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    • 11. 发明申请
    • OPTICAL FIBER SENSING SYSTEM
    • 光纤传感系统
    • US20110141459A1
    • 2011-06-16
    • US13059821
    • 2009-08-20
    • Seiichi OnodaKeiichi InoueMasayuki Nakano
    • Seiichi OnodaKeiichi InoueMasayuki Nakano
    • G01D5/353
    • G01B11/18G01D5/268G01D5/30
    • Provided is an optical fiber sensing system that can carry out measurement accurately without being affected by measurement noise factors other than the physical-quantity attribute of a measurement target object, for example, the effects of the emission power of a light source, fiber insertion loss, fluctuations in the sensitivity of a photo detector, fluctuations in the amplitude of an amplifier or other fluctuations, the loss of optical energy due to the bending of an optical fiber (bending loss), the loss of optical energy due to the connecting of two or more optical fibers by means of connectors (connector loss), the gain fluctuations of electric circuitry provided on a platform, and so forth. A reflective sensor is connected to an end of an optical fiber connected to a light source. The light source outputs physical measurement light. Reflected light coming from the reflective sensor is separated into two beams of light. Information on the physical quantity of a measurement target object is detected on the basis of an intensity ratio of the two beams.
    • 提供一种能够精确地进行测量而不受测量目标物体的物理量属性以外的测量噪声因素的影响的光纤传感系统,例如光源的发射功率的影响,光纤插入损耗 ,光检测器的灵敏度波动,放大器幅度的波动或其他波动,光纤弯曲导致的光能损失(弯曲损耗),由于连接两个光纤的光能损失 或更多的光纤通过连接器(连接器损耗),在平台上提供的电路的增益波动等等。 反射传感器连接到连接到光源的光纤的端部。 光源输出物理测量光。 来自反射传感器的反射光分离成两束光。 基于两个光束的强度比来检测关于测量对象物体的物理量的信息。
    • 16. 发明授权
    • Method for fabricating ceramic electronic parts
    • 陶瓷电子零件的制造方法
    • US5916395A
    • 1999-06-29
    • US804896
    • 1997-02-24
    • Mamoru OgawaTakashi NojiKeiichi Inoue
    • Mamoru OgawaTakashi NojiKeiichi Inoue
    • H01G13/00B32B31/00
    • H01G13/006Y10T156/1089Y10T29/49224
    • A method for fabricating ceramic electronic parts allows external electrodes to be baked onto the electronic parts without overlaying powder on the sagger. An adhesive material layer is provided on a surface of a sagger on which electronic parts are placed. The sagger is inserted into a firing oven with the electronic parts adhesively fixed onto the adhesive material layer, whereby the external electrodes of the electronic parts are baked. The adhesive layer burns away during the firing process. The method including such steps eliminates the need of overlaying powder onto the sagger, so that no powder sticks to the external electrodes after baking, so that the process of removing powder is no longer necessitated.
    • 制造陶瓷电子部件的方法允许将外部电极烘烤到电子部件上,而不会在粉碎机上重叠粉末。 粘合材料层设置在其上放置有电子部件的砧座的表面上。 将s子插入烧成炉中,将电子部件粘合地固定在粘合材料层上,由此烘烤电子部件的外部电极。 在烧制过程中,粘合剂层烧掉。 包括这样的步骤的方法消除了将粉末重叠在s子上的需要,使得烘烤后没有粉末粘附到外部电极,因此不再需要除去粉末的过程。