聚（苯乙烯） - 二烯嵌段共聚物通过使用铂 - 二乙烯基四甲基二硅氧烷催化剂的氢硅氧烷氢化硅烷化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式