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    • 13. 发明授权
    • Semiconductor device and process for making the same
    • 半导体器件及其制造方法
    • US4270262A
    • 1981-06-02
    • US880618
    • 1978-02-23
    • Ryoichi HoriMasaharu KuboNorikazu HashimotoShigeru NishimatsuKiyoo Itoh
    • Ryoichi HoriMasaharu KuboNorikazu HashimotoShigeru NishimatsuKiyoo Itoh
    • H01L27/10H01L21/3213H01L21/60H01L21/768H01L21/8242H01L23/522H01L27/108H01L27/115H01L29/78H01L21/70H01L21/90
    • H01L27/10844H01L21/76877H01L21/76897H01L27/115
    • A first semiconductor circuit element including a first electrode is formed on a semiconductor substrate, an inter-layer insulating layer for insulating the first electrode is formed on the first electrode, and a first penetrating opening is provided in a part of the inter-layer insulating layer.Subsequently, a step of forming a second semiconductor circuit element is carried out, this step including a step of forming a second electrode so that at least a part thereof may overlie the inter-layer insulating layer at an area other than the first penetrating opening. Further, a subsidiary interconnection conductive layer is buried into the first opening. Another insulating layer is formed on the structure thus formed, whereupon second and third penetrating openings are respectively provided in the insulating layer over the second electrode and the interconnection subsidiary conductive layer.First and second interconnection conductors are respectively buried into the second and third penetrating openings. The first electrode is conductively connected with the second interconnection conductor in the third opening via the subsidiary interconnection conductive layer in the first opening. The second electrode is conductively connected with the first interconnection conductor in the second opening.
    • 包括第一电极的第一半导体电路元件形成在半导体衬底上,在第一电极上形成用于绝缘第一电极的层间绝缘层,并且第一穿透开口设置在层间绝缘体的一部分中 层。 随后,执行形成第二半导体电路元件的步骤,该步骤包括形成第二电极的步骤,使得其至少一部分可以覆盖除了第一穿透开口之外的区域的层间绝缘层。 此外,辅助互连导电层被埋入第一开口中。 在由此形成的结构上形成另一绝缘层,由此在第二电极和互连副导电层上的绝缘层中分别设置第二和第三穿透开口。 第一和第二互连导体分别埋入第二和第三穿透开口中。 第一电极通过第一开口中的辅助互连导电层与第三开口中的第二互连导体导电连接。 第二电极与第二开口中的第一互连导体导电连接。