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11. 发明申请

WO2013036561A2 BROAD-AREA LIGHTING SYSTEMS 审中-公开
标题翻译：广域照明系统
公开(公告)号：WO2013036561A2
公开(公告)日：2013-03-14
申请号：PCT/US2012/053841
申请日：2012-09-06
申请人： COOLEDGE LIGHTING, INC. , TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin, Wade
发明人： TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin, Wade
IPC分类号： H01L25/075 , F21V5/04 , F21V5/00 , F21K99/00
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
摘要翻译：根据某些实施例，通过将发光元件与光学元件对准和/或在发光元件上设置光转换材料以及通过提供与发光元件的电连接来形成照明系统

12. 发明公开

EP1861876A1 SOLID-STATE LIGHTING DEVICE PACKAGE 审中-公开
标题翻译：半导体照明设备HOUSING
公开(公告)号：EP1861876A1
公开(公告)日：2007-12-05
申请号：EP06721708.3
申请日：2006-03-24
申请人： Tir Systems Ltd.
发明人： SCHICK, Philippe , SPEIER, Ingo
IPC分类号： H01L23/34 , H01L23/02 , F21V13/04 , H01L25/075 , H01L33/00
CPC分类号： H01L33/642 , H01L25/0753 , H01L25/167 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/648 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction from the one or more light-emitting elements within the lighting device package. The lighting device package comprises a substrate having a thermally conductive region to which one or more light-emitting elements are thermally connected, wherein the light-emitting elements may be relatively closely packed. An optical system is optically coupled to one or more light emitting elements, and is positioned relative to the substrate such that the optical system substantially encloses the one or more light-emitting elements on the substrate. The optical system is adapted to extract the light from the one or more light-emitting elements.

13. 发明公开

EP1839463A1 INTEGRATED MODULAR LIGHTING UNIT 审中-公开
标题翻译：集成模块BELEUCHTUNGSEINHEIT
公开(公告)号：EP1839463A1
公开(公告)日：2007-10-03
申请号：EP05810860.6
申请日：2005-11-29
申请人： Tir Systems Ltd.
发明人： ASHDOWN, Ian , JUNGWIRTH, Paul , ROBINSON, Shane, P. , SCHICK, Philippe , SPEIER, Ingo , YORK, Allan, Brent
IPC分类号： H05B33/00 , H05B37/02 , H05B33/12 , F21S2/00
CPC分类号： F21V29/51 , F21S6/00 , F21S6/007 , F21V9/08 , F21V23/0457 , F21V29/004 , F21V29/54 , F21V29/717 , F21V29/763 , F21Y2115/10 , H05B33/0869
摘要： The present invention provides an integrated self-contained lighting module which can be used on its own, or in conjunction with other modules to produce white light, or light of any other colour within the colour spectrum. Each module comprises one or more light-emitting elements, a drive and control system, a feedback system, thermal management system, optical system, and optionally a communication system enabling communication between modules and/or other control systems. Depending on the configuration, the lighting module can operatc autonomously or its functionality can be determined based on either or both internal signals and externally received signals.
摘要翻译：本发明提供了一种集成的独立照明模块，其可以单独使用或与其他模块结合使用以产生白光，或者在色谱范围内的任何其他颜色的光。每个模块包括一个或多个发光元件，驱动和控制系统，反馈系统，热管理系统，光学系统和可选地实现模块和/或其他控制系统之间的通信的通信系统。根据配置，照明模块可以自主操作，或者可以基于内部信号和外部接收信号中的一个或两个来确定其功能。

14. 发明公开

EP1872401A1 ELECTRONIC DEVICE PACKAGE WITH AN INTEGRATED EVAPORATOR 有权转让
标题翻译： ELEKTRONISCHE BAUELEMENTEKAPSELUNG麻醉药整体蒸发器
公开(公告)号：EP1872401A1
公开(公告)日：2008-01-02
申请号：EP06721749.7
申请日：2006-04-04
申请人： Tir Systems Ltd.
发明人： SCHICK, Philippe
IPC分类号： H01L23/46 , H01L23/02
CPC分类号： F21V29/51 , F21V29/54 , F21V29/83 , F28D15/0275 , F28D15/04 , H01L23/3675 , H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H05K1/0203 , H05K1/0209 , H05K2201/10106 , H01L2924/00
摘要： The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
摘要翻译：本发明提供一种可以使用标准封装制造技术制造的电子器件封装，同时向可附接的热管理系统提供期望的热传递能力水平。根据本发明的电子器件封装包括专门设计成与热管理系统（例如热管）的蒸发器部分连接的壳体。一个或多个电子装置与热管理系统的蒸发器部分热接触地安装。在使用标准技术完成封装的制造之后，电子器件封装的蒸发器部分与热管理系统的次级部分可操作地耦合。以这种方式，可以制造电子器件封装以并入期望的热管理系统，同时使用标准封装制造工艺和机械制造。

