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    • 11. 发明授权
    • Method of producing a frame made of connected semiconductor die mounting
substrates
    • 制造由连接的半导体管芯安装基板制成的框架的方法
    • US5614443A
    • 1997-03-25
    • US622144
    • 1996-03-27
    • Takashi NakashimaKeiji TakaiKouji Tateishi
    • Takashi NakashimaKeiji TakaiKouji Tateishi
    • H01L23/12H01L21/98H01L23/50H01L23/538H01L25/065H01L21/60
    • H01L25/50H01L23/5385H01L25/0655H01L2924/0002Y10T156/1057Y10T29/4921Y10T29/49222
    • Method of producing a frame made of connected semiconductor die mounting substrates comprises i) a first step for producing a metal substrate sheet wherein an original material for metal substrate sheet of a desired size is cut out from a metal material and an erosion preventing layer is provided on the entire surface thereof, ii) a second step for producing a circuit substrate sheet wherein the circuit substrate sheet is made of a resin substrate coated with a copper leaf layer and is provided with a lead pattern on the surface thereof in place, iii) a third step for producing a connected semiconductor die mounting substrate sheet by adhering the metal substrate sheet to the circuit substrate sheet, iv) a fourth step for forming a plurality of pilot apertures and slits on the connected semiconductor die mounting substrate sheet by press working and v) a fifth step for producing a plurality of connected semiconductor die mounting substrate frames by separating the connected semiconductor die mounting substrate sheet.
    • 制造由连接的半导体管芯安装基板制成的框架的方法包括:i)制造金属基片的第一步骤,其中提供从金属材料切割所需尺寸的金属基片的原始材料和防腐蚀层 在其整个表面上,ii)用于制造电路基片的第二步骤,其中电路基片由涂有铜箔层的树脂基片制成,并在其表面上设有引线图案,iii) 第三步骤,通过将金属基片粘附到电路基片上来制造连接的半导体管芯安装基片; iv)第四步骤,用于通过冲压加工在连接的半导体管芯安装基片上形成多个引导孔和狭缝, v)通过分离连接的半导体来生产多个连接的半导体管芯安装衬底框架的第五步骤 或模具安装基板。
    • 13. 发明授权
    • Word line drive circuit of semiconductor memory device
    • 半导体存储器件的字线驱动电路
    • US5297104A
    • 1994-03-22
    • US850840
    • 1992-03-13
    • Takashi Nakashima
    • Takashi Nakashima
    • G11C11/413G11C8/08G11C11/407G11C11/408H01L21/8242H01L27/10H01L27/108G11C7/00
    • G11C11/4085G11C8/08
    • Disclosed is a word line drive circuit of an LSI semiconductor memory device comprising a plurality of word lines, a plurality of memory cells connected each to the word line, a row decoder and drive circuit connected to said plurality of word lines for selecting and driving the word line from a first voltage level to a second voltage level in response to an input address signal in a memory cycle, and a negative voltage generating circuit connected to the plurality of word lines for generating a negative voltage in a non-memory cycle, wherein the word line drive circuit comprises a reset circuit for maintaining the selected word line at an intermediate voltage level between the first voltage level and the second voltage level at least in one point of an end point and an starting point of the memory cycle.
    • 公开了一种LSI半导体存储器件的字线驱动电路,其包括多个字线,连接到字线的多个存储单元,连接到所述多个字线的行解码器和驱动电路,用于选择和驱动 字线从响应于存储器周期中的输入地址信号的第一电压电平到第二电压电平;以及负电压产生电路,连接到所述多个字线,用于在非存储器周期中产生负电压,其中 字线驱动电路包括复位电路,用于在所述存储器周期的终点和起始点的至少一个点中将所选择的字线保持在第一电压电平和第二电压电平之间的中间电压电平。
    • 18. 发明授权
    • Steel tube for bearing element parts and method of manufacturing as well as machining the same
    • 用于轴承元件零件的钢管和制造方法以及机加工
    • US07393420B2
    • 2008-07-01
    • US11191914
    • 2005-07-29
    • Yoshihiro DaitoTakashi Nakashima
    • Yoshihiro DaitoTakashi Nakashima
    • C22C38/18C21D8/10
    • C22C38/02C21D1/32C21D8/10C22C38/04C22C38/18C22C38/22Y10S148/909Y10S384/912
    • Steel tubes for bearing element parts according to the present invention, wherein the specific compositions are limited and an accumulation intensity of {211} face along with an impact property at ambient temperature in the longitudinal direction of steel tube are specified, can be provided as a source material for bearing element parts, which have excellent machinability and fatigue life in rolling contact, being incorporated without adding a free-cutting element specifically nor without reducing productivity since the spheroidizing for the same annealing duration with that of conventional spheroidizing treatment can be applied. Accordingly, by applying a manufacturing method or a cutting-machining method according to the present invention, bearing element parts such as races, rollers and shafts can be produced with less cost and efficiently.
    • 根据本发明的用于轴承元件部件的钢管,其特征在于,限定了特定组成,并规定了{211}面的堆积强度以及在钢管的长度方向上的环境温度下的冲击性能,作为 可以应用具有优异的机械加工性和滚动疲劳寿命的轴承元件用原料,其特征在于并不添加自由切削元件也不降低生产率,因为可以应用与常规球化处理相同的退火持续时间的球化。 因此,通过应用本发明的制造方法或切削加工方法,可以以较低的成本和效率制造诸如座圈,滚子和轴的轴承元件部件。