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    • 12. 发明申请
    • Cooling structure and cooling method for electronic equipment
    • 电子设备冷却结构及冷却方式
    • US20050122680A1
    • 2005-06-09
    • US11034138
    • 2005-01-12
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • H05K5/00H05K7/20
    • H05K7/20581H05K7/207
    • A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the first electronic device or air inside of the second electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electric device is controlled.
    • 一种用于电子设备的冷却结构,包括彼此叠置的多个电子设备,每个电子设备具有下部,其中空气通风部分构造成使空气通风以冷却电子设备,该冷却结构包括: 进气排气孔形成部分,其形成在第一电子设备的上部并且设置在第一电子设备上的第二电子设备的空气通风部分的下方。 电子设备外部的空气被吸入第一电子设备的内部,或者第二电子设备内部的空气经由进气和排气孔形成部件被排出到电子设备的外部,使得空气量 控制第一电气设备内的通风。