15. 发明申请

WO2012000114A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 审中-公开
标题翻译：带有焊接基板的电子设备
公开(公告)号：WO2012000114A1
公开(公告)日：2012-01-05
申请号：PCT/CA2011/050399
申请日：2011-06-29
申请人： COOLEDGE LIGHTNING INC. , TISCHLER, Michael , SCHICK, Philippe , ASHDOWN, Ian , SHEEN, Calvin Wade , JUNGWIRTH, Paul
发明人： TISCHLER, Michael , SCHICK, Philippe , ASHDOWN, Ian , SHEEN, Calvin Wade , JUNGWIRTH, Paul
IPC分类号： H01L29/02 , H01L23/488 , H01L29/40
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译：根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

16. 发明申请

WO2015023540A1 LIGHT-EMITTING ELEMENT REPAIR IN ARRAY-BASED LIGHTING DEVICES 审中-公开
标题翻译：基于阵列照明设备的发光元件修复
公开(公告)号：WO2015023540A1
公开(公告)日：2015-02-19
申请号：PCT/US2014/050376
申请日：2014-08-08
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael, A. , PINNINGTON, Thomas , SCHICK, Philippe , JUNGWIRTH, Paul
发明人： TISCHLER, Michael, A. , PINNINGTON, Thomas , SCHICK, Philippe , JUNGWIRTH, Paul
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/62 , H01L2924/0002 , H05B33/0893 , H05B37/036 , H05B37/04 , H05K1/0268 , H05K1/0269 , H05K1/0386 , H05K1/141 , H05K1/147 , H05K3/225 , H05K3/288 , H05K3/305 , H05K2201/049 , H05K2201/09045 , H05K2201/09063 , H05K2201/09918 , H05K2201/10106 , H05K2201/10113 , H05K2201/10303 , H05K2201/10386 , H05K2201/10757 , H05K2201/10795 , H05K2201/10871 , H05K2201/10878 , H05K2201/2054 , H05K2203/1545 , H05K2203/162 , H05K2203/166 , H05K2203/175 , H05K2203/176 , H01L2924/00
摘要： A method for repairing a lighting system comprises identifying a fault location; disposing over or under the substrate at the fault location a patch comprising (i) a patch substrate, (ii) two conductive traces disposed on the patch substrate, and (iii) a replacement light-emitting element electrically coupled to the two conductive traces of the patch; and electrically connecting the replacement light-emitting element across the fault location by electrically connecting each of the conductive traces of the patch to one of the conductive traces defining the fault location.
摘要翻译：修理照明系统的方法包括识别故障位置; 在所述故障位置处布置在所述基底之上或之下的贴片，所述贴片包括（i）贴片衬底，（ii）布置在所述贴片衬底上的两个导电迹线，以及（iii）替代发光元件，电耦合到所述两个导电迹线补丁; 以及通过将所述贴片的每个所述导电迹线电连接到限定所述故障位置的导电迹线之一来将所述替代发光元件电连接在所述故障位置上。

17. 发明申请

WO2012024792A1 FAILURE MITIGATION IN ARRAYS OF LIGHT-EMITTING DEVICES 审中-公开
标题翻译：发光装置阵列失效减速
公开(公告)号：WO2012024792A1
公开(公告)日：2012-03-01
申请号：PCT/CA2011/050436
申请日：2011-07-14
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin Wade , JUNGWIRTH, Paul
发明人： TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin Wade , JUNGWIRTH, Paul
IPC分类号： H05B37/00 , F21K99/00 , F21S2/00 , H05B37/04
CPC分类号： H05B37/04 , H01L25/0753 , H01L2924/0002 , H05B33/0803 , H05B33/0821 , H05K1/0292 , H05K2201/10106 , H05K2201/10363 , H05K2203/173 , H01L2924/00
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译：根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。

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