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11. 发明授权

US07068515B2 Multi-chip module with stacked redundant power 失效
标题翻译：具有堆叠冗余电源的多芯片模块
公开(公告)号：US07068515B2
公开(公告)日：2006-06-27
申请号：US10996478
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
IPC分类号： H05K7/20
CPC分类号： H05K7/1092 , Y10T307/505
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.
摘要翻译：实施例包括具有堆叠冗余电力的多芯片模块的装置，方法和系统。示例性装置具有具有多个处理器的模块。第一电力系统以垂直堆叠的配置耦合到模块以向模块提供电力。第二电力系统向模块提供电力并且以垂直堆叠的配置耦合到第一电力系统。每个电力系统作为一个副本，用于防止一个电力系统故障时模块的故障。散热装置设置在第一和第二电力系统和第一电力系统和模块之间，使得散热装置通过热交换而散热，远离处理器，第一电力系统和第二电力系统。

12. 发明申请

US20130120941A1 MODULAR EQUIPMENT RACK SYSTEM FOR DATA CENTER 有权
标题翻译：数据中心的模块化设备机架系统
公开(公告)号：US20130120941A1
公开(公告)日：2013-05-16
申请号：US13296266
申请日：2011-11-15
申请人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
发明人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
IPC分类号： H05K7/14 , B23P23/00
CPC分类号： H05K7/14 , H05K7/1492 , Y10T29/49716
摘要： Various technologies described herein pertain to racking equipment in a data center. A modular equipment rack system can include an upper track, a lower track, a vertical support, a power and network distribution unit, and a tray. The upper track and the lower track can respectively include incrementally spaced mounting locations at which the vertical support and the power and network distribution unit can be attachable. The tray can be attachable to the vertical support and the power and network distribution unit when the vertical support is attached to the upper track at a first upper mounting location and attached to the lower track at a corresponding first lower mounting location, and the power and network distribution unit is attached to the upper track at a second upper mounting location and attached to the lower track at a corresponding second lower mounting location.
摘要翻译：本文描述的各种技术涉及数据中心中的设备。模块化设备机架系统可以包括上轨道，下轨道，垂直支撑件，电力和网络分配单元以及托盘。上轨道和下轨道可以分别包括递增间隔的安装位置，垂直支撑和电力和网络分配单元可以在该位置附接。当垂直支撑件在第一上部安装位置处附接到上部轨道并且在相应的第一下部安装位置处附接到下部轨道时，托盘可以附接到垂直支撑件和电力和网络分配单元，并且电源和网络分配单元在第二上部安装位置处附接到上部轨道并且在相应的第二下部安装位置处附接到下部轨道。

13. 发明申请

US20120098343A1 CHASSIS SLOTS ACCEPTING BATTERY MODULES AND OTHER MODULE TYPES 有权
标题翻译：接收电池模块和其他模块类型的底座
公开(公告)号：US20120098343A1
公开(公告)日：2012-04-26
申请号：US12912696
申请日：2010-10-26
申请人： Shaun L. Harris , Christian L. Belady , Eric C. Peterson
发明人： Shaun L. Harris , Christian L. Belady , Eric C. Peterson
IPC分类号： H02J9/00 , H02J7/34 , H05K7/00 , G06F1/16
CPC分类号： H02J9/061 , G06F1/183 , G06F1/187 , G06F1/30 , H02J7/34 , H05K7/1492 , Y10T307/505 , Y10T307/527 , Y10T307/625
摘要： A chassis includes a component interconnect board having multiple multi-function slots coupled thereto. Each of the multi-function slots is configured to accept different types of modules, including a battery module and one or more other types of modules, such as server modules or storage modules. The component interconnect board also includes a power bus coupled to receive external power and route the external power to the multiple multi-function slots.
摘要翻译：机箱包括具有与其相连的多个多功能插槽的部件互连板。每个多功能插槽都配置为接受不同类型的模块，包括电池模块和一个或多个其他类型的模块，如服务器模块或存储模块。组件互连板还包括耦合以接收外部电力并将外部电力路由到多个多功能插槽的电源总线。

14. 发明申请

US20110316338A1 Hierarchical Power Smoothing 有权
标题翻译：分层功率平滑
公开(公告)号：US20110316338A1
公开(公告)日：2011-12-29
申请号：US12822949
申请日：2010-06-24
申请人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Frank J. Wirtz
发明人： Eric C. Peterson , Shaun L. Harris , Christian L. Belady , Frank J. Wirtz
IPC分类号： H02J4/00
CPC分类号： G06F1/263 , G06F1/3206 , G06F1/3234 , H02J9/06 , Y10T307/305 , Y10T307/391 , Y10T307/615 , Y10T307/696
摘要： Power is provided to one or more devices in a system that includes a hierarchical power smoothing environment having multiple tiers. In response to a peak in power usage by the one or more devices, power is provided from a first power smoothing component in a first tier of the multiple tiers. Additionally, power is provided to the one or more devices from power smoothing components in each of other tiers of the multiple tiers if the power smoothing component in a next lower tier of the multiple tiers is unable to provide sufficient power for the peak in power usage. If the power smoothing components in the multiple tiers are unable to provide sufficient power for the peak in power usage, then performance of at least one of the one or more devices is reduced in response to the peak in power usage.
摘要翻译：电力被提供给系统中的一个或多个设备，该系统包括具有多个层的分层功率平滑环境。响应于一个或多个设备的电力使用的峰值，从多层的第一层中的第一功率平滑组件提供功率。此外，如果多层下一层较低层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则向多个设备中的功率平滑组件提供功率平滑组件给多个层的每个其他层中的功率平滑组件。如果多层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则响应于功率使用的峰值来降低一个或多个设备中的至少一个的性能。

