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    • 14. 发明授权
    • Method and system for forming a variable thickness seed layer
    • 用于形成可变厚度种子层的方法和系统
    • US07351285B2
    • 2008-04-01
    • US11092266
    • 2005-03-29
    • Tsukasa Matsuda
    • Tsukasa Matsuda
    • C30B23/00C23C16/00B05D3/00
    • C23C16/18C23C16/16H01L21/28556H01L21/76868H01L21/76873
    • A method and system for forming a variable thickness seed layer on a substrate for a subsequent metal electrochemical plating process, where the seed layer thickness profile improves uniformity of the electroplated metal layer compared to when using a constant thickness seed layer. The method includes providing a substrate in a process chamber containing a showerhead, with the center of the substrate generally aligned with an inner gas delivery zone of the showerhead and the edge of the substrate generally aligned with an outer gas delivery zone of the showerhead. The method further includes depositing a seed layer on the substrate by exposing the substrate to a first gas containing a metal-containing precursor flowed through the inner gas delivery zone, and exposing the substrate to a second gas flowed through the outer gas delivery zone, whereby the seed layer is deposited with a thickness at the edge of the substrate that is less than the thickness at the center of the substrate.
    • 一种用于在随后的金属电化学电镀工艺的衬底上形成可变厚度籽晶层的方法和系统,其中与使用恒定厚度的种子层相比,种子层厚度分布改善了电镀金属层的均匀性。 该方法包括在包含喷头的处理室中提供衬底,其中衬底的中心大致与喷头的内部气体输送区域对准,并且衬底的边缘与喷头的外部气体输送区域大致对准。 该方法还包括通过将衬底暴露于含有流过内部气体输送区的含金属前体的第一气体,并将衬底暴露于流过外部气体输送区的第二气体,从而将衬底层沉积在衬底上,由此 籽晶层在衬底的边缘处被沉积成小于衬底中心的厚度。