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    • 11. 发明申请
    • Liquid organopolysiloxane composition for matting and cured article having a matted surface
    • 用于消光和固化制品的液体有机聚硅氧烷组合物具有无光泽表面
    • US20070287014A1
    • 2007-12-13
    • US11808082
    • 2007-06-06
    • Toshiyuki OzaiMitsuhiro Iwata
    • Toshiyuki OzaiMitsuhiro Iwata
    • B32B9/04C08K3/40
    • C08L83/04C08G77/12C08G77/20C08K7/22Y10T428/24372Y10T428/24421Y10T428/31663C08L83/00
    • A liquid organopolysiloxane composition is provided. This composition can readily form a cured article having a matted surface without requiring separate step such as mechanical surface roughening, and this composition is well adapted for use as a potting material or a coating material in electric and electronic components such as LED. An article having a matted surface produced by curing such composition is also provided. The liquid organopolysiloxane composition for matting comprises (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition, and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., a specific weight of 0.01 to 0.8, and a particle size of up to 200 μm. The composition has a viscosity at room temperature of 100 to 100,000 mPa·s. The resulting cured article has a surface glossiness of up to 40.
    • 提供液体有机聚硅氧烷组合物。 该组合物可以容易地形成具有无光表面的固化制品,而不需要诸如机械表面粗糙化的单独步骤,并且该组合物很好地适用于诸如LED的电气和电子部件中的灌封材料或涂料。 还提供了通过固化该组合物制成的具有无光泽表面的制品。 用于消光的液体有机基聚硅氧烷组合物包含(A)100重量份的热固性液体有机基聚硅氧烷组合物,和(B)0.1至100重量份的熔点至少为150℃的中空填料, 为0.01〜0.8,粒径可达200​​μm。 该组合物在室温下具有100至100,000mPa.s的粘度。 所得到的固化制品的表面光泽度高达40。
    • 13. 发明授权
    • Heat-curable silicone composition and light emitting diode element using same
    • 可热固化的硅氧烷组合物和使用其的发光二极管元件
    • US07915362B2
    • 2011-03-29
    • US11859123
    • 2007-09-21
    • Toshiyuki Ozai
    • Toshiyuki Ozai
    • C08G77/20
    • C09K3/1018C08K5/14C08L83/06C08L83/14H01L33/56C08L2666/34
    • Provided is a heat-curable silicone composition containing: (A) an organopolysiloxane having at least one structure represented by the following general formula (2) within each molecule: wherein m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R2 represents a hydrogen atom or a methyl group, R3 represents an identical or different monovalent organic group having 1 to 10 carbon atoms, and R4 represents an identical or different bivalent organic group having 1 to 10 carbon atoms; and (B) a quantity of an organic peroxide that is effective as a curing catalyst. The heat-curable silicon composition yields a cured product having excellent transparency and minimal discoloration over time. Also provided is a light emitting diode element having a material composed of the cured product.
    • 本发明提供一种可热固化的硅氧烷组合物,其含有:(A)在每个分子内具有至少一个由以下通式(2)表示的结构的有机聚硅氧烷:其中m表示0,1或2的整数,R 1表示氢原子 ,苯基或卤代苯基,R 2表示氢原子或甲基,R 3表示相同或不同的具有1〜10个碳原子的一价有机基团,R 4表示相同或不同的1价〜10元的有机基团 碳原子 和(B)一定量的作为固化催化剂有效的有机过氧化物。 可热固化的硅组合物产生具有优异透明度和随时间变化最小的固化产物。 还提供了具有由固化产物组成的材料的发光二极管元件。
    • 17. 发明申请
    • Heat conductive silicone composition
    • 导热硅胶组合物
    • US20060270788A1
    • 2006-11-30
    • US11439277
    • 2006-05-24
    • Toshiyuki OzaiNaoki Yamakawa
    • Toshiyuki OzaiNaoki Yamakawa
    • C08G59/40
    • C08L83/04C08G77/045C08G77/12C08G77/14C08G77/18C08G77/20C08L83/00
    • A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o  (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties
    • 提供了一种导热硅氧烷组合物,其包括(A)具有式(1)的有机聚硅氧烷:<?in-line-formula description =“In-line formula”end =“lead”?> {(CH < 2 - - - - - - - - - - - - - - - - - - - - - - - - (1) 1 SiO 2/2/2)SiO 2(R 1)2 SiO 2)n < / O 2 1/2 SiR 1 - 2 - - - - - - - - - - - - - - - - - - - - - (3-a)(或<3>)(1)<? -formulae description =“In-line Formulas”end =“tail”?>其中R 1表示一价烃基,R 2表示氧原子或二价烃基 R 3表示烷基,烷氧基烷基,烯基或酰基,L和o表示1〜10的数,m表示0〜10的数,n表示5以上的数 至100时,a表示1〜3的整数,当m = 0时,L + o = 2,R 2为二价烃基,(B) 导电填料,(C)除(A)成分以外的有机聚硅氧烷。 即使使用导热填料进行高级包装以获得高导热性,组合物仍然表现出良好的处理和成型性能
    • 18. 发明申请
    • SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT
    • 硅胶用于半导体元件
    • US20090258216A1
    • 2009-10-15
    • US12421876
    • 2009-04-10
    • Naoki YAMAKAWAKei MiyoshiToshiyuki OzaiYoshinori Ogawa
    • Naoki YAMAKAWAKei MiyoshiToshiyuki OzaiYoshinori Ogawa
    • B32B7/12C09J183/00C09J183/06
    • H01L33/56C09J183/14
    • A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.
    • 一种用于半导体元件的硅粘合剂,其适合作为用于将发光二极管芯片固定到基板的芯片接合材料。 粘合剂包括(a)在25℃下的粘度不大于100Pa.s的加成反应固化性有机硅树脂组合物,并且在150℃加热3小时时产生固化产物,其具有类型 JIS K6253规定的D硬度为30以上,(b)平均粒径小于1μm的白色颜料粉末,(c)平均粒径为1μm以上的白色或无色透明粉末 但少于10个妈妈。 粘合剂显示出高水平的隐蔽性,有效地反映了从LED芯片发出的光,并且还显示出有利的芯片定位性能,优异的粘合强度和优异的耐久性。