15. 发明授权

US08952566B2 Chassis slots accepting battery modules and other module types 有权
标题翻译：机箱插槽接受电池模块和其他模块类型
公开(公告)号：US08952566B2
公开(公告)日：2015-02-10
申请号：US12912696
申请日：2010-10-26
申请人： Shaun L. Harris , Christian L. Belady , Eric C. Peterson
发明人： Shaun L. Harris , Christian L. Belady , Eric C. Peterson
IPC分类号： H02J7/00 , H02J9/06 , G06F1/18 , G06F1/30 , H02J7/34 , H05K7/14
CPC分类号： H02J9/061 , G06F1/183 , G06F1/187 , G06F1/30 , H02J7/34 , H05K7/1492 , Y10T307/505 , Y10T307/527 , Y10T307/625
摘要： A chassis includes a component interconnect board having multiple multi-function slots coupled thereto. Each of the multi-function slots is configured to accept different types of modules, including a battery module and one or more other types of modules, such as server modules or storage modules. The component interconnect board also includes a power bus coupled to receive external power and route the external power to the multiple multi-function slots.
摘要翻译：机箱包括具有与其相连的多个多功能插槽的部件互连板。每个多功能插槽都配置为接受不同类型的模块，包括电池模块和一个或多个其他类型的模块，如服务器模块或存储模块。组件互连板还包括耦合以接收外部电力并将外部电力路由到多个多功能插槽的电源总线。

16. 发明授权

US07791889B2 Redundant power beneath circuit board 有权
标题翻译：电路板下方冗余电源
公开(公告)号：US07791889B2
公开(公告)日：2010-09-07
申请号：US11059189
申请日：2005-02-16
申请人： Christian L. Belady , Eric C. Peterson , Shaun L. Harris , Steven A. Belson , Gary W. Williams
发明人： Christian L. Belady , Eric C. Peterson , Shaun L. Harris , Steven A. Belson , Gary W. Williams
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H05K1/0203 , H05K1/0262 , H05K1/0263 , H05K2201/0979 , H05K2201/10545 , H05K2201/10689 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.
摘要翻译：一个实施例包括具有第一印刷电路板（PCB）和第二PCB的电子组件。第二PCB具有至少两个处理器，并且耦合到并布置在第一PCB的第一侧上。散热装置将散热物从处理器中散出。第一和第二功率模块耦合到第一PCB的第二侧并且布置在第一PCB的第二侧上，第一和第二功率模块为第二PCB上的两个处理器提供冗余电力。

17. 发明授权

US07280365B2 Multi-processor module with redundant power 有权
标题翻译：具冗余电源的多处理器模块
公开(公告)号：US07280365B2
公开(公告)日：2007-10-09
申请号：US11061156
申请日：2005-02-18
申请人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Steven A. Belson , Shaun L. Harris , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , H05K1/0203 , H05K1/0263 , H05K2201/066 , H05K2201/0979 , H05K2201/10189
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
摘要翻译：一个实施例包括具有第一印刷电路板（PCB）和具有至少两个处理器的第二PCB的电子组件。第二PCB耦合到并设置在第一PCB上方。散热装置将散热物从处理器中散出。第一和第二电源模块向第二PCB提供电源，并且是分离的和冗余的电源，使得在第一电源模块故障时，第二电源模块可为两个电源模块向第二个PCB提供电力。

18. 发明授权

US07096926B2 Thermal pouch interface 有权
公开(公告)号：US07096926B2
公开(公告)日：2006-08-29
申请号：US10831059
申请日：2004-04-22
申请人： Christian L Belady , Eric C. Peterson , Brent A Boudreaux , Shaun L. Harris , Roy M. Zeighami
发明人： Christian L Belady , Eric C. Peterson , Brent A Boudreaux , Shaun L. Harris , Roy M. Zeighami
IPC分类号： F28F7/00
CPC分类号： F28F23/00 , H01L23/433 , H01L2924/0002 , H01L2924/3011 , H05K3/0058 , H01L2924/00
摘要： A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

19. 发明授权

US07064955B2 Redundant power for processor circuit board 失效
公开(公告)号：US07064955B2
公开(公告)日：2006-06-20
申请号：US10996477
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/184 , G06F1/185 , G06F1/20 , G06F1/263 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K2201/0979 , H05K2201/10189 , H05K2201/1056 , Y10T307/505 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the processor, and provides an airflow path. First and second power systems are coupled to the second PCB and in a pathway of the airflow path. The first and second power systems are redundant such that upon failure of the first power system, the second power system can provide power for both power systems.

20. 发明授权

US08582302B2 Modular equipment rack system for data center 有权
公开(公告)号：US08582302B2
公开(公告)日：2013-11-12
申请号：US13296266
申请日：2011-11-15
申请人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
发明人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
IPC分类号： H05K7/14
CPC分类号： H05K7/14 , H05K7/1492 , Y10T29/49716
摘要： Various technologies described herein pertain to racking equipment in a data center. A modular equipment rack system can include an upper track, a lower track, a vertical support, a power and network distribution unit, and a tray. The upper track and the lower track can respectively include incrementally spaced mounting locations at which the vertical support and the power and network distribution unit can be attachable. The tray can be attachable to the vertical support and the power and network distribution unit when the vertical support is attached to the upper track at a first upper mounting location and attached to the lower track at a corresponding first lower mounting location, and the power and network distribution unit is attached to the upper track at a second upper mounting location and attached to the lower track at a corresponding second lower mounting location.

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