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    • 12. 发明授权
    • Electronic apparatus
    • 电子仪器
    • US06292365B1
    • 2001-09-18
    • US09398036
    • 1999-09-17
    • Noriyuki AshiwakeToshio OtaguroAtsuo NishiharaMitsuru Honma
    • Noriyuki AshiwakeToshio OtaguroAtsuo NishiharaMitsuru Honma
    • H05K720
    • H01L23/473H01L2224/73204H01L2924/09701
    • It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which a heating region is built in the multilayered wiring substrate of the semiconductor package or module on the side near to the input/output pins, the semiconductor package or module and the cooler mounted on the package or module are placed in a moisture proof case, a heat insulating material is filled in the gaps between the moisture proof case, semiconductor package or module and cooler, and a heater is provided on the outer periphery of the heat insulating material.
    • 本发明的目的是提供一种电子设备的冷却器,其能够将半导体芯片保持在低温而不用冷凝,并且其紧凑性优异。 为了实现上述目的,本发明提出了一种电子设备,其中在靠近输入/输出引脚,半导体封装或模块和冷却器的一侧的半导体封装或模块的多层布线基板中内置加热区域 安装在包装或模块上的防潮壳体放置在防潮壳体,半导体封装件或模块与冷却器之间的间隙中,隔热材料填充在隔热材料的外周上, 。
    • 14. 发明申请
    • Power Conversion Device
    • 电源转换装置
    • US20130128646A1
    • 2013-05-23
    • US13811497
    • 2011-07-25
    • Atsuo NishiharaKenichiro NakajimaKeisuke Horiuchi
    • Atsuo NishiharaKenichiro NakajimaKeisuke Horiuchi
    • H05K7/20
    • H05K7/20H01L23/367H01L23/473H01L23/552H01L25/072H01L2924/0002H01L2924/1203H01L2924/13055H01L2924/13091H02M7/003H02M7/48H01L2924/00
    • A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144. The flow passage control portion 16b is arranged in a gap formed between the flange portion 13b and the group of radiator fins 144, and introduces the cooling medium into the group of radiator fins 144 while preventing the cooling medium from flowing into gaps 51c.
    • 电力转换装置包括:冷却基座5,其中形成有冷却介质流动的流动通道51和与流动通道51连通的开口部分50; 电源模块1; 和流路控制部16b。 功率模块1具有底部的圆筒部13a,其中容纳有功率半导体元件,并且通过开口部50插入到流路51中;凸缘部13b,形成在圆筒部13a的开口上,并且是 固定在冷却基座5上,以封闭开口部分50;以及一组散热器散热片144,其安装在圆筒部分13a的外圆周表面上,具有形成在凸缘部分13b和 一组散热器散热片144.流路控制部分16b布置在形成在凸缘部分13b和一组散热片144之间的间隙中,并将冷却介质引入散热片144的一组中,同时防止冷却介质流动 进入间隙51c。
    • 19. 发明申请
    • Electric Power Converter
    • 电力转换器
    • US20140078803A1
    • 2014-03-20
    • US14122713
    • 2012-05-25
    • Atsuo NishiharaKen MaedaKinya NakatsuYukio Hattori
    • Atsuo NishiharaKen MaedaKinya NakatsuYukio Hattori
    • H02M7/00
    • H02M7/003H02M7/797H05K7/1432H05K7/20927
    • An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.
    • 电力转换器具有:功率半导体模块,具有将直流电转换为交流电的功率半导体元件; 电容器模块,其具有使直流平滑的电容器元件; 以及冷却功率半导体模块和电容器模块的冷却体。 电容器模块具有大致矩形形状的壳体,具有形成在一个表面上的开口,并且具有用于容纳电容器元件的空间; 以及用于将功率半导体元件和电容器元件彼此电连接的DC导体。 冷却体形成为面对壳体的内壁上的底面,并且壳体的两侧表面彼此面对。 在电容器元件和壳体的内壁表面之间,直流导体沿壳体的底表面和两个侧表面形